JPS63251417A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS63251417A JPS63251417A JP8391987A JP8391987A JPS63251417A JP S63251417 A JPS63251417 A JP S63251417A JP 8391987 A JP8391987 A JP 8391987A JP 8391987 A JP8391987 A JP 8391987A JP S63251417 A JPS63251417 A JP S63251417A
- Authority
- JP
- Japan
- Prior art keywords
- bismaleimide
- heat
- resin composition
- present
- acid anhydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011342 resin composition Substances 0.000 title claims description 14
- 229920006015 heat resistant resin Polymers 0.000 title claims description 11
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 150000001875 compounds Chemical class 0.000 claims abstract description 16
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000004593 Epoxy Substances 0.000 claims abstract description 15
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229920003192 poly(bis maleimide) Polymers 0.000 claims abstract description 14
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 10
- 150000001412 amines Chemical class 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 18
- 238000002156 mixing Methods 0.000 abstract description 6
- CSHJJWDAZSZQBT-UHFFFAOYSA-N 7a-methyl-4,5-dihydro-3ah-2-benzofuran-1,3-dione Chemical compound C1=CCCC2C(=O)OC(=O)C21C CSHJJWDAZSZQBT-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003086 colorant Substances 0.000 abstract description 2
- 239000000945 filler Substances 0.000 abstract description 2
- 239000003063 flame retardant Substances 0.000 abstract description 2
- 238000005470 impregnation Methods 0.000 abstract description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract 1
- 125000002723 alicyclic group Chemical group 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000001879 gelation Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- FTFULVSESZARHS-UHFFFAOYSA-N 1-[2-chloro-4-[[3-chloro-4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(N2C(C=CC2=O)=O)C(Cl)=CC=1CC(C=C1Cl)=CC=C1N1C(=O)C=CC1=O FTFULVSESZARHS-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- PYVHLZLQVWXBDZ-UHFFFAOYSA-N 1-[6-(2,5-dioxopyrrol-1-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCCCCCN1C(=O)C=CC1=O PYVHLZLQVWXBDZ-UHFFFAOYSA-N 0.000 description 1
- AERZMMNNWVZSNB-UHFFFAOYSA-N 3-dodec-1-ynyloxolane-2,5-dione Chemical compound CCCCCCCCCCC#CC1CC(=O)OC1=O AERZMMNNWVZSNB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、電気機器の含浸等に用いられるもので、低粘
度、安定性に優れた、可使時間め長い耐熱性樹脂組成物
に関する。[Detailed description of the invention] [Object of the invention] (Industrial application field) The present invention is used for impregnating electrical equipment, etc., and has low viscosity, excellent stability, and heat resistance with a long pot life. The present invention relates to a resin composition.
（従来の技術）
従来、Ｈ種クラスの耐熱性の含浸材料として、ジアミノ
ジフェニルメタンから合成されるビスマレイミド−エポ
キシ化合物−酸無水物系の樹脂組成物が使用されている
。(Prior Art) Conventionally, a bismaleimide-epoxy compound-acid anhydride resin composition synthesized from diaminodiphenylmethane has been used as a heat-resistant impregnating material of class H class.
しかし、この従来含浸材料は、室温で比較的粘度が高い
ため、含浸する際には加熱して粘度を下げて使用しなけ
ればならず、取扱い上大変不便で作業性が悪いという欠
点がある。 また、含浸を行うたびに加熱を繰り返すた
めに次第に増粘し、硬化物の特性が大変不安定なものと
なる。 更に、増粘が進行して全く使用できなくなる時
間、いわゆる可使時間が大変短く、経済的に損失が大き
いという欠点がある。However, since this conventional impregnated material has a relatively high viscosity at room temperature, it must be heated to lower the viscosity before use, which is very inconvenient to handle and has poor workability. Moreover, since heating is repeated each time impregnation is performed, the viscosity gradually increases, and the properties of the cured product become extremely unstable. Furthermore, there is a drawback that the time period during which viscosity increases and becomes completely unusable, the so-called pot life, is very short, resulting in large economic losses.
（発明が解決しようとする問題点）
本発明は、上記の欠点を解消するためになされたもので
、低粘度で安定性に優れた、可使時間の長く耐熱性を低
下させることなく、トータルコストを低下した耐熱性樹
脂組成物を提供しようとするものである。(Problems to be Solved by the Invention) The present invention was made in order to eliminate the above-mentioned drawbacks. The present invention aims to provide a heat-resistant resin composition with reduced cost.
［発明の構成］
（問題点を解決するための手段と作用）本発明者は、上
記の目的を達成しようと鋭意研究を重ねた結果、エポキ
シ化合物として、ビスフェノールＦ型、環状脂肪族型の
エポキシ樹脂を使用すれば、低粘度、安定性に優れた、
可使時間の長い樹脂組成物が得られることを見いだし、
本発明を完成したものである。[Structure of the Invention] (Means and Effects for Solving the Problems) As a result of intensive research to achieve the above object, the present inventor has discovered bisphenol F type and cycloaliphatic type epoxy compounds as epoxy compounds. If resin is used, it has low viscosity and excellent stability.
It was discovered that a resin composition with a long pot life can be obtained,
This completes the present invention.
すなわち、本発明は、
（Ａ）ビスフェノールＦ型及び環状脂肪族型の群から選
択される液状のエポキシ化合物、（Ｂ）ビスマレイミド
、（Ｃ）液状酸無水物並びに（Ｄ）潜在性アミン系硬化
促進剤を必須成分とする耐熱性樹脂組成物である。That is, the present invention provides (A) a liquid epoxy compound selected from the group of bisphenol F type and cycloaliphatic type, (B) bismaleimide, (C) liquid acid anhydride, and (D) latent amine curing. It is a heat-resistant resin composition containing an accelerator as an essential component.
本発明に用いる（Ａ）ｉ状のエポキシ化合物としては、
ビスフェノールＦとエピクロルヒドリンを反応さぜなビ
スフェノールＦ型および環状脂肪族型のエポキシ化合物
の中から室温で液状のものが７１択され、これらは１種
又は２種以」二混合して使用する。The (A) i-type epoxy compound used in the present invention is as follows:
Among bisphenol F-type and cycloaliphatic-type epoxy compounds that react with bisphenol F and epichlorohydrin, 71 compounds are selected that are liquid at room temperature, and these are used singly or in a mixture of two or more.
本発明に用いる（Ｂ）ビスマレイミドは次の一般式で示
される。Bismaleimide (B) used in the present invention is represented by the following general formula.
（但し、式中Ｒ１は水素原子又はアルキル基を、Ｒ２は
などの芳香族２価の基を表す）
具体的な化合物として、例えばＮ、Ｎ′−エチレンビス
マレイミド、Ｎ、Ｎ′−ヘキサメチレンビスマレイミド
、Ｎ、Ｎ′−ｍ−フェニレンビスマレイミド、Ｎ、Ｎ′
−ｐ−フェニレンビスマレイミド、Ｎ、 Ｎ′−４，４
′−ジフェニルメタンビスマレイミド、Ｎ、 Ｎ′−４
，４’−ジフェニルエーテルビスマレイミド、Ｎ、Ｎ′
−メチレンビス（３−クロロ−ｐ−フェニレン）ビスマ
レイミド、Ｎ、 Ｎ’ −４，４’−ジフェニルスルフ
ォンビスマレイミド、Ｎ。(However, in the formula, R1 represents a hydrogen atom or an alkyl group, and R2 represents an aromatic divalent group such as.) Specific compounds include, for example, N,N'-ethylene bismaleimide, N,N'-hexamethylene Bismaleimide, N, N'-m-phenylene bismaleimide, N, N'
-p-phenylene bismaleimide, N, N'-4,4
'-diphenylmethane bismaleimide, N, N'-4
, 4'-diphenyl ether bismaleimide, N, N'
-methylenebis(3-chloro-p-phenylene)bismaleimide, N, N'-4,4'-diphenylsulfonebismaleimide, N.
Ｎ′−４，４’−ジシクロヘキシルメタンビスマレイミ
ド、Ｎ、Ｎ’−α 、α’−４，４’−ジメチレンシク
ロヘキサンビスマレイミド、Ｎ、 Ｎ’ −ｒｎ−キシ
レンビスマレイミド、Ｎ、 Ｎ’−４，４’−ジフェニ
ルシクロヘキサンビスマレイミド等が挙げられ、これら
は単独又は２種以上混合して使用する。N'-4,4'-dicyclohexylmethane bismaleimide, N, N'-α, α'-4,4'-dimethylenecyclohexane bismaleimide, N, N'-rn-xylene bismaleimide, N, N'- Examples include 4,4'-diphenylcyclohexane bismaleimide, which may be used alone or in combination of two or more.
ビスマレイミドの配合割合は、全体の組成物に対して１
０〜４０重量％配合することが望ましい。 配合量が１
０重量％未満では耐熱性に効果なく、また４０重量％を
超えると反応が進行し粘度が増加して好ましくない。The blending ratio of bismaleimide is 1 to the entire composition.
It is desirable to blend 0 to 40% by weight. The blending amount is 1
If it is less than 0% by weight, there is no effect on heat resistance, and if it exceeds 40% by weight, the reaction will proceed and the viscosity will increase, which is not preferable.
本発明に用いる（Ｃ）液状の酸無水物としては、常温で
液状の酸無水物が選択される。 具体的な化合物として
は、例えばモノメチルナ１〜ラヒドロ無水フタル酸、モ
ノメチルへキザヒドロ無水フタル酸、ドデシニル無水コ
ハク酸等が挙げられ、これらは単独又は２種以上混合し
て使用する。 液状の酸無水物の配合量はエポキシ樹脂
を含めた全体の組成物に対して６０〜９０重景％である
ことが望ましい。 配合量が６０重量％未満では低粘度
に効果なく、また９０重量％を超えると耐熱性に効果な
く好ましくない。As the liquid acid anhydride (C) used in the present invention, an acid anhydride that is liquid at room temperature is selected. Specific compounds include, for example, monomethylna-1-lahydrophthalic anhydride, monomethylhexahydrophthalic anhydride, dodecynylsuccinic anhydride, and the like, which may be used alone or in combination of two or more. The content of the liquid acid anhydride is preferably 60 to 90% by weight based on the entire composition including the epoxy resin. If the amount is less than 60% by weight, it will not be effective in lowering viscosity, and if it exceeds 90% by weight, it will not be effective in improving heat resistance, which is not preferred.
本発明に用いる（Ｄ＞潜在性アミン系硬化促進剤として
は、ＨＸ−３７４１（旭化成社製硬化促進剤、商品名）
等が挙げられる。 この硬化促進剤は、４０〜６０℃に
おける粘度」１昇に関係なくゲル化時間を大幅に短縮さ
せることができる。 硬化促進剤の配合割合は、ビスマ
レイミドと液状酸無水物との合ｄ１に対して０．０５〜
３重量％配合することが望ましい。 配合量が０．０５
重量％未満ではゲル化時間の短縮に効果なく、また、３
重量％を超えると安定性か悪く好ましくない。The latent amine curing accelerator used in the present invention (D> HX-3741 (curing accelerator manufactured by Asahi Kasei Co., Ltd., trade name)
etc. This curing accelerator can significantly shorten the gelation time regardless of the 1 increase in viscosity at 40 to 60°C. The blending ratio of the curing accelerator is from 0.05 to d1 of the bismaleimide and liquid acid anhydride.
It is desirable to add 3% by weight. The blending amount is 0.05
If it is less than 3% by weight, it will not be effective in shortening the gelation time;
If it exceeds % by weight, stability is poor and undesirable.
本発明の耐熱性樹脂組成物は、液状エポキシ化合物、ビ
スマレイミド、液状の酸無水物及び潜在性アミン系硬化
促進剤を含有するものであるが、本発明の目的に反しな
い限度において他の成分、例えば着色剤、難燃剤、充填
剤、その他の成分を添加配合することができる。 製造
にはこれらの各成分を混合して容易に耐熱性樹脂組成物
とすることができ、電気機器の含浸等に使用される。The heat-resistant resin composition of the present invention contains a liquid epoxy compound, bismaleimide, a liquid acid anhydride, and a latent amine curing accelerator, but may contain other components as long as it does not contradict the purpose of the present invention. For example, colorants, flame retardants, fillers, and other components can be added and blended. For production, these components can be easily mixed to form a heat-resistant resin composition, which is used for impregnating electrical equipment and the like.
＝ ６−
本発明の耐熱性樹脂組成物は通常Ａ液、Ｂ液に２分して
おき、使用する直前に均一に混合して使用する。 即ち
、Ａ液にはエポキシ化合物中にビスマレイミドを均一に
混合させておき、またＢ液には硬化剤の酸無水物中に硬
化促進剤を加えて均一に混合させておく。= 6- The heat-resistant resin composition of the present invention is usually divided into two parts, A liquid and B liquid, and mixed uniformly immediately before use. That is, in liquid A, bismaleimide is uniformly mixed in an epoxy compound, and in liquid B, a curing accelerator is added to an acid anhydride as a curing agent and mixed uniformly.
本発明においてＨ種クラスの耐熱性を保持し、低粘度を
実現させる方法として■マレイミド（イミド含有量）を
減少させる方法や、■エポキシ化合物を低粘度の反応希
釈剤でその一部を置換する方法等が考えられたが、■の
方法では耐熱性が低下し好ましくなく、また■の方法に
おいても耐熱性が低下する方向のため、エポキシ化合物
を検討した結果、ビスフェノールＦ型又は環状脂肪族が
有効であることを見いだしたものである。In the present invention, methods for maintaining class H class heat resistance and achieving low viscosity include: (1) reducing maleimide (imide content); and (2) replacing a portion of the epoxy compound with a low-viscosity reactive diluent. Several methods were considered, but method (2) is unfavorable due to a decrease in heat resistance, and method (2) is also likely to result in a decrease in heat resistance.As a result of examining epoxy compounds, it was found that bisphenol F type or cycloaliphatic This has been found to be effective.
（実施例）
次に本発明を実施例によって具体的に説明するか、本発
明はこれらの実施例によって限定されるものではない。(Examples) Next, the present invention will be specifically explained by examples, but the present invention is not limited by these examples.
以下の実施例および比較例において「部」とは「重量
部」を意味する。In the following examples and comparative examples, "parts" means "parts by weight."
実施例 Ｉ
Ｎ、Ｎ’−メチレンビス（Ｎ−フェニルモノマレイミド
）３０部、およびビスフェノールＦ型エポキシ樹脂（エ
ポキシ当量１７０） ７０部を容器に入れ、１４０℃に
加熱して６０分間撹拌して均一に混合してＡ液を得た。Example I 30 parts of N,N'-methylenebis(N-phenyl monomaleimide) and 70 parts of bisphenol F type epoxy resin (epoxy equivalent: 170) were placed in a container, heated to 140°C, and stirred for 60 minutes to uniformly dissolve the mixture. A liquid A was obtained by mixing.
このＡ液にモノメチルテトラヒドロ無水フタル酸６０
部、およびＨＸ−３７４１（旭化成社製硬化促進剤、商
品名） ０．２５部を加えてよく撹拌して均一に混合
し、茶褐色の耐熱性樹脂組成物を製造した。 この組成
物の４０℃における粘度、および１５０°Ｃにおけるゲ
ル化時間、またこの組成物を使用して作成した注型板（
１８０°Ｃ２１５時間で硬化）の絶縁抵抗、ゲル化時間
、加熱減量、および安定性について試験しなので、その
結果を第１表に示した。 本発明の組成物はバランスの
とれた特性を有しており、本発明の効果が確認された。Add 60% of monomethyltetrahydrophthalic anhydride to this A solution.
1, and 0.25 parts of HX-3741 (curing accelerator manufactured by Asahi Kasei Co., Ltd., trade name) were added and stirred well to mix uniformly to produce a brown heat-resistant resin composition. The viscosity of this composition at 40°C and the gelation time at 150°C, as well as the casting plate made using this composition (
The results are shown in Table 1. The results are shown in Table 1. The composition of the present invention had well-balanced characteristics, and the effects of the present invention were confirmed.
実施例 ２〜３
第１表に示した組成によって実施例１と同様に操作処理
して耐熱性樹脂組成物を製造した。 この組成物につい
て実施例１と同様にして試験を行い結果を得たので第１
表に示したが、本発明の組成物はバランスのとれた特性
を有しており、本発明の効果が確認された。Examples 2 to 3 Heat-resistant resin compositions were manufactured using the compositions shown in Table 1 and performing the same operations as in Example 1. This composition was tested in the same manner as in Example 1, and the results were obtained.
As shown in the table, the composition of the present invention had well-balanced characteristics, confirming the effects of the present invention.
比較例
第１表に示した組成によって実施例１と同様にして耐熱
性樹脂組成物を製造した。 この組成物について実施例
１と同様にして試験を行ったので、その結果を第１表に
示しな。Comparative Example A heat-resistant resin composition was produced in the same manner as in Example 1 using the composition shown in Table 1. This composition was tested in the same manner as in Example 1, and the results are shown in Table 1.
［発明の効果］
以上の説明および第１表から明らかなように、本発明の
耐熱性樹脂組成物は、エポキシ化合物を特定し、また特
定の潜在性アミン系硬化促進剤を用いることによって、
低粘度、安定性に優れた、可使時間の長い、トータルロ
ス１−低減に役立つ組成物となるので、電気機器等の含
浸、絶縁に好適なものである。[Effects of the Invention] As is clear from the above explanation and Table 1, the heat-resistant resin composition of the present invention can be produced by specifying the epoxy compound and using a specific latent amine curing accelerator.
The composition has low viscosity, excellent stability, long pot life, and is useful for reducing total loss 1, so it is suitable for impregnating and insulating electrical equipment.
Claims (1)
選択される液状のエポキシ化合物、（Ｂ）ビスマレイミ
ド、（Ｃ）液状酸無水物並びに（Ｄ）潜在性アミン系硬
化促進剤を必須成分とする耐熱性樹脂組成物。1 (A) A liquid epoxy compound selected from the group of bisphenol F type and cycloaliphatic type, (B) bismaleimide, (C) liquid acid anhydride, and (D) a latent amine hardening accelerator as essential components. A heat-resistant resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8391987A JPS63251417A (en) | 1987-04-07 | 1987-04-07 | Heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8391987A JPS63251417A (en) | 1987-04-07 | 1987-04-07 | Heat-resistant resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63251417A true JPS63251417A (en) | 1988-10-18 |
Family
ID=13816008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8391987A Pending JPS63251417A (en) | 1987-04-07 | 1987-04-07 | Heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63251417A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02127416A (en) * | 1988-11-04 | 1990-05-16 | Toshiba Chem Corp | Heat-resistant resin composition and production thereof |
| US8372922B2 (en) | 2006-09-12 | 2013-02-12 | Somar Corporation | One component epoxy resin composition and motor or dynamo using the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5316099A (en) * | 1976-07-28 | 1978-02-14 | Mitsubishi Electric Corp | Heat-resistant resin composition |
| JPS5556118A (en) * | 1978-10-20 | 1980-04-24 | Mitsubishi Electric Corp | Curing of epoxy resin |
| JPS55165915A (en) * | 1979-06-11 | 1980-12-24 | Hitachi Ltd | Thermosetting resin composition |
-
1987
- 1987-04-07 JP JP8391987A patent/JPS63251417A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5316099A (en) * | 1976-07-28 | 1978-02-14 | Mitsubishi Electric Corp | Heat-resistant resin composition |
| JPS5556118A (en) * | 1978-10-20 | 1980-04-24 | Mitsubishi Electric Corp | Curing of epoxy resin |
| JPS55165915A (en) * | 1979-06-11 | 1980-12-24 | Hitachi Ltd | Thermosetting resin composition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02127416A (en) * | 1988-11-04 | 1990-05-16 | Toshiba Chem Corp | Heat-resistant resin composition and production thereof |
| US8372922B2 (en) | 2006-09-12 | 2013-02-12 | Somar Corporation | One component epoxy resin composition and motor or dynamo using the same |
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