JPH0925394A - Heat-resistant thremosetting resin composition - Google Patents
Heat-resistant thremosetting resin compositionInfo
- Publication number
- JPH0925394A JPH0925394A JP19701395A JP19701395A JPH0925394A JP H0925394 A JPH0925394 A JP H0925394A JP 19701395 A JP19701395 A JP 19701395A JP 19701395 A JP19701395 A JP 19701395A JP H0925394 A JPH0925394 A JP H0925394A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- heat
- bismaleimide
- component
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電気機器の絶縁材料、
特に回転機、変圧器等の含浸、注型用に最適であり、耐
熱性、貯蔵安定性に優れた一液性の耐熱性熱硬化性樹脂
組成物に関する。The present invention relates to an insulating material for electric equipment,
In particular, the present invention relates to a one-component heat-resistant thermosetting resin composition that is most suitable for impregnation and casting of rotating machines, transformers, etc. and has excellent heat resistance and storage stability.
【0002】[0002]
【従来の技術】近年、電気機器の小型化、軽量化のニー
ズが高まり、それにつれて、電気機器の使用温度も上が
る傾向にあり、それに伴って回転機、変圧器等に使用さ
れる含浸、注型用の絶縁材料に対しても耐熱性が要求さ
れるようになってきている。従来から、耐熱性を有する
電気機器絶縁の含浸、注型用の絶縁材料としては、エポ
キシ樹脂と酸無水物硬化剤とからなる系に代表される樹
脂組成物が最適であり、広く用いられている。2. Description of the Related Art In recent years, there has been an increasing need for miniaturization and weight reduction of electric equipment, and the operating temperature of the electric equipment tends to rise accordingly, so that impregnation and injection of electric equipment used in rotating machines, transformers, etc. Heat resistance is also required for the mold insulating material. BACKGROUND ART Conventionally, as an insulating material for impregnation and casting of electric equipment insulation having heat resistance, a resin composition represented by a system composed of an epoxy resin and an acid anhydride curing agent is optimal and widely used. There is.
【0003】しかしながら、この樹脂組成物は、一般に
耐熱クラスF種が限界であり、H種クラス以上の耐熱性
を要求される電気機器に使用することは困難である。そ
こで、エポキシ樹脂と酸無水物硬化剤およびビスマレイ
ミド系化合物を配合し、耐熱性を向上した樹脂組成物が
提案されている。ここで用いられるビスマレイミド化合
物としてもっとも汎用的に用いられている化合物にN,N'
−(4,4'−ジフェニルメタン)ビスマレイミドが挙げら
れる。However, this resin composition is generally limited to the heat-resistant class F class, and it is difficult to use it in electric equipment which requires heat resistance higher than the H-class class. Therefore, there has been proposed a resin composition in which an epoxy resin, an acid anhydride curing agent and a bismaleimide compound are blended to improve heat resistance. N, N 'is the most widely used compound as the bismaleimide compound used here.
-(4,4'-diphenylmethane) bismaleimide may be mentioned.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、これら
の樹脂組成物の耐熱性を向上させるためには、N,N'−
(4,4'−ジフェニルメタン)ビスマレイミドの配合量を
多くしなければならないにもかかわらず、N,N'−(4,4'
−ジフェニルメタン)ビスマレイミドは、エポキシ樹脂
等に対する溶解性が、乏しいため、配合量を増やすと、
組成物の保存安定性が極めて乏しくなり、保存中、ある
いは作業中にN,N'−(4,4'−ジフェニルメタン)ビスマ
レイミドの結晶が析出し使用不可能になるという重大な
問題が発生する。However, in order to improve the heat resistance of these resin compositions, N, N'-
Despite the need to increase the amount of (4,4'-diphenylmethane) bismaleimide compounded, N, N '-(4,4'
-Diphenylmethane) bismaleimide has poor solubility in epoxy resins and the like, so if the compounding amount is increased,
The storage stability of the composition becomes extremely poor, and a serious problem occurs that crystals of N, N '-(4,4'-diphenylmethane) bismaleimide precipitate during storage or during work, making it unusable. .
【0005】また、結晶析出を防止する目的で、エポキ
シ樹脂中にN,N'−(4,4'−ジフェニルメタン)ビスマレ
イミドを加熱溶解させ、比較的高温度のもとでマレイミ
ドの一部を重合反応させて使用するという手段も提案さ
れているが、重合反応に比較的長い時間を要すると同時
に、反応のコントロールが困難であるために、コストの
上昇を招きやすい。さらに、このような方法では得られ
る樹脂組成物の粘度の上昇が避けられず、含浸、注型等
の低粘度が要求される用途に使用するためには、高温で
の作業が必要となるためポットライフが問題になりやす
い。従って、これらの樹脂組成物では、N,N'−(4,4'−
ジフェニルメタン)ビスマレイミドの配合量を少なく
し、ある程度耐熱性を犠牲にしても、保存安定性の良好
な樹脂組成物を得て使用しているのが現状である。Further, in order to prevent crystal precipitation, N, N '-(4,4'-diphenylmethane) bismaleimide is dissolved by heating in an epoxy resin, and a part of the maleimide is dissolved at a relatively high temperature. Although a means of using after a polymerization reaction has been proposed, the polymerization reaction requires a relatively long time and, at the same time, it is difficult to control the reaction, so that the cost tends to increase. Further, in such a method, an increase in the viscosity of the obtained resin composition is unavoidable, and it is necessary to work at a high temperature in order to use it for applications requiring low viscosity such as impregnation and casting. Pot life tends to be a problem. Therefore, in these resin compositions, N, N '-(4,4'-
The present situation is to obtain and use a resin composition having good storage stability even if the heat resistance is sacrificed to some extent by reducing the compounding amount of diphenylmethane) bismaleimide.
【0006】[0006]
【課題を解決するための手段】本発明は、上記の諸問題
を解決するためになされ、回転機、変圧器等の電気絶縁
用として好適な耐熱性、保存安定性にすぐれた一液性の
樹脂組成物を提供しようとするものであり、後述に詳し
く述べるように、2種類のビスマレイミド化合物を最適
に組み合わせることによってビスマレイミド成分の析出
を抑制し、かつ耐熱性に優れた一液性の耐熱性熱硬化性
樹脂組成物が得られることを見いだし、本発明を完成さ
せるに至ったものである。The present invention has been made to solve the above-mentioned problems, and is a one-liquid type excellent in heat resistance and storage stability suitable for electrical insulation of rotating machines, transformers and the like. It is intended to provide a resin composition, and as described in detail below, by optimally combining two kinds of bismaleimide compounds, the precipitation of the bismaleimide component is suppressed, and the one-liquid type excellent in heat resistance is provided. The inventors have found that a heat-resistant thermosetting resin composition can be obtained, and completed the present invention.
【0007】すなわち、本発明は、 (A)N,N'−(4,4'−ジフェニルメタン)ビスマレイミ
ド (B)2,2'−ビス[4 −(4 −マレイミドフェノキシ)
フェニル]プロパン (C)常温で液状のエポキシ樹脂 (D)常温で液状の酸無水物 (E)有機過酸化物重合開始剤 (F)潜在性硬化促進剤 の(A)〜(B)を必須成分として成ることを特徴とす
る耐熱性熱硬化性樹脂組成物である。That is, the present invention provides: (A) N, N '-(4,4'-diphenylmethane) bismaleimide (B) 2,2'-bis [4- (4-maleimidophenoxy)
Phenyl] propane (C) Epoxy resin that is liquid at room temperature (D) Acid anhydride that is liquid at room temperature (E) Organic peroxide polymerization initiator (F) Latent curing accelerator (A) to (B) are essential It is a heat-resistant thermosetting resin composition characterized by comprising as a component.
【0008】本発明に用いる成分(A)はN,N'−(4,4'
−ジフェニルメタン)ビスマレイミドであり、化1で示
され、また、成分(B)は2,2'−ビス[4 −(4 −マレ
イミドフェノキシ)フェニル]プロパンであり、一般
式、化2で示される。The component (A) used in the present invention is N, N '-(4,4'
-Diphenylmethane) bismaleimide, which is represented by Chemical Formula 1, and component (B) is 2,2'-bis [4- (4-maleimidophenoxy) phenyl] propane, which is represented by the general formula: Chemical Formula 2 .
【0009】[0009]
【化1】 Embedded image
【化2】 Embedded image
【0010】これら、耐熱性を発揮する成分(A)と成
分(B)において〔(A)+(B)〕の総量は、全体の
樹脂組成物に対して20〜40重量%となるように配合する
ことが望ましい。配合量が20重量%以下では、望ましい
耐熱性は得られず、また40重量%以上ではビスマレイミ
ド成分の析出、粘度の上昇、硬化物の脆さ等が生じ、含
浸、注型用の用途としては実用性に乏しくなる。In these components (A) and (B) exhibiting heat resistance, the total amount of [(A) + (B)] should be 20 to 40% by weight based on the total resin composition. It is desirable to mix them. If the blending amount is 20% by weight or less, the desired heat resistance cannot be obtained, and if it is 40% by weight or more, precipitation of the bismaleimide component, increase in viscosity, brittleness of the cured product, etc. occur, and it is used for impregnation and casting. Becomes less practical.
【0011】一方、成分(A)N,N'−(4,4'−ジフェニ
ルメタン)ビスマレイミドと成分(B)2,2'−ビス[4
−(4 −マレイミドフェノキシ)フェニル]プロパンの
間の配合割合は[(A)/〔(A)+(B)〕]の割合
が30〜70%になるような配合比を選ぶことが望ましい。
この割合が30%以下では、低粘度化を達成するのが難し
くなる。また(A)成分の割合が70%以上では、保存中
に成分(A)の析出が生じ、保存安定性が著しく悪くな
る。On the other hand, the component (A) N, N '-(4,4'-diphenylmethane) bismaleimide and the component (B) 2,2'-bis [4
It is desirable to select a compounding ratio between-(4-maleimidophenoxy) phenyl] propane such that the ratio of [(A) / [(A) + (B)]] is 30 to 70%.
If this ratio is 30% or less, it becomes difficult to achieve low viscosity. On the other hand, when the proportion of the component (A) is 70% or more, the component (A) is precipitated during storage and storage stability is significantly deteriorated.
【0012】また、本発明に用いられる成分(C)は、
1分子中に2個以上のエポキシ基を含む常温で液状のエ
ポキシ樹脂であれば、特に制限することもなく使用する
ことができるが、低粘度化および、耐熱性を維持できる
樹脂が望ましい。具体的には、ビスフェノールA型エポ
キシ樹脂、ビスフェノールF型エポキシ樹脂、脂環式エ
ポキシ樹脂等が挙げられる。これらの樹脂は、単独ある
いは、2種以上混合して使用することができる。The component (C) used in the present invention is
Any epoxy resin which is liquid at room temperature and which contains two or more epoxy groups in one molecule can be used without particular limitation, but a resin that can lower the viscosity and maintain heat resistance is desirable. Specific examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin and the like. These resins may be used alone or in combination of two or more.
【0013】次に本発明において用いる成分(D)の常
温で液状の酸無水物とは、メチルテトラヒドロフタル酸
無水物、メチルヘキサヒドロフタル酸無水物、無水メチ
ルハイミック酸等が挙げられ、これらは単独又は、2種
以上を混合して用いる。Examples of the component (D) acid anhydride which is liquid at room temperature used in the present invention include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride and methylhymic acid anhydride. Are used alone or in combination of two or more.
【0014】これら、酸無水物の配合割合は、成分
(C)のエポキシ樹脂のエポキシ基1当量あたり、 0.7
〜 1.2当量配合することが望ましい。この範囲をこえた
配合では、エポキシ基と、酸無水物基の反応が十分に行
われず、硬化物の物性に悪影響を及ぼす。The mixing ratio of these acid anhydrides is 0.7 per equivalent of the epoxy group of the component (C) epoxy resin.
It is desirable to mix up to 1.2 equivalents. If the content exceeds this range, the reaction between the epoxy group and the acid anhydride group is not sufficiently carried out, which adversely affects the physical properties of the cured product.
【0015】また、成分(E)の有機過酸化物重合開始
剤は、樹脂組成物の硬化反応性を改善する目的で微量添
加されるもので、具体的には、メチルイソブチルケトン
パーオキサイド、ラウロイルパーオキサイド、ベンゾイ
ルパーオキサイド、ターシャリーブチルパーオキサイ
ド、ジクミルパーオキサイドなどが上げられるが、作業
温度にて分解しない化合物を選ぶ必要がある。これら有
機過酸化物重合開始剤は、成分〔(A)+(B)〕の総
量に対して0.01〜2重量%の範囲で配合する。The organic peroxide polymerization initiator of component (E) is added in a trace amount for the purpose of improving the curing reactivity of the resin composition, and specifically, methyl isobutyl ketone peroxide, lauroyl. Although peroxide, benzoyl peroxide, tertiary butyl peroxide, dicumyl peroxide, etc. can be mentioned, it is necessary to select a compound that does not decompose at the working temperature. These organic peroxide polymerization initiators are added in an amount of 0.01 to 2% by weight based on the total amount of the components [(A) + (B)].
【0016】また、成分(F)の潜在性硬化促進剤と
は、具体的にはアミンアダクト型の化合物、イミダゾー
ル化合物の微粉末をマイクロカプセル化した化合物、ア
セチルアセトンクロム、アセチルアセトン亜鉛、アセチ
ルアセトンコバルト等のアセチルアセトン金属塩、等が
用いられる。これら潜在性硬化促進剤は、成分〔(A)
+(B)+(C)〕の総量に対して0.01〜10重量%の範
囲で配合する。The latent curing accelerator of the component (F) is specifically an amine adduct type compound, a compound obtained by encapsulating fine powder of an imidazole compound, acetylacetone chromium, acetylacetone zinc, acetylacetone cobalt or the like. Acetylacetone metal salt or the like is used. These latent curing accelerators are components [(A)
+ (B) + (C)] in the range of 0.01 to 10% by weight.
【0017】本発明の、樹脂組成物は、上記各成分を混
合して得ることができるが、具体的には成分(C)の常
温で液状のエポキシ樹脂を120 〜160 ℃に加熱し、成分
(A)および成分(B)を添加しながら攪拌溶解させ、
70℃に冷却させた後に(D)の常温で液状の酸無水物、
成分(E)の有機過酸化物重合開始剤、成分(F)の潜
在性硬化促進剤を添加して容易に目的とする樹脂組成物
を得ることができる。The resin composition of the present invention can be obtained by mixing the above components. Specifically, the component (C), which is a liquid epoxy resin at room temperature, is heated to 120 to 160 ° C. (A) and component (B) are added while stirring to dissolve,
After cooling to 70 ° C, (D) a liquid acid anhydride at room temperature,
The desired resin composition can be easily obtained by adding the component (E) organic peroxide polymerization initiator and the component (F) latent curing accelerator.
【0018】また、得られた樹脂組成物に、本来の目的
を損なわない範囲において充填剤,難燃剤、強化繊維等
を配合して、複合材料とすることも可能である。It is also possible to add a filler, a flame retardant, a reinforcing fiber and the like to the obtained resin composition within a range that does not impair the original purpose, to obtain a composite material.
【0019】こうして本発明によって得られた樹脂組成
物は、150 〜250 ℃の温度で、1〜24時間加熱すれば、
容易に耐熱性に優れた硬化物が得られる。The resin composition thus obtained according to the present invention is heated at a temperature of 150 to 250 ° C. for 1 to 24 hours,
A cured product having excellent heat resistance can be easily obtained.
【0020】[0020]
【作用】本発明の一液性耐熱性熱硬化性樹脂組成物は、
析出しやすいN,N'−(4,4'−ジフェニルメタン)ビスマ
レイミドと、比較的溶解性に富んだ2,2'−ビス[4−(4
−マレイミドフェノキシ)フェニル]プロパンの両化合
物を用いることにより、保存安定性、および作業性に優
れかつ硬化物の耐熱性のある安定した一液性耐熱性熱硬
化性樹脂組成物を得る。The one-component heat-resistant thermosetting resin composition of the present invention is
N, N '-(4,4'-diphenylmethane) bismaleimide, which is easy to precipitate, and 2,2'-bis [4- (4
By using both compounds of -maleimidophenoxy) phenyl] propane, a stable one-component heat-resistant thermosetting resin composition having excellent storage stability and workability and having heat resistance of the cured product is obtained.
【0021】[0021]
【実施例】次に、本発明を実施例によって説明するが、
本発明はこれら実施例によって限定されるものではな
い。Next, the present invention will be described with reference to examples.
The present invention is not limited by these examples.
【0022】実施例1 ビスフェノールF型エポキシ樹脂 60重量部をフラスコ
に入れて 130℃に加熱し、N,N'−(4,4'−ジフェニルメ
タン)ビスマレイミド 20重量部と2,2'−ビス[4 −
(4 −マレイミドフェノキシ)フェニル]プロパン 20
重量部を徐々に添加して同温度で20分加熱し、均一な液
状とした後、70℃に冷却してメチルテトラヒドロフタル
酸無水物53重量部、ジクミルパーオキサイド 0.3重量
部、HX3741(潜在性硬化促進剤、旭化成社製) 0.2重
量部を添加し、茶褐色透明な一液性の耐熱性熱硬化性樹
脂組成物を得た。Example 1 60 parts by weight of a bisphenol F type epoxy resin was placed in a flask and heated to 130 ° C., and 20 parts by weight of N, N ′-(4,4′-diphenylmethane) bismaleimide and 2,2′-bis were added. [4-
(4-Maleimidophenoxy) phenyl] propane 20
After gradually adding 20 parts by weight of the mixture and heating at the same temperature for 20 minutes to form a uniform liquid, it was cooled to 70 ° C. and 53 parts by weight of methyl tetrahydrophthalic anhydride, 0.3 parts by weight of dicumyl peroxide, HX3741 (latent) 0.2 part by weight of a heat-curing accelerator, manufactured by Asahi Kasei Co., Ltd. was added to obtain a brown-colored transparent one-component heat-resistant thermosetting resin composition.
【0023】実施例2〜実施例3 表1に示した組成によって実施例1と同様にして均一な
一液性の耐熱性熱硬化性樹脂組成物を得た。Examples 2 to 3 In the same manner as in Example 1 except that the composition shown in Table 1 was used, uniform one-component heat-resistant thermosetting resin compositions were obtained.
【0024】比較例1 実施例1と同様に、ビスフェノールF型エポキシ樹脂
60重量部をフラスコに入れ 130℃に加熱し、N,N'−(4,
4'−ジフェニルメタン)ビスマレイミド40重量部を徐々
に添加して同温度で20分加熱し、均一な液状とした後、
70℃に冷却してメチルテトラヒドロフタル酸無水物53重
量部、ジクミルパーオキサイド 0.3重量部、 HX3741
(イミダゾール化合物をマイクロカプセル化した潜在性
硬化促進剤、旭化成社製) 0.2重量部を添加し、一液性
の耐熱性熱硬化性樹脂組成物を得ようとしたが、冷却の
途中でビスマレイミドが析出し、安定な耐熱性熱硬化性
樹脂組成物が得られなかった。Comparative Example 1 Similar to Example 1, bisphenol F type epoxy resin
Add 60 parts by weight to a flask and heat to 130 ° C, then add N, N '-(4,
4'-diphenylmethane) bismaleimide 40 parts by weight was gradually added and heated at the same temperature for 20 minutes to form a uniform liquid,
After cooling to 70 ° C, 53 parts by weight of methyl tetrahydrophthalic anhydride, 0.3 parts by weight of dicumyl peroxide, HX3741
(A latent curing accelerator microcapsulated with an imidazole compound, manufactured by Asahi Kasei Corporation) 0.2 part by weight was added to obtain a one-component heat-resistant thermosetting resin composition, but bismaleimide was obtained during cooling. Was deposited, and a stable heat-resistant thermosetting resin composition could not be obtained.
【0025】比較例2 ビスフェノールF型エポキシ樹脂 70重量部をフラスコ
に入れて 170℃に加熱し、N,N'−(4,4'−ジフェニルメ
タン)ビスマレイミド 30重量部を徐々に添加して同温
度で3時間加熱して、ビスマレイミドの一部を反応させ
て均一な液状とした後、70℃に冷却してメチルテトラヒ
ドロフタル酸無水物63重量部、ジクミルパーオキサイド
0.3重量部、HX3741 0.2重量部を添加し、一液性の耐
熱性熱硬化性樹脂組成物を得た。Comparative Example 2 70 parts by weight of a bisphenol F type epoxy resin was placed in a flask and heated to 170 ° C., and 30 parts by weight of N, N ′-(4,4′-diphenylmethane) bismaleimide was gradually added thereto. After heating at temperature for 3 hours, a part of bismaleimide is reacted to form a uniform liquid, then cooled to 70 ° C and 63 parts by weight of methyltetrahydrophthalic anhydride, dicumyl peroxide.
0.3 parts by weight and 0.2 parts by weight of HX3741 were added to obtain a one-component heat-resistant thermosetting resin composition.
【0026】以上の、実施例1〜3および比較例2で得
られた樹脂組成物において粘度、および保存安定性を測
定した。また、得られた樹脂組成物を 180℃で4時間さ
らに 200℃で8時間硬化させた硬化物について熱変形温
度、および加熱減量を測定し、それらの結果を表1に示
した。いずれも、優れた特性を示し本発明の効果を示す
ことができた。The viscosity and storage stability of the resin compositions obtained in Examples 1 to 3 and Comparative Example 2 were measured. Further, the heat distortion temperature and the heat loss of the cured product obtained by curing the obtained resin composition at 180 ° C. for 4 hours and further at 200 ° C. for 8 hours were measured, and the results are shown in Table 1. In each case, excellent characteristics were exhibited, and the effects of the present invention could be exhibited.
【0027】[0027]
【表1】 [Table 1]
【0028】[0028]
【発明の効果】以上の説明および表1から明らかなよう
に、本発明の樹脂組成物は、耐熱性、保存安定性、作業
性等に優れた一液性の耐熱性熱硬化性樹脂組成物が得ら
れ、H種クラスの回転機、変圧器等の含浸、注型用樹脂
組成物として好適である。As is clear from the above description and Table 1, the resin composition of the present invention is a one-component heat-resistant thermosetting resin composition excellent in heat resistance, storage stability, workability and the like. And is suitable as a resin composition for impregnating and casting a class H rotating machine and transformer.
Claims (1)
ン)ビスマレイミド (B)2,2'−ビス[4 −(4 −マレイミドフェノキシ)
フェニル]プロパン (C)常温で液状のエポキシ樹脂 (D)常温で液状の酸無水物硬化剤 (E)有機過酸化物重合開始剤 (F)潜在性硬化促進剤 を必須成分として成ることを特徴とする耐熱性熱硬化性
樹脂組成物。1. (A) N, N '-(4,4'-diphenylmethane) bismaleimide (B) 2,2'-bis [4- (4-maleimidophenoxy)
Phenyl] propane (C) Epoxy resin that is liquid at room temperature (D) Acid anhydride curing agent that is liquid at room temperature (E) Organic peroxide polymerization initiator (F) Latent curing accelerator And a heat-resistant thermosetting resin composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19701395A JPH0925394A (en) | 1995-07-10 | 1995-07-10 | Heat-resistant thremosetting resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19701395A JPH0925394A (en) | 1995-07-10 | 1995-07-10 | Heat-resistant thremosetting resin composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0925394A true JPH0925394A (en) | 1997-01-28 |
Family
ID=16367337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19701395A Pending JPH0925394A (en) | 1995-07-10 | 1995-07-10 | Heat-resistant thremosetting resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0925394A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7553890B2 (en) | 1997-03-31 | 2009-06-30 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US7629056B2 (en) | 1997-03-31 | 2009-12-08 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
-
1995
- 1995-07-10 JP JP19701395A patent/JPH0925394A/en active Pending
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7553890B2 (en) | 1997-03-31 | 2009-06-30 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US7604868B2 (en) | 1997-03-31 | 2009-10-20 | Hitachi Chemical Company, Ltd. | Electronic circuit including circuit-connecting material |
US7618713B2 (en) | 1997-03-31 | 2009-11-17 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US7629050B2 (en) * | 1997-03-31 | 2009-12-08 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US7629056B2 (en) | 1997-03-31 | 2009-12-08 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US7879956B2 (en) | 1997-03-31 | 2011-02-01 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US7968196B2 (en) | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US7967943B2 (en) | 1997-03-31 | 2011-06-28 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
US8142605B2 (en) | 1997-03-31 | 2012-03-27 | Hitachi Chemical Company, Ltd. | Circuit-connecting material and circuit terminal connected structure and connecting method |
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