JPS6325137Y2 - - Google Patents

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Publication number
JPS6325137Y2
JPS6325137Y2 JP15740882U JP15740882U JPS6325137Y2 JP S6325137 Y2 JPS6325137 Y2 JP S6325137Y2 JP 15740882 U JP15740882 U JP 15740882U JP 15740882 U JP15740882 U JP 15740882U JP S6325137 Y2 JPS6325137 Y2 JP S6325137Y2
Authority
JP
Japan
Prior art keywords
pin
plate
lower mold
ejection
ejector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15740882U
Other languages
Japanese (ja)
Other versions
JPS5961911U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15740882U priority Critical patent/JPS5961911U/en
Publication of JPS5961911U publication Critical patent/JPS5961911U/en
Application granted granted Critical
Publication of JPS6325137Y2 publication Critical patent/JPS6325137Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案は熱硬化性樹脂圧縮成形用金型における
成形品突出し機構に関する。
[Detailed Description of the Invention] The present invention relates to a molded product ejection mechanism in a mold for compression molding a thermosetting resin.

熱硬化性樹脂に圧縮成形法は、加熱された金型
のキヤビテイに成形材料を入れプレスにより加圧
することにより、材料を溶融させると共に硬化さ
せ、製品を成形するものである。成形後は金型の
上型と下型とを開き、突出し機構により成形品を
離型する。
In the compression molding method for thermosetting resins, a molding material is put into a heated mold cavity and pressurized by a press, thereby melting and hardening the material and molding the product. After molding, the upper and lower molds are opened and the ejector mechanism releases the molded product.

従来の突出し機構を図解説明するに、第1図は
金型の下型の平面図、第2図は第1図の−矢
視垂直断面図で上型を破線で示したもの、第3図
は突出し板の上板および突出しピンの一部を下か
ら視た分解斜視図である。第1図および第2図に
おいて、10は下型取付け板、12はスペーサブ
ロツク、14は下型母型、16は下型入子、18
はキヤビテイ、20はキヤビテイ・ブシユ、22
は上型母型、24は上型取付け板である。下型入
子16には例えばスチーム通路26のような加熱
手段が設けてあつて、下型入子を成形温度に加熱
し得るようになつている。下型入子16は下型母
型14の凹所に嵌合されている。下型入子16の
寸法は、冷却時には図示した様に母型の基準面
AAおよびBBのみに接触しているが、成形温度
まで加熱した時には熱膨脹して面CCおよびDDに
もピツクリと当接する様に設計されている。
To illustrate and explain the conventional ejection mechanism, Fig. 1 is a plan view of the lower die of the mold, Fig. 2 is a vertical sectional view taken along the - arrow in Fig. 1, with the upper die indicated by a broken line, and Fig. 3. is an exploded perspective view of the upper plate of the protrusion plate and part of the protrusion pin, viewed from below. 1 and 2, 10 is a lower mold mounting plate, 12 is a spacer block, 14 is a lower mold mother mold, 16 is a lower mold insert, 18
is Cavitei, 20 is Cavity Bushiyu, 22
2 is an upper mold mother mold, and 24 is an upper mold mounting plate. The lower mold insert 16 is provided with heating means, such as a steam passage 26, for heating the lower mold insert to the molding temperature. The lower mold insert 16 is fitted into the recess of the lower mold matrix 14. The dimensions of the lower mold insert 16 are determined by the reference surface of the mother mold as shown in the figure during cooling.
Although it only contacts AA and BB, it is designed so that when heated to the molding temperature, it will thermally expand and come into contact with surfaces CC and DD as well.

第2図に示した様に、下型取付け板10とスペ
ーサブロツク12と下型母型14とにより画定さ
れた空間内には互いに固着された上板28と下板
30から成る突出し板が配置されている。この突
出し板や複動ピストンシリンダの様な図示しない
並進運動機構に連結されていると共に、ガイドピ
ン32に摺動自在に嵌合したガイドピンブシユ3
4を備えており、ガイドピン32に案内されなが
ら上下動し得るようになつている。突出し板には
例えば3本の突出しピン36が装着されている。
夫々の突出しピン36の下端にはボス部38が一
体に形成されている。第2図および第3図から判
るように、夫々の突出しピンに対応して突出し板
の上板28には段付けボアから成る透孔40が設
けてあり、この透孔40内に突出しピン36を下
から挿入した後上板28と下板30とをボルト締
め等により互いに固着することにより突出しピン
の下端すなわちボス部が突出し板に係留される。
この時には、ボス部38は、透孔40の小径ボア
42と大径ボア44との間の水平な肩部46と、
下板30の上面との間に挾持される。
As shown in FIG. 2, a protruding plate consisting of an upper plate 28 and a lower plate 30 fixed to each other is arranged in the space defined by the lower die mounting plate 10, the spacer block 12, and the lower die matrix 14. has been done. A guide pin bush 3 is connected to a translation mechanism (not shown) such as this projecting plate and a double-acting piston cylinder, and is slidably fitted to the guide pin 32.
4, and can move up and down while being guided by a guide pin 32. For example, three protruding pins 36 are attached to the protruding plate.
A boss portion 38 is integrally formed at the lower end of each protruding pin 36. As can be seen from FIGS. 2 and 3, a through hole 40 consisting of a stepped bore is provided in the upper plate 28 of the ejector plate in correspondence with each ejector pin, and the ejector pin 36 is inserted into the through hole 40. After inserting the upper plate 28 and the lower plate 30 from below, the upper plate 28 and the lower plate 30 are fixed to each other by bolting or the like, so that the lower end of the ejecting pin, that is, the boss portion, is moored to the ejecting plate.
At this time, the boss portion 38 has a horizontal shoulder portion 46 between the small diameter bore 42 and the large diameter bore 44 of the through hole 40;
It is held between the upper surface of the lower plate 30 and the upper surface of the lower plate 30.

突出しピン36の上部は透孔40と同一軸線上
に整列して下型母型14および下型入子16に穿
設された透孔48および50に挿通されている。
透孔50の上端は縮径されており、この部分に突
出しピン36の上端が摺動可能に精密嵌合してあ
る。したがつて、突出し板が上下動する時には、
突出しピン36は透孔50の縮径部に上端近傍を
案内されながら下型入子16から出入りしてキヤ
ビテイ18内の成形品を突出す。突出しピン36
の上端面は下型入子の表面と整合しており、成形
品の下側表面の一部を画定する。したがつて、こ
の突出しピンがその軸線廻りに回転するのは好ま
しくない。そこで、第2図および第3図に示した
様に、突出しピン36のボス部38には半径方向
に回り止めピン52を打込み、この回り止めピン
52の自由端は透孔40の大径ボア44に隣接し
て突出し板上板28に設けた切欠き54内に係合
させることにより、突出しピン36の回転を防止
している。この従来の回り止め構造に於ては、回
り止めピン52の方向については特に配慮がなさ
れておらず、各回り止めピンは例えば第1図に矢
印で表した方位に配置されている。
The upper part of the ejecting pin 36 is aligned on the same axis as the through hole 40 and inserted into through holes 48 and 50 formed in the lower mold matrix 14 and the lower mold insert 16.
The upper end of the through hole 50 has a reduced diameter, and the upper end of the protruding pin 36 is slidably and precisely fitted into this part. Therefore, when the protruding plate moves up and down,
The ejecting pin 36 moves in and out of the lower mold insert 16 while being guided near the upper end by the reduced diameter portion of the through hole 50 to eject the molded product within the cavity 18 . Ejecting pin 36
The upper end surface is aligned with the surface of the lower mold insert and defines a portion of the lower surface of the molded article. Therefore, it is undesirable for this ejector pin to rotate about its axis. Therefore, as shown in FIGS. 2 and 3, a detent pin 52 is driven into the boss portion 38 of the ejecting pin 36 in the radial direction, and the free end of the detent pin 52 is connected to the large diameter bore of the through hole 40. Rotation of the ejector pin 36 is prevented by engaging it in a notch 54 provided in the ejector plate upper plate 28 adjacent to the ejector pin 44 . In this conventional anti-rotation structure, no particular consideration is given to the direction of the anti-rotation pins 52, and each anti-rotation pin is arranged, for example, in the direction indicated by the arrow in FIG.

しかして、前述した従来の突出し機構に於て
は、突出しピン36の上端近傍は下型入子16の
透孔50の縮径部に案内されているため下型入子
16の加熱時にその熱膨脹に伴い面CCおよび面
DD(第1図)に向つて変位するが、その下端す
なわちボス部38は熱影響の少ない突出し板に係
留されているため変位が少ない。その結果、突出
しピンの上端と下端が偏心し、突出しピンが変形
を起し、成形品突出し時に摺動不良を起すことが
あつた。
However, in the conventional ejecting mechanism described above, the vicinity of the upper end of the ejecting pin 36 is guided by the reduced diameter portion of the through hole 50 of the lower mold insert 16, so that when the lower mold insert 16 is heated, its thermal expansion occurs. According to plane CC and plane
Although it is displaced toward DD (FIG. 1), its lower end, that is, the boss portion 38, is moored to a protruding plate that is less affected by heat, so the displacement is small. As a result, the upper and lower ends of the ejector pin became eccentric, causing deformation of the ejector pin and causing sliding failure when ejecting the molded product.

本考案は従来技術の叙上の問題点に鑑み案出さ
れたもので、突出しピンの摺動不良を回避し得る
ような突出し機構を提供することを目的とするも
のである。
The present invention was devised in view of the above-mentioned problems of the prior art, and it is an object of the present invention to provide an ejection mechanism that can avoid sliding defects of the ejection pin.

このため、本考案は、前述の構造の突出し機構
において、前記突出しピンの下端は突出し板に平
行な平面に沿つて移動自在に突出し板に装着する
と共に、回り止めピンは金型の加熱および冷却時
の下型入子の熱膨脹および収縮に伴い突出しピン
上端が変位する方向に方位決めしたことを特徴と
するものである。このように構成すれば、下型入
子の膨脹収縮に追従して突出しピン下端を突出し
板内で滑動させ、下端の軸心を上端の軸心に常に
整列させることが可能となる。
Therefore, in the ejection mechanism of the above-described structure, the lower end of the ejection pin is attached to the ejection plate so as to be movable along a plane parallel to the ejection plate, and the detent pin is used for heating and cooling the mold. It is characterized in that the upper end of the protruding pin is oriented in the direction in which it is displaced as the lower die insert thermally expands and contracts. With this configuration, it is possible to slide the lower end of the ejector pin within the ejector plate following the expansion and contraction of the lower mold insert, and to always align the axis of the lower end with the axis of the upper end.

次に、第4図以下の図面を参照して本考案の実
施例を説明するが、第1図から第3図に示した構
成部材と共通のものは同一又は類似の参照番号で
示しかつ既にした説明は省略する。
Next, embodiments of the present invention will be described with reference to the drawings from FIG. 4 onwards. Components common to those shown in FIGS. The detailed explanation will be omitted.

第4図は第1図同様の平面図、第5図は第4図
の−矢視垂直断面図、第6図は第5図の破線
円内部分の拡大図である。第6図に示す様に、突
出し板の上板28には突出しピン36のボス部3
8に比して大きなサイズの透孔40′が設けてあ
り、ボス部38と透孔40′の肩部46′との間に
は環状のスライド板56が介装してある。スライ
ド板56の外周面と大径ボア44′の内周面との
間の距離は下型入子16の熱膨脹による最大変位
量よりも大きく定める。また、肩部46′と下板
30との間の距離はボス部38とスライド板56
との合計厚さより僅かに大きく定め、肩部46′
と下板30との間でボス部38およびスライド板
56が側方に滑動し得るようにする。
4 is a plan view similar to FIG. 1, FIG. 5 is a vertical sectional view taken along the - arrow in FIG. 4, and FIG. 6 is an enlarged view of the portion inside the broken line circle in FIG. As shown in FIG.
A through hole 40' having a larger size than the hole 40' is provided, and an annular slide plate 56 is interposed between the boss portion 38 and a shoulder portion 46' of the through hole 40'. The distance between the outer circumferential surface of the slide plate 56 and the inner circumferential surface of the large diameter bore 44' is set to be larger than the maximum displacement of the lower mold insert 16 due to thermal expansion. Further, the distance between the shoulder portion 46' and the lower plate 30 is the same as that between the boss portion 38 and the slide plate 56.
Shoulder portion 46'
The boss portion 38 and the slide plate 56 are allowed to slide laterally between the lower plate 30 and the lower plate 30.

回り止めピン52′はこの実施例ではスライド
板56に打込んであるが、従来例と同様にボス部
38に固定してもよい。夫々の回り止めピン5
2′の自由端は上板28の切欠き54′内に係合し
てある。夫々の切欠き54′は、第4図に矢印で
示した様に下型入子16の熱膨脹に伴い突出しピ
ン36の上端が変位する方向に方位決めされてい
る。従つてそれらの切欠き内に収容された回り止
めピンに対応する切欠きと同じ方向に延長してい
る。下型母型14の基準面BBに対する夫々の切
欠き54′の角度θは、基準面AAとBBとの交点
Oと各突出しピンとを結ぶ線が基準面BBに対し
て成す角度に等しい。
Although the detent pin 52' is driven into the slide plate 56 in this embodiment, it may be fixed to the boss portion 38 as in the conventional example. Each detent pin 5
The free end of 2' is engaged in a notch 54' in the top plate 28. Each notch 54' is oriented in the direction in which the upper end of the ejector pin 36 is displaced as the lower die insert 16 thermally expands, as indicated by the arrow in FIG. They therefore extend in the same direction as the corresponding cutouts for the detent pins housed within them. The angle θ of each notch 54' with respect to the reference plane BB of the lower mold matrix 14 is equal to the angle that a line connecting the intersection O of the reference planes AA and BB and each ejecting pin makes with the reference plane BB.

成形に当り下型入子を加熱した時には、下型入
子は第4図のO点を中心として熱膨脹し、夫々の
突出しピンの上端は第4図の矢印の方向に変位す
る。このため、突出しピンの下端には上端の変位
の方向に横方向偏寄力が作用し、スライド板56
およびボス部38を滑動させて突出しピンの上下
端を整列させる。各回り止めピン52′は突出し
ピンの上端の変位の方向に方位決めしてあるの
で、前記滑動を妨げることがない。
When the lower mold insert is heated during molding, the lower mold insert thermally expands around point O in FIG. 4, and the upper end of each ejector pin is displaced in the direction of the arrow in FIG. 4. Therefore, a lateral biasing force acts on the lower end of the protruding pin in the direction of displacement of the upper end, and the sliding plate 56
Then, slide the boss portion 38 to align the upper and lower ends of the ejector pins. Each detent pin 52' is oriented in the direction of displacement of the upper end of the ejector pin, so that said sliding movement is not impeded.

以上から明らかなように、本考案は突出しピン
の下端と突出し板に平行な平面に沿つて移動可能
に装着すると共に回り止めピンは金型の加熱およ
び冷却による突出しピン上端の変位の方向に方位
決めしたので、突出しピン上端の変位に追従して
下端を変位させることができ、常に突出しピンの
上下端の軸心を整列させることができる。従つ
て、金型加熱時に突出しピンを円滑に作動させる
ことができる。
As is clear from the above, in the present invention, the lower end of the ejector pin is movably mounted along a plane parallel to the ejector plate, and the detent pin is oriented in the direction of displacement of the upper end of the ejector pin due to heating and cooling of the mold. Since this is determined, the lower end can be displaced following the displacement of the upper end of the ejector pin, and the axes of the upper and lower ends of the ejector pin can always be aligned. Therefore, the ejector pin can be smoothly operated when the mold is heated.

【図面の簡単な説明】[Brief description of the drawings]

第1図は従来の突出し機構を備えた金型下型の
平面図、第2図は第1図の−矢視垂直断面
図、第3図は突出し板および突出しピンの一部を
下から視た分解斜視図、第4図は本考案の突出し
機構を備えた金型下型の平面図、第5図は第4図
の−矢視垂直断面図、第6図は第5図の円内
部分の拡大図である。 10……下型取付け板、12……スペーサブロ
ツク、14……下型母型、16……下型入子、1
8……キヤビテイ、20……キヤビテイブツユ、
22……上型母型、24……上型取付け板、26
……加熱手段、28,30……突出し板、28…
…突出し板の上板、30……突出し板の下板、3
2……ガイドピン、34……ガイドピンブシユ、
36……突出しピン、38……ボス部、40,4
0′……透孔、42,42′……小径ボア、44,
44′……大径ボア、46,46′……肩部、4
8,50……透孔、52,52′……回り止めピ
ン、54,54′……切欠き、56……スライド
板。
Fig. 1 is a plan view of a lower mold with a conventional ejection mechanism, Fig. 2 is a vertical sectional view taken in the direction of - arrow in Fig. 1, and Fig. 3 is a view of a part of the ejection plate and ejection pin from below. FIG. 4 is a plan view of the lower die equipped with the ejection mechanism of the present invention, FIG. It is an enlarged view of a part. 10...Lower die mounting plate, 12...Spacer block, 14...Lower die matrix, 16...Lower die insert, 1
8... Cavity, 20... Cavity butsuyu,
22...Upper mold mother mold, 24...Upper mold mounting plate, 26
... Heating means, 28, 30 ... Projection plate, 28...
... Upper plate of the protruding plate, 30... Lower plate of the protruding plate, 3
2...Guide pin, 34...Guide pin bushing,
36...Ejection pin, 38...Boss part, 40,4
0'...Through hole, 42, 42'...Small diameter bore, 44,
44'...Large diameter bore, 46, 46'...Shoulder, 4
8, 50... Through hole, 52, 52'... Rotating pin, 54, 54'... Notch, 56... Slide plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 下型入子を担持した下型母型と下型取付け板と
前記両者間に挾持されたスペーサブロツクとによ
り画定された空間内で上下動可能な突出し板と、
下端が前記突出し板に装着され上端近傍が下型入
子に摺動自在に支承された突出しピンと、突出し
ピンが突出し板に対して相対回転するのを阻止す
るための回り止めピン、とを包含して成る圧縮成
形用金型の突出し機構において、前記突出しピン
の下端は突出し板に平行な平面に沿つて移動自在
に突出し板に装着すると共に、前記回り止めピン
は金型の加熱および冷却時の下型入子の熱膨脹お
よび収縮に伴い突出しピン上端が変位する方向に
方位決めしたことを特徴とする圧縮成形用金型の
突出し機構。
a protruding plate that is movable up and down within a space defined by a lower mold matrix carrying a lower mold insert, a lower mold mounting plate, and a spacer block held between the two;
Includes an ejector pin whose lower end is attached to the ejector plate and whose upper end vicinity is slidably supported by the lower mold insert, and a detent pin for preventing relative rotation of the ejector pin with respect to the ejector plate. In the ejection mechanism for a compression molding mold, the lower end of the ejection pin is attached to the ejection plate so as to be movable along a plane parallel to the ejection plate, and the detent pin is attached to the ejection plate during heating and cooling of the mold. An ejecting mechanism for a compression molding mold, characterized in that the ejecting pin is oriented in a direction in which the upper end of the ejecting pin is displaced as the lower mold insert thermally expands and contracts.
JP15740882U 1982-10-20 1982-10-20 Ejection mechanism of compression molding mold Granted JPS5961911U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15740882U JPS5961911U (en) 1982-10-20 1982-10-20 Ejection mechanism of compression molding mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15740882U JPS5961911U (en) 1982-10-20 1982-10-20 Ejection mechanism of compression molding mold

Publications (2)

Publication Number Publication Date
JPS5961911U JPS5961911U (en) 1984-04-23
JPS6325137Y2 true JPS6325137Y2 (en) 1988-07-08

Family

ID=30347046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15740882U Granted JPS5961911U (en) 1982-10-20 1982-10-20 Ejection mechanism of compression molding mold

Country Status (1)

Country Link
JP (1) JPS5961911U (en)

Also Published As

Publication number Publication date
JPS5961911U (en) 1984-04-23

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