JPS6324838U - - Google Patents
Info
- Publication number
- JPS6324838U JPS6324838U JP1986118453U JP11845386U JPS6324838U JP S6324838 U JPS6324838 U JP S6324838U JP 1986118453 U JP1986118453 U JP 1986118453U JP 11845386 U JP11845386 U JP 11845386U JP S6324838 U JPS6324838 U JP S6324838U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- recess
- carrier
- mounting structure
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986118453U JPH0438522Y2 (en:Method) | 1986-08-01 | 1986-08-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986118453U JPH0438522Y2 (en:Method) | 1986-08-01 | 1986-08-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6324838U true JPS6324838U (en:Method) | 1988-02-18 |
| JPH0438522Y2 JPH0438522Y2 (en:Method) | 1992-09-09 |
Family
ID=31004918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986118453U Expired JPH0438522Y2 (en:Method) | 1986-08-01 | 1986-08-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0438522Y2 (en:Method) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994029887A1 (fr) * | 1993-06-14 | 1994-12-22 | Poripurasuchikkusu Co., Ltd. | Piece electrique moulee et sa fabrication |
| EP3542398A4 (en) * | 2016-11-21 | 2020-12-02 | 3M Innovative Properties Company | AUTOMATIC REGISTRATION BETWEEN CIRCUIT CHIPS AND INTERCONNECTIONS |
-
1986
- 1986-08-01 JP JP1986118453U patent/JPH0438522Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1994029887A1 (fr) * | 1993-06-14 | 1994-12-22 | Poripurasuchikkusu Co., Ltd. | Piece electrique moulee et sa fabrication |
| EP3542398A4 (en) * | 2016-11-21 | 2020-12-02 | 3M Innovative Properties Company | AUTOMATIC REGISTRATION BETWEEN CIRCUIT CHIPS AND INTERCONNECTIONS |
| US10971468B2 (en) | 2016-11-21 | 2021-04-06 | 3M Innovative Properties Company | Automatic registration between circuit dies and interconnects |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0438522Y2 (en:Method) | 1992-09-09 |