JPS63244639A - Semiconductor substrate - Google Patents

Abstract

PURPOSE:To obtain an element and a circuit for evaluation use of a large-area semiconductor substrate without reducing the number of semiconductor devices obtainable using one semiconductor substrate by a method wherein auxiliary semiconductor devices are formed at the four corners of a main semiconductor device. CONSTITUTION:Octagonal main semiconductor devices 1 as first semiconductor devices and diamond-shaped auxiliary semiconductor devices 3 as second semiconductor devices are arranged on a semiconductor substrate lengthwise and breadthwise at individually prescribed intervals, and are partitioned by individual scribing lines 2. Electrode pads 4 are situated at the inside of each main semiconductor device 1 and a actual circuit part 5 is formed at their inner part. On the other hand, pads 6 for evaluation use are arranged on each auxiliary semiconductor device 3; an element and a circuit for evaluation use of the semiconductor substrate are mounted. In this case, an area of the actual circuit part 5 is decided by a width of a region for a bonding connection to the electrode pads 4; accordingly, if a size of the auxiliary semiconductor device 3 is limited to almost the same as this width, the area of the actual circuit part 5 is not reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor substrate, and particularly to a plurality of types of semiconductor devices 1.
The present invention relates to a semiconductor substrate formed by forming.

[Conventional technology]

Conventionally, in this type of semiconductor substrate, one in which rectangular semiconductor devices are arranged at regular intervals in both the vertical and horizontal directions has been used.

FIG. 5 is a plan view of a portion of a conventional semiconductor substrate.

As shown in FIG. 5, rectangular semiconductor devices 11 are arranged on a semiconductor substrate at regular intervals, and each is separated by a dividing line (slide line) 12.

FIG. 6 is an enlarged view of the repeating pattern of the semiconductor device shown in FIG.

As shown in FIG. 6, the semiconductor device 11 has a scribe line 1
2 and formed around the electrode pad part 1
4 and an actual circuit section 15 surrounded by these pad sections 14. In such a semiconductor substrate, there are methods for arranging parts for evaluating the characteristics of the elements and circuits 11 formed on the semiconductor substrate in the same semiconductor device 11, and methods for arranging parts for evaluating the characteristics of the elements and circuits 11 formed on the semiconductor substrate, and methods for arranging parts for evaluating the characteristics of the elements and circuits 11 formed on the semiconductor substrate, and methods for arranging parts for evaluating the characteristics of the elements and circuits 11 formed on the semiconductor substrate. A method is used in which a part of the vertical and horizontal arrangement is replaced in the semiconductor device.

[Problem that the invention seeks to solve]

In the conventional semiconductor substrate described above, the semiconductor device has a rectangular structure, so the former installation method has the disadvantage that the size of one semiconductor device becomes large or the number of evaluation items that can be mounted is reduced. Furthermore, the latter installation method has the disadvantage that the number of semiconductor devices that can be formed on one semiconductor substrate is reduced.

An object of the present invention is to provide a semiconductor substrate without increasing the size of the semiconductor device, without reducing evaluation items, and without reducing the number of semiconductor devices that can be formed from one substrate. be.

[Means for solving problems]

The semiconductor substrate of the present invention includes first semiconductor devices arranged at regular intervals in the vertical and horizontal directions, a scribe line for dividing the first semiconductor devices, and a first semiconductor device at a point where the scribe lines intersect. and a second semiconductor device formed so as to straddle the semiconductor device.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of a portion of a semiconductor substrate for explaining a first embodiment of the present invention.

As shown in FIG. 1, on a semiconductor substrate, a hexagonal main semiconductor device 1, which is a first semiconductor device, and a rhombic sub-semiconductor device 3, which is a second semiconductor device, are arranged at regular intervals vertically and horizontally. and are separated by scribe lines 2.

Figure 2 shows the main semiconductor device and sub-semiconductor device shown in Figure 1.
It is an enlarged view of a repeating pattern.

As shown in FIG. 2, inside the present semiconductor device 1, there are electrode pads 4 at the periphery, and an actual circuit section 5 inside thereof.

On the other hand, an evaluation pad 6 is arranged on the sub-semiconductor device 3, and evaluation elements and circuits of the semiconductor substrate are mounted thereon.

Incidentally, since the area of the actual circuit portion 5 is determined by the width of the region for bonding connection to the electrode pad 4, the size of the sub-semiconductor device 3 may be limited to the same extent as this width. There is no reduction in the area of the actual circuit section 5 due to this installation.

Further, in this embodiment, since the corners of the semiconductor device 1 are obtuse angles, the problem of chipping or peeling of the corners after scribing is reduced.

FIG. 3 is a plan view of a portion of a semiconductor substrate for explaining a second embodiment of the present invention.

As shown in FIG. 3, the present semiconductor device 1 is placed on the semiconductor substrate.
A rectangular sub-semiconductor device 7 is arranged.

FIG. 4 is an enlarged view of the repeated pattern of the semiconductor device in FIG. 3.

As shown in FIG. 4, this embodiment is an example in which there are many electrode pads 4 compared to the first embodiment, and in such a case, it is better to make the sub-semiconductor device 7 rectangular in shape. Device 1
It has the advantage of being able to take up a large area.

〔Effect of the invention〕

As explained above, the present invention provides sub-semiconductor devices at the four corners of the present semiconductor device, thereby enabling the evaluation of elements and circuits on large-area semiconductor substrates without reducing the number of semiconductor devices that can be formed on the semiconductor substrate. It has the effect of obtaining the following parts. Furthermore, there is an effect that it is easy to assemble the sub-semiconductor device as a single unit and perform detailed evaluation.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a part of a semiconductor substrate for explaining a first embodiment of the present invention, FIG. 2 is an enlarged view of a repeating pattern of the semiconductor device shown in FIG. 1, and FIG. A plan view of a part of a semiconductor/conductor substrate for explaining a second embodiment of the invention, FIG. 4 is an enlarged view of a repeating pattern of the semiconductor device shown in FIG. 3, and FIG. 5 is a conventional semiconductor substrate. FIG. 6 is an enlarged view of the repeating pattern of the semiconductor device shown in FIG. 1... Semiconductor device, 2... Scribe line, 3.7
...Sub-semiconductor device, 4...Electrode pad, 5...Actual circuit section, 6...Evaluation pad. Susumu Uchihara, Patent Attorney, '-:,. Iwa 1, 3rd figure, cow 4 figure

Claims (1)

[Claims] first semiconductor devices arranged at regular intervals in the vertical and horizontal directions;
The method includes a scribe line for dividing the first semiconductor device, and a second semiconductor device formed to straddle the first semiconductor device at a location where the scribe lines intersect. semiconductor substrate.