JPS63242699A - Semiconductor-device card - Google Patents
Semiconductor-device cardInfo
- Publication number
- JPS63242699A JPS63242699A JP62079926A JP7992687A JPS63242699A JP S63242699 A JPS63242699 A JP S63242699A JP 62079926 A JP62079926 A JP 62079926A JP 7992687 A JP7992687 A JP 7992687A JP S63242699 A JPS63242699 A JP S63242699A
- Authority
- JP
- Japan
- Prior art keywords
- card
- semiconductor device
- connector
- package
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 11
- 238000003780 insertion Methods 0.000 claims description 11
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ゲームカードなどに用いられるＩＣカード
などの半導体装置カードに関し、特にコネクタへの挿入
を容易にした改良にかかわる。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device card such as an IC card used in a game card or the like, and particularly relates to an improvement that facilitates insertion into a connector.
例えば、テレビゲーム用ソフトを内蔵したゲームカード
やマイコン用メモリカードなどに用いられる、従来の半
導体装置カードは、第３図に示すようになっていた。図
において、１は半導体装置カードＣ以下「カード」と称
する）で、半導体装置を収納したパッケージ２０表面の
前部側に多数の電ａ端子Ｓが設けられている。For example, a conventional semiconductor device card used for a game card with built-in video game software, a memory card for a microcomputer, etc. is shown in FIG. In the figure, reference numeral 1 denotes a semiconductor device card C (hereinafter referred to as "card"), in which a large number of electrical terminals S are provided on the front side of the surface of a package 20 containing a semiconductor device.
第４図はカードｌを外部装置をなすカードリーダ（図示
は略すン側のコネクタに挿入する状態を示す。コネクタ
６は枠体（合成樹脂材など＆！！縁材からなる）７の挿
入穴フａの奥側に多数の電極接触片８が設けられである
。Fig. 4 shows a state in which a card l is inserted into a connector on the side of a card reader (not shown) which constitutes an external device.The connector 6 is an insertion hole in a frame body 7 (made of synthetic resin material etc. & edge material). A large number of electrode contact pieces 8 are provided on the back side of the fa.
カードユをコネクタ６の挿入穴７ａに挿入すると、バッ
ケー、ジ２の前端の上面角部２ａが各電極接触片８に当
り、これらを押し上げ前進挿入され、各電極端子３が対
応する各電極接触片８に接触し電気的接続される。When the card unit is inserted into the insertion hole 7a of the connector 6, the top corner 2a of the front end of the bag and the case 2 hits each electrode contact piece 8, pushing them up and being inserted forward, causing each electrode terminal 3 to correspond to the corresponding electrode contact piece. 8 and is electrically connected.
上記のような従来の半ｊＪ１体装置カードでは、カード
１をコネクタ６の挿入穴７ａに挿入すると、パッケージ
２の前端の上方角部２ａが′ｄＬ極接触片８に当り、挿
入しにくかったり、電極接触片８を損傷するという問題
点があった。In the conventional semi-JJ1 device card as described above, when the card 1 is inserted into the insertion hole 7a of the connector 6, the upper corner 2a of the front end of the package 2 hits the 'dL contact piece 8, making it difficult to insert the card. There was a problem in that the electrode contact piece 8 was damaged.
この発明は、このような問題点を解決するため、 にな
されたもので、カードがパッケージの挿入穴に円滑に挿
入され、電極接触片８を損傷することのない半導体装置
カードを得ることを目的としている。The present invention was made in order to solve these problems, and an object of the present invention is to obtain a semiconductor device card in which the card can be smoothly inserted into the insertion hole of the package without damaging the electrode contact piece 8. It is said that
この発明にかかる半導体装置カードは、パッケージの前
端の上部角部を面取りしたものである。In the semiconductor device card according to the present invention, the upper corner of the front end of the package is chamfered.
この発明においては、カードの前端の上部角部が面取り
してあり、コネクタに挿入すると電極接触片を損傷する
ことなく、円滑に挿入される。In this invention, the upper corner of the front end of the card is chamfered, so that when inserted into the connector, the card can be inserted smoothly without damaging the electrode contact pieces.
４１図はこの発明による半導体装置カードの一実施例を
示す。図において、カード１１の半導体装置を収納した
パッケージ１２は、異面の前部側に多数の電極端子３が
設けられ、前端の上部角部に面取ｆ） １２ａを施しで
ある。FIG. 41 shows an embodiment of a semiconductor device card according to the present invention. In the figure, a package 12 containing a semiconductor device of a card 11 is provided with a large number of electrode terminals 3 on the front side of a different surface, and has a chamfer f) 12a on the upper corner of the front end.
このカード１１＠第２図に示すように、コネクタ６の挿
入穴７ａに挿入すると、パッケージ１２の前端の面取り
１２ａにより、各電極接触片８を損傷することなく円滑
に押上げて挿入される。こうして、各電極端子３は各電
極接触片８に接触される。As shown in FIG. 2, when the card 11 is inserted into the insertion hole 7a of the connector 6, the chamfer 12a on the front end of the package 12 allows the card 11 to be smoothly pushed up and inserted without damaging the electrode contact pieces 8. In this way, each electrode terminal 3 is brought into contact with each electrode contact piece 8.
なお、パッケージ１２の前端の面取りは傾斜面の外、円
弧面であってもよい。また、との前端の面取りは、上部
だけでなく、下部、さらには両側部にも施してもよく、
一層円渭に挿入される。The front end of the package 12 may be chamfered not only as an inclined surface but also as a circular arc surface. In addition, the chamfering of the front end of and may be applied not only to the upper part but also to the lower part and even to both sides.
It is inserted further into the circle.
以上のように、この発明によれは、パッケージの前端の
上部に面取りを施したので、コネクタの挿入穴に電極接
触片を傷めることなく円滑に挿入される。As described above, according to the present invention, since the upper part of the front end of the package is chamfered, the electrode contact piece can be smoothly inserted into the insertion hole of the connector without damaging it.
第１図はこの発明による半導体装置カードの一実施例を
示す斜視図、第２図は第１図のカードをコネクタに挿入
している途中を示す側面断面図、第３図は従来の半導体
装置カードの斜視図、Ｒ４４図は４３図のカードをコネ
クタの挿入穴に挿入している途中を示す側面ｖＲｉｌｋ
Ｉ図である。
３・・・ｔｆｆｌ端子、６・・・コネクタ、マ・・・枠
体、フａ・・・挿入穴、８・・・’ｓｔｍ接触片、１１
・・・半導体装置カード、１２・・・パッケージ、１２
ａ・・・面Ｒ１り 。FIG. 1 is a perspective view showing an embodiment of a semiconductor device card according to the present invention, FIG. 2 is a side sectional view showing the card shown in FIG. 1 being inserted into a connector, and FIG. 3 is a conventional semiconductor device. A perspective view of the card, Figure R44 is a side view showing the card in Figure 43 being inserted into the insertion hole of the connector.
This is an I diagram. 3...tffl terminal, 6...connector, ma...frame body, fa...insertion hole, 8...'stm contact piece, 11
...Semiconductor device card, 12...Package, 12
a...Surface R1ri.
Claims (1)
数の電極端子が設けられ、カードリーダ側のコネクタの
挿入穴に挿入され、この挿入穴の奥側に配設されてある
多数の電極接触片に、上記各電極端子がそれぞれ接触さ
れるようにした半導体装置カードにおいて、上記パツケ
ージの前端の四辺部のうち、少なくとも上部に面取りを
施したことを特徴とする半導体装置カード。A large number of electrode terminals are provided on the front side of the surface of the package housing the semiconductor device, and are inserted into the insertion hole of the connector on the card reader side, and a large number of electrode contact pieces are arranged on the back side of this insertion hole. In the semiconductor device card in which each of the electrode terminals is brought into contact with each other, at least an upper portion of the four sides of the front end of the package is chamfered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62079926A JPS63242699A (en) | 1987-03-31 | 1987-03-31 | Semiconductor-device card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62079926A JPS63242699A (en) | 1987-03-31 | 1987-03-31 | Semiconductor-device card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63242699A true JPS63242699A (en) | 1988-10-07 |
Family
ID=13703913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62079926A Pending JPS63242699A (en) | 1987-03-31 | 1987-03-31 | Semiconductor-device card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63242699A (en) |
-
1987
- 1987-03-31 JP JP62079926A patent/JPS63242699A/en active Pending
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