JPS5851500U - Lead terminal bend detection device - Google Patents
Lead terminal bend detection deviceInfo
- Publication number
- JPS5851500U JPS5851500U JP14561781U JP14561781U JPS5851500U JP S5851500 U JPS5851500 U JP S5851500U JP 14561781 U JP14561781 U JP 14561781U JP 14561781 U JP14561781 U JP 14561781U JP S5851500 U JPS5851500 U JP S5851500U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- gap
- detection device
- recess
- bend detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- A Measuring Device Byusing Mechanical Method (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本案−実施例のＩＣとＩＣソケットの組立部材
の断面図、第２図は第１図のＩＣの裏面の斜視図、第３
図は本案向り検出装置の斜視図、第４図〜第８図は第３
図の装置の異なる状態の側面図で、第４図は第３図の状
態の側面図、第５図と第６図は組立部材に曲りがない場
合の検出装置の異なる状態を示す。第７図と第８図は組
立部材に曲りがある場合の検出装置の異なる状態を示す
。
１６はケース、１３はリード端子、１０は部品、１９は
凹部、１１は被挿入部材、２５は間隙、１５は挿入ピン
を示す。
第３図
第５図Fig. 1 is a sectional view of an assembly member of an IC and an IC socket according to the present invention and an embodiment, Fig. 2 is a perspective view of the back side of the IC shown in Fig. 1, and Fig. 3
The figure is a perspective view of the orientation detection device, and Figures 4 to 8 are the 3rd direction detection device.
4 is a side view of the device shown in the figure in different states, FIG. 4 is a side view of the state in FIG. 3, and FIGS. 5 and 6 show different states of the detection device when there is no bending in the assembly member. 7 and 8 show different states of the detection device when there is a bend in the assembled member. 16 is a case, 13 is a lead terminal, 10 is a component, 19 is a recess, 11 is a member to be inserted, 25 is a gap, and 15 is an insertion pin. Figure 3 Figure 5
Claims (1)
リード端子に対応し前記リード端子が挿入される凹部を
有するソケット等の被挿入部材とから成り、前記リード
端子が前記凹部に挿入された状態で前記凹部のリード端
子挿入側に前記リード端子と前記ケースと前記被挿入部
材との間に間隙が形成される組立部材に適用され、前記
リード端子が前記間隙内に曲っていることを検出する装
置において、 前記間隙に挿入可能であって、前記間隙に挿入される際
、前記間隙内に曲っている前記リード端子で前記挿入が
阻止されることにより前記リード端子の曲りを検出する
挿入ピンを具備することを特長とするリード端子面り検
出装置。[Scope of Claim for Utility Model Registration] A component consisting of a case in which a predetermined number of lead terminals are protruded, and a member to be inserted such as a socket having a recess corresponding to the lead terminal and into which the lead terminal is inserted; The present invention is applied to an assembly member in which a gap is formed between the lead terminal, the case, and the inserted member on the lead terminal insertion side of the recess when the lead terminal is inserted into the recess, and the lead terminal is inserted into the recess. In a device for detecting bending into a gap, the device is insertable into the gap, and when inserted into the gap, the lead terminal bent into the gap prevents the insertion. A lead terminal surface detection device characterized by having an insertion pin for detecting bending of a lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14561781U JPS5851500U (en) | 1981-09-30 | 1981-09-30 | Lead terminal bend detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14561781U JPS5851500U (en) | 1981-09-30 | 1981-09-30 | Lead terminal bend detection device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5851500U true JPS5851500U (en) | 1983-04-07 |
| JPS642480Y2 JPS642480Y2 (en) | 1989-01-20 |
Family
ID=29938545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14561781U Granted JPS5851500U (en) | 1981-09-30 | 1981-09-30 | Lead terminal bend detection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5851500U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567675A (en) * | 1978-11-17 | 1980-05-21 | Hitachi Ltd | Detector for presence of small sized electronic component |
| JPS55110094A (en) * | 1979-02-19 | 1980-08-25 | Fujitsu Ltd | Ic lead wire detecting mechanism |
-
1981
- 1981-09-30 JP JP14561781U patent/JPS5851500U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5567675A (en) * | 1978-11-17 | 1980-05-21 | Hitachi Ltd | Detector for presence of small sized electronic component |
| JPS55110094A (en) * | 1979-02-19 | 1980-08-25 | Fujitsu Ltd | Ic lead wire detecting mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS642480Y2 (en) | 1989-01-20 |
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