JPS63239961A - Inspecting apparatus - Google Patents

Abstract

PURPOSE:To align the positions of a probe card and an IC card with a monitor being observed and to measure the IC highly reliably, by providing a camera, which displays the position relationship between a semiconductor device and the probe card, a video signal processing circuit, and the monitor, which outputs the monitored image based on an image signal. CONSTITUTION:The probes of a probe card are electrically connected to a wafer state semiconductor device. The electrical characteristics of the semiconductor device are measured with an IC tester in an inspecting apparatus. In this apparatus, the following parts are provided: a camera 12, which displays the position relationship between the semiconductor device and the probe card; a video-signal processing circuit 13, which processes the image picked up with the camera; and a monitor 14, which outputs the monitored image based on the image signal that is processed in the video- signal processing circuit 13. For example, the camera 12 is provided at the lower part of a test station 3. Motors 15a and 15b are driven and controlled by the commands from a control part 16. The camera 12 is moved to a position directly over the IC over the wafer and the probe card with feed screws 21a and 21b. Light is projected from a light source 17, and the position relationship between the IC and the probe card is displayed on the camera 12.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor device testing device comprising an IC tester, a wafer roving device, etc. used in a wafer testing process.

[Conventional technology 1] Conventionally, this type of inspection equipment includes an IC tester that measures the electrical characteristics of a large number of semiconductor devices (hereinafter referred to as ICs) formed within a wafer, and an IC tester that measures a large number of ICs on a wafer. It consists of a wafer probing device (hereinafter referred to as a prober) that feeds the wafer intermittently. As shown in FIG. 3, the IC tester 1 in this type of testing equipment consists of a control unit 2, a test station 3, a console 4, etc. The test station 3 measures the electrical characteristics of the IC while preventing external noise. It also includes a pin electronics card and the like for accurately measuring high frequency characteristics, and is installed near the wafer 9.

On the other hand, the pro-buff consists of the control device 5, microscope 6, and stage 1.
It is composed of 0, etc.

A probe card 8 is connected between the ICl 3 and the test station 3, and the microscope 6 is used to confirm the position of the probe 8a of the probe card 8 and the electrode of the IC 1B. In this case, probe card 8 and IC1
Since the connection B is made at a position below the test station 3, it is necessary to provide a cavity 11 near the center of the test station 3 in which the microscope 6 for confirming the positions of both is installed.

[Problems to be Solved by the Invention] In the structure of the conventional inspection apparatus described above, the test station 3 has a cavity 11 near the center, so light enters the wafer 9 through the gap between the microscope 6 and the test station 3. Sometimes, the electrical properties of ICl3 cannot be measured accurately.

Furthermore, when viewing the ICl 3 or the probe of the probe card 8 using the microscope 6, the operator often looks into the lens of the microscope 6.

Since the height of workers varies, the height of the eyepiece of the microscope 6 is set to the average height of the workers, but those who are taller or shorter than the average height may bend their waist deeply or It is not a desirable work environment as many workers have to stretch their backs and complain of physical fatigue.

An object of the present invention is to provide an inspection device that solves the above-mentioned problems.

[Means for Solving the Problems] The present invention provides an inspection apparatus for electrically connecting a probe of a probe card to a semiconductor device in a wafer state and measuring the electrical characteristics of the semiconductor device using an IC tester. a camera that displays the positional relationship between the probe card and the probe card;
This inspection device includes a video signal processing circuit that processes images captured by the camera, and a monitor that outputs a monitor image based on the image signal processed by the video signal processing circuit.

[Example] Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1(a) is a front view showing a first embodiment of the present invention, and FIG. 1(b) is a bottom view thereof.

In FIGS. 1(a) and 1(b), a camera 12 is installed at the bottom of the test station 3 so as to be movable in two horizontal axes, and the camera 12 is connected to a motor 15a that drives in the Y direction via a feed screw 21a. The motor 15a is connected via a feed screw 12b to a motor 15b which performs feeding drive in the X direction. Further, illumination light sources 17, 17, . . . are installed around the camera 12.

Roughly speaking, there are a video signal processing circuit 13 that processes an image captured by the camera 12, a monitor 14 that outputs a monitor image based on the image signal processed by the video signal processing circuit 13, and motors 15a, 15b. A control section 16 that controls the driving of the light source 17 is provided.

In the embodiment, a command is issued from the control unit 16 to drive and control the motors 15a and 15b, and the feed screw 21a.

21b, the camera 12 is moved to a position directly above the ICl 3 on the wafer 9 and the probe card 8, and the light source 17 is used to illuminate the tcia on the wafer 9 and the probe card 8.
The camera 12 projects the positional relationship between the two. The image captured by the camera 12 is processed by the video signal processing circuit 13, and a monitor image is displayed on the monitor 14 based on the image signal.
7 and adjust the shading of the image on the monitor 14. Here, the camera 12 used is preferably small and has a deep depth of focus, and preferably uses a solid-state image carrier, for example.

(Embodiment 2) FIG. 2 is a block diagram of a second embodiment showing an application of the inspection device 19 disclosed in FIG. 1.

A plurality of inspection apparatuses 19 shown in the embodiment shown in FIG.
and the monitor 14, and switch these to each inspection device 19 through the switching device 20, and connect the probe card 8 and ICl3.
Check the alignment.

In the second embodiment of the present invention, by switching between a plurality of inspection devices 19, the operator does not have to walk between each inspection device, and the control device 16, video signal processing circuit 13, and monitor 14 can be saved.

[Effects of the Invention] As explained above, the present invention allows a camera to be installed at a location near the center of the test station at the bottom, and alignment of the probe card and IC can be performed while watching the monitor.
The worker does not have to work in an awkward posture and can perform work that is favorable from the viewpoint of safety.

Furthermore, since no light enters through the gap between the test station and the microscope, it is possible to measure ICs with high reliability.

[Brief explanation of the drawing]

FIG. 1(a) is a front view showing a first embodiment of the present invention, FIG. 1(b) is a bottom view thereof, FIG. 2 is a configuration diagram showing a second embodiment of the present invention, and FIG. The figure shows a schematic configuration diagram of a conventional inspection device.
FIG. 4 is a configuration diagram of a conventional test station and the vicinity of a prober. 1...IC tester 2...Control unit 3...
Test station 4...Console 5...Control device 6...Microscope 7...Prober
8...Probe card 9...Wafer
10...Stage 11...Cavity
12...Camera 13...Video signal processing circuit 14...Monitor 15a, 15b...Motor 16...Control unit 17...Light source, 18...I
C, 19...Inspection device 20...Switching device
21a, 21b...Feed screw (α) Fig. 1(b) Fig. 1 Fig. 3 Fig. 4

Claims (1)

[Claims] (1) In an inspection device that electrically connects the probe of a probe card to a semiconductor device in a wafer state and measures the electrical characteristics of the semiconductor device using an IC tester, the positional relationship between the semiconductor device and the probe card is determined. An inspection device that includes a camera that displays images, a video signal processing circuit that processes images captured by the camera, and a monitor that outputs a monitor image based on the image signal processed by the video signal processing circuit.