JPS63237868A - Forming method of diamond grinding wheel - Google Patents
Forming method of diamond grinding wheelInfo
- Publication number
- JPS63237868A JPS63237868A JP7027087A JP7027087A JPS63237868A JP S63237868 A JPS63237868 A JP S63237868A JP 7027087 A JP7027087 A JP 7027087A JP 7027087 A JP7027087 A JP 7027087A JP S63237868 A JPS63237868 A JP S63237868A
- Authority
- JP
- Japan
- Prior art keywords
- grinding wheel
- forming
- diamond
- grindstone
- diamond grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010432 diamond Substances 0.000 title claims abstract description 78
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims description 19
- 239000006061 abrasive grain Substances 0.000 claims abstract description 23
- 239000011230 binding agent Substances 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 5
- 238000003754 machining Methods 0.000 claims description 11
- 238000009760 electrical discharge machining Methods 0.000 abstract description 5
- 238000007599 discharging Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000007767 bonding agent Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/001—Devices or means for dressing or conditioning abrasive surfaces involving the use of electric current
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、砥粒が導電性の結合剤によって結合されてい
るダイヤモンド砥石の成形加工法に係り、特に高能率で
高精度にダイヤモンド砥石を成形仕上げ加工する方法に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for forming a diamond grinding wheel in which abrasive grains are bonded by a conductive binder, and particularly to a method for forming a diamond grinding wheel with high efficiency and high precision. Concerning a method for forming and finishing processing.
従来のメタルボンドなどの結合剤を用いて結合されたダ
イヤモンド砥石の成形仕上げ加工法（ツルーイング法）
としては１例えば、ダイヤモンド工具マニュアル（昭和
５４年５月１０日、ダイヤモンド工業会編集発行）第１
９８頁に述べられているごとく、ＧＣ砥石〔砥粒にＳｉ
Ｃ（炭化ケイ素）を用いた砥石〕による制動形ツルーイ
ング方法が一般に用いられている。この方法は、第４図
に示すごとく、回転するダイヤモンド砥石１′にＧＣ砥
石６′が連動しないようにブレーキ族ｆｆ１１２を設け
、ダイヤモンド砥石１′の先端をＧＣ砥石６′による研
削加工によって、ダイヤモンド砥石１′を所定の形状に
成形加工する方法である。A forming and finishing method for diamond grinding wheels bonded using a conventional bonding agent such as metal bond (truing method)
For example, Diamond Tool Manual (May 10, 1976, edited and published by Diamond Industry Association) No. 1
As stated on page 98, the GC grinding wheel [Si abrasive grains]
A braking type truing method using a grindstone using C (silicon carbide) is generally used. In this method, as shown in FIG. 4, a brake group ff112 is provided to prevent the GC grinding wheel 6' from interlocking with the rotating diamond grinding wheel 1', and the tip of the diamond grinding wheel 1' is ground by the GC grinding wheel 6'. This is a method of forming the grindstone 1' into a predetermined shape.
上述したごと〈従来技術においては、成形すべき砥石の
砥粒であるダイヤモンドは最も硬く、また結合剤も耐摩
耗性が高く、しかも無気孔であるために、ＧＣ砥石によ
る機械研削で成形を行うと。As mentioned above, in conventional technology, diamond, which is the abrasive grain of the whetstone to be shaped, is the hardest and the binder has high wear resistance and is non-porous, so forming is done by mechanical grinding with a GC grindstone. and.
ダイヤモンド砥石よりも、成形加工に使用するＧＣ砥石
の方の摩耗が著しく大きく、所定の形状のダイヤモンド
砥石を得るためには多大の加工時間を必要とした。しか
も、ＧＣ砥石の形状が大きく崩れるため、ダイヤモンド
砥石の成形時の形状精度も悪いという欠点があった。The wear of the GC grindstone used for forming processing was significantly greater than that of the diamond grindstone, and a large amount of processing time was required to obtain the diamond grindstone of a predetermined shape. Moreover, since the shape of the GC grindstone is greatly distorted, there is a drawback that the shape accuracy during molding of the diamond grindstone is also poor.
本発明は、上述した従来技術の欠点を解消し、高能率で
高精度のダイヤモンド砥石の成形仕上げ加工法を提供す
ることにある。An object of the present invention is to eliminate the above-mentioned drawbacks of the prior art and provide a highly efficient and highly accurate forming and finishing method for a diamond grindstone.
上記本発明の目的は、導電性の結合剤によって結合され
ているダイヤモンド砥石を、所定の形状に加工する成形
用の砥石の方にも、ダイヤモンド。The object of the present invention is to apply diamond to a forming whetstone in which a diamond whetstone bonded with a conductive binder is processed into a predetermined shape.
炭化ケイ素またはアルミナなどからなる硬い砥粒が導電
性の結合剤によって結合されている砥石を使用し、成形
加工するダイヤモンド砥石との間に、放電加工用電源を
設け、上記成形用の砥石をマイナス（−）極に、加工す
るダイヤモンド砥石の方をプラス（＋）極にして接続し
、両砥石間にパルス状の放電波形を加えて、ダイヤモン
ド砥石を機械研削すると同時に、放電加工による熱作用
を複合させてダイヤモンド砥石の成形加工を容易にする
ことにより、達成される。A grindstone in which hard abrasive grains made of silicon carbide or alumina are bonded with a conductive binder is used, and a power source for electric discharge machining is installed between the diamond grindstone used for forming and the above-mentioned forming grindstone is connected to a negative Connect the diamond grinding wheel to be processed with the positive (+) pole to the (-) pole, and apply a pulse-like discharge waveform between both grinding wheels to mechanically grind the diamond grinding wheel and at the same time reduce the thermal effect caused by the electrical discharge machining. This is achieved by making the diamond grindstone easier to form.
放電加工により、子種であるダイヤモンド砥石の結合剤
の一部は、放電加工の熱により溶融除去され、ダイヤモ
ンド砥粒の保持が弱くなるため、成形用砥石による機械
研削で容易にダイヤモンド砥粒を脱落させることができ
るため、ダイヤモンド砥石を高能率、高精度で、しかも
容易に成形加工することが可能になる。During electric discharge machining, some of the bonding agent in the diamond grinding wheel, which is a child type, is melted and removed by the heat of electric discharge machining, weakening the retention of the diamond abrasive grains, so it is easy to remove the diamond abrasive grains by mechanical grinding with a forming whetstone. Since it can be made to fall off, it becomes possible to form the diamond grindstone easily with high efficiency and precision.
しかも、成形加工時に印加電力などを調節し放電波形を
制御することができるため、ダイヤモンド砥石の結合剤
の熱による除去能率や除去深さを自在に調整することが
可能で、例えばダイヤモンド砥石の成形加工の初期にお
いては除去能率を高くシ、形成加工の終期には除去能率
を遅くすることによって、形状精度を極めて高く制御す
ることができる。Moreover, since it is possible to control the discharge waveform by adjusting the applied power etc. during the forming process, it is possible to freely adjust the removal efficiency and removal depth by heat of the bonding agent of the diamond grinding wheel. By increasing the removal efficiency at the beginning of processing and slowing down the removal efficiency at the end of forming processing, shape accuracy can be controlled to an extremely high level.
以下に本発明の一実施例を挙げ、図面に基づいてさらに
詳細に説明する。An embodiment of the present invention will be described below in more detail based on the drawings.
第１図は本発明のダイヤモンド砥石の成形加工方法の一
例を示す模式図である。図において、成形すべきダイヤ
モンド砥石１を保持し、回転させる砥石軸５を有する砥
石回転部およびダイヤモンド砥石１の成形面２，３を加
工するための成形用砥石６が配置され、成形用砥石６は
、モータ７によって回転され、かつ、スライドテーブル
８および支持台９を介して、移動テーブル１０に塔載さ
れている。そして、ダイヤモンド砥石１を子種に、成形
用砥石６を一極とした放電加工用電源１１が接続されて
いる。FIG. 1 is a schematic diagram showing an example of the method for forming a diamond grindstone according to the present invention. In the figure, a grindstone rotating section having a grindstone shaft 5 that holds and rotates a diamond grindstone 1 to be formed, and a forming grindstone 6 for processing forming surfaces 2 and 3 of the diamond grindstone 1 are arranged. is rotated by a motor 7 and mounted on a moving table 10 via a slide table 8 and a support stand 9. A power source 11 for electric discharge machining is connected to the diamond grindstone 1 as a child and the forming grindstone 6 as a single pole.
例えば、メタルボンドによって結合されたダイヤモンド
砥石１（外径５０ｍｍ 、厚さ０．３ｍｍ、砥粒精度＃
２０００）の成形面２および３の先端部を９０″に成
形加工する場合、ダイヤモンド砥石１をフランジ４を介
して砥石軸５に取り付け、所定の回転数（例えば、 １
５０００ｒｐｍ）で回転させる。一方、成形用砥石６と
して、例えばメタルボンドのダイヤモンド砥石（砥粒の
粒度＃ ８００ 、外径４０ｍｍ 、厚さ２ ｎ＋ｍ）
を用い、これを２０ 、 ＯＯＯｒｐｍで回転させる。For example, a diamond grinding wheel 1 (outer diameter 50 mm, thickness 0.3 mm, abrasive grain precision #
2000), the diamond grinding wheel 1 is attached to the grinding wheel shaft 5 via the flange 4 and rotated at a predetermined number of rotations (for example, 1
5000 rpm). On the other hand, as the forming whetstone 6, for example, a metal bond diamond whetstone (abrasive grain size #800, outer diameter 40mm, thickness 2n+m) is used.
and rotate it at 20 OO rpm.
そして、この成形用砥石６の外周面が、上記ダイヤモン
ド砥石１の成形面２に４５度の角度で当るようにし、か
つ所定の切込量（例えば５〜１０−）を与えて、スライ
ドテーブル８により成形用砥石６を移動させながら、ダ
イヤモンド砥石１の成形面２を加工する。この時、放電
加工用電源１１により、ダイヤモンド砥石１側を子種に
、成形用砥石６側を一極に接続し、第２図に示すごとく
、パルス波形（例えば、電圧Ｅを１００Ｖ、パルス幅τ
１を１０μｓ、パルス間隔て２を２０μｓとする）を有
する放電加工作用を複合させると、第３図に示すごとく
、メタルボンドのダイヤモンド砥石１の結合剤２３の一
部が放電加工により溶融除去され、表面にあるダイヤモ
ンド砥粒２２の保持力が弱くなるため、成形用砥石６の
砥粒２４により、ダイヤモンド砥石１の表面の砥粒の脱
落が促進され、ダイヤモンド砥石１の成形が容易になる
。このようにして、ダイヤモンド砥石１の成形面２を所
定の形状が得られるまで加工した後、ダイヤモト砥石１
の成形面３を上記と同様の方法で加工し、ダイヤモンド
砥石１の成形面２，３よりなる先端部を所定の形状に仕
上げることができる。Then, the outer circumferential surface of this forming whetstone 6 is brought into contact with the forming surface 2 of the diamond whetstone 1 at an angle of 45 degrees, and a predetermined depth of cut (for example, 5 to 10 -) is applied to the slide table 8. While moving the forming whetstone 6, the forming surface 2 of the diamond whetstone 1 is processed. At this time, the electrical discharge machining power supply 11 connects the diamond grinding wheel 1 side to the child and the forming grinding wheel 6 side to one pole, and as shown in FIG. τ
As shown in Fig. 3, part of the binder 23 of the metal-bonded diamond grinding wheel 1 is melted and removed by the electric discharge machining. Since the holding force of the diamond abrasive grains 22 on the surface becomes weaker, the abrasive grains 24 of the forming whetstone 6 promote the falling off of the abrasive grains on the surface of the diamond whetstone 1, making it easier to shape the diamond whetstone 1. In this way, after processing the forming surface 2 of the diamond grinding wheel 1 until a predetermined shape is obtained, the diamond grinding wheel 1
By processing the forming surface 3 of the diamond grinding wheel 1 in the same manner as described above, it is possible to finish the tip of the diamond grindstone 1 consisting of the forming surfaces 2 and 3 into a predetermined shape.
さらに、ダイヤモンド砥石１の成形面２および３を成形
加工する際に、ダイヤモンド砥石１と成形用砥石６との
間にかかる放電加工条件を制御することが可能であり、
例えば成形初期の段階では、印加電圧を１５０ｖと大き
くシ、ダイヤモンド砥石１の結合剤の熱による溶融除去
能率を高め、かつダイヤモンド砥石１と成形用砥石６と
の相対的切込量（例えば、５〜１０−）を大きくするこ
とにより、ダイヤモンド砥石１の砥粒の脱落除去を容易
にすると同時に、成形能率を高くすることができる。さ
らに成形加工の後段においては、印加電圧を、例えば５
０Ｖと小さくシ、シかもダイヤモンド砥石１と成形用砥
石６との相対的切込量を小さく（例えばＯ〜２７ｆｆｉ
）することにより、成形面の形状精度を高く維持するこ
とができると共に、ダイヤモンド砥石１の成形面２およ
び３の砥粒の突き出し量を適度に制御でき、成形面に付
着する不要な結合剤あるいは切屑などの除去も可能で、
成形面にダイヤモンド砥粒をよく突出させた鋭い切れ刃
を出現させる、いわゆるドレッシングの効果を併せて得
ることができる。Furthermore, when forming the forming surfaces 2 and 3 of the diamond grinding wheel 1, it is possible to control the electric discharge machining conditions applied between the diamond grinding wheel 1 and the forming grinding wheel 6,
For example, in the initial stage of forming, the applied voltage is set as high as 150 V to increase the efficiency of melting and removing the binder of the diamond grinding wheel 1 due to heat, and the relative cutting depth between the diamond grinding wheel 1 and the forming grinding wheel 6 (for example, 5 By increasing ~10-), the abrasive grains of the diamond grindstone 1 can be easily removed and the forming efficiency can be increased. Furthermore, in the latter stage of the molding process, the applied voltage is increased to 5, for example.
The relative depth of cut between the diamond grinding wheel 1 and the forming grinding wheel 6 may be small (for example, 0 to 27ffi).
), it is possible to maintain high shape accuracy of the molding surface, and also to appropriately control the protruding amount of abrasive grains on the molding surfaces 2 and 3 of the diamond grinding wheel 1, thereby eliminating unnecessary binder or It is also possible to remove chips etc.
It is also possible to obtain the so-called dressing effect, in which a sharp cutting edge with well-protruding diamond abrasive grains appears on the forming surface.
上記実施例において、成形用砥石として、ダイヤモンド
砥石を用いる場合の例を挙げたが、この他に炭化ケイ素
（ＳｉＣ）、アルミナ（ＡＩ２２０．）などの硬い砥粒
を導電性の結合剤であるメタルボンドで結合させた砥石
を用いても、上記実施例と同様の効果があることを確認
している。しかし、成形加工の精度および能率からいっ
てダイヤモンド砥石を用いるのが最も望ましい。In the above embodiment, a case where a diamond grindstone is used as a forming grindstone is given, but in addition, hard abrasive grains such as silicon carbide (SiC) and alumina (AI220. It has been confirmed that the same effect as in the above example can be obtained even when a grindstone bonded with a bond is used. However, it is most desirable to use a diamond grindstone in terms of precision and efficiency of the forming process.
以上詳細に説明したごとく、本発明の導電性の結合剤を
含む成形加工用砥石を用い、同じく導電性の結合剤より
なるダイヤモンド砥石を、放電加工作用を複合させなが
ら成形仕上げ加工を行う方法は、高能率で、しかも高精
度にダイヤモンド砥石の成形加工ができ、しかもダヤモ
ンド砥石の成形面のドレッシング効果を併せて得ること
ができる。As explained in detail above, there is a method for forming and finishing a diamond grindstone also made of a conductive binder using a forming grindstone containing an electrically conductive binder of the present invention while combining electric discharge machining action. , it is possible to form a diamond grindstone with high efficiency and precision, and also to obtain the dressing effect of the forming surface of the diamond grindstone.
第１図は本発明の実施例におけるダイヤモンド砥石の成
形加工方法を示す模式図、第２図は実施例における放電
加工条件である放電パルス波形を示すグラフ、第３図は
実施例におけるダイヤモンド砥石と成形用砥石の放電加
工作用を示す説明図、第４図は従来のダイヤモンド砥石
の修正法の一例を示す模式図である。
１．１′・・・ダイヤモンド砥石
２．３・・・成形面
４・・・フランジ ５・・・砥石軸６．６′・
・・成形用砥石 ７・・・モータ８・・・スライドテー
ブル ９・・・支持台１０・・・移動テーブル １
１・・・放電加工用電源１２・・・ブレーキ装置
１３・・・テーブル２２・・・ダイヤモンド砥粒 ２３
・・・結合剤２４・・・成形用砥石の砥粒
２５・・・成形用砥石の結合剤
τ、・・・パルス幅
τ２・・・パルス間隔
Ｅ・・・電圧
代理人弁理士 中 村 純之助
才１ 図
１−−一 ダイヤモー１１士＼石
２．３−−−へデン ｃｔ＋
４−−−フラ＞ジ
５−−一石ε６畢自
ｌ ｌ −−−＊７ ＠ ｆｔＤｘ １４９ｙ；９１Ｐ
２図
ＩＰ３図Fig. 1 is a schematic diagram showing a method of forming a diamond grinding wheel in an example of the present invention, Fig. 2 is a graph showing a discharge pulse waveform which is the electric discharge machining condition in an example, and Fig. 3 is a diagram showing a diamond grinding wheel in an example. FIG. 4 is an explanatory diagram showing the electric discharge machining action of a forming whetstone. FIG. 4 is a schematic diagram showing an example of a conventional method for repairing a diamond whetstone. 1.1'... Diamond grinding wheel 2.3... Molding surface 4... Flange 5... Grinding wheel shaft 6.6'.
...Forming grindstone 7...Motor 8...Slide table 9...Support stand 10...Movement table 1
1... Power source for electrical discharge machining 12... Brake device
13...Table 22...Diamond abrasive grain 23
... Binder 24 ... Abrasive grains of the forming whetstone 25 ... Binder τ of the forming whetstone, ... Pulse width τ2 ... Pulse interval E ... Voltage agent Junnosuke Nakamura, patent attorney Sai 1 Figure 1--1 Diamo 11shi\Ishi 2.3--Heden ct+ 4---Fla > Ji 5--Ichikoku ε6 Biji l l ---*7 @ ftDx 149y; 91P
Figure 2 IP Figure 3
Claims (1)
ヤモンド砥石を成形加工する方法において、上記ダイヤ
モンド砥石を所定の幾何学的形状に成形加工するために
用いる砥石として、砥粒が導電性の結合剤によって結合
されている成形用砥石を用い、上記ダイヤモンド砥石と
、該ダイヤモンド砥石を成形加工する上記成形用砥石と
の間に、放電加工用の電源を印加し、上記ダイヤモンド
砥石の機械的研削加工を行うと同時に、放電加工による
熱作用を複合させて、上記ダイヤモンド砥石の加工制御
を行いながら成形加工することを特徴とするダイヤモン
ド砥石の成形加工法。 ２、成形用砥石として、ダイヤモンド砥粒を導電性のメ
タルボンドで結合させた砥石を用いることを特徴とする
特許請求の範囲第１項に記載のダイヤモンド砥石の成形
加工法。[Claims] 1. In a method for forming a diamond grindstone in which abrasive grains are bonded by a conductive binder, the grindstone used for forming the diamond grindstone into a predetermined geometric shape includes: Using a forming whetstone in which abrasive grains are bonded by a conductive binder, a power source for electric discharge machining is applied between the diamond whetstone and the forming whetstone that shapes the diamond whetstone, and the above-mentioned A method for forming a diamond whetstone, characterized by performing mechanical grinding of the diamond whetstone and, at the same time, combining the thermal action of electric discharge machining to form the diamond whetstone while controlling the processing. 2. The method for forming a diamond grindstone according to claim 1, wherein a grindstone in which diamond abrasive grains are bonded with a conductive metal bond is used as the forming grindstone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7027087A JPS63237868A (en) | 1987-03-26 | 1987-03-26 | Forming method of diamond grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7027087A JPS63237868A (en) | 1987-03-26 | 1987-03-26 | Forming method of diamond grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63237868A true JPS63237868A (en) | 1988-10-04 |
Family
ID=13426662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7027087A Pending JPS63237868A (en) | 1987-03-26 | 1987-03-26 | Forming method of diamond grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63237868A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0938948A1 (en) * | 1998-02-26 | 1999-09-01 | The Institute Of Physical & Chemical Research | Method and apparatus for profile mirror surface grinding |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61146467A (en) * | 1984-12-18 | 1986-07-04 | Oyo Jiki Kenkyusho:Kk | Cutting-off grinding method by conductive grindstone and cutting-off grinding device |
| JPS6228172A (en) * | 1985-07-29 | 1987-02-06 | Hitachi Ltd | Formation of grindstone |
-
1987
- 1987-03-26 JP JP7027087A patent/JPS63237868A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61146467A (en) * | 1984-12-18 | 1986-07-04 | Oyo Jiki Kenkyusho:Kk | Cutting-off grinding method by conductive grindstone and cutting-off grinding device |
| JPS6228172A (en) * | 1985-07-29 | 1987-02-06 | Hitachi Ltd | Formation of grindstone |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0938948A1 (en) * | 1998-02-26 | 1999-09-01 | The Institute Of Physical & Chemical Research | Method and apparatus for profile mirror surface grinding |
| US6149504A (en) * | 1998-02-26 | 2000-11-21 | The Institute Of Physical And Chemical Research | Method and apparatus for profile mirror surface grinding |
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