JPS63237556A - Bending method of connecting protrusion piece of electronic member - Google Patents

Abstract

PURPOSE:To easily bend a connecting protrusion piece as compared with the bending after the piece is contained in a case by using shape memory alloy for the piece, flattening the piece, then containing it in the case, returning to a memory stage at high temperature together with the case, and bending the piece. CONSTITUTION:Connecting protrusion pieces 11-13 of terminal plates 4, 6, 9 are shaped in predetermined bent shape, heated to a high temperature of austenite transformation ending temperature or higher to memorize its shape. Then, the plates 4, 6, 9 are deformed flatly at martensite transformation ending temperature or lower. Thereafter, the flattened plates 4, 6, 9 are inserted together with other members in the containing air gap 3 of a case 1, the pieces 11-13 are protruded from an opening face 2, a sealing plate 14 is engaged, and epoxy resin 15 is than poured. Thereafter, the case 1 is placed in an atmosphere of the austenite transformation ending temperature or higher by heating. Thus, the pieces 11-13 are returned to the bending shape to be connected to a predetermined conduction passage to the substrate.

Description

[Detailed Description of the Invention] <Industrial Application Field> So-called surface-mounted ladder-type electric filters, which are made into a thin unit by combining a pair of series resonators and a parallel resonator, and surface-mounted type electric filters. IC packages, etc., which have connecting protrusions protruding laterally from the opening of the case to connect with the required conductive paths on the printed circuit board, and which are placed horizontally on the printed circuit board to make the required connections. One aspect of the present invention relates to a method for bending a connecting protrusion in such an electrical component.

<Problems to be Solved by the Invention> One electrode of the series resonator is connected to the input side terminal plate, one side electrode of the parallel resonator is connected to the ground side terminal plate, and the other side electrode of the series resonator is connected to the input side terminal plate. The other side of the parallel resonator? l! A ladder-type circuit in which a circuit constructed by connecting a pole and an output # terminal plate is housed in a case, and each connecting protrusion connected to each terminal plate is made to protrude laterally from the opening surface of the case. Electric filters are known.

A plurality of filters of this type are arranged horizontally on a printed circuit board, and each input/output terminal and a ground terminal are connected to a required conductive path on the printed circuit board through a resistor to form a filter circuit.

In order to connect and fix this ladder-type electric filter on a printed circuit board, the electric filter is placed horizontally on a printed circuit board. In order to connect to the channel, the connecting piece must be bent.

For this reason, conventionally, after assembly into the case, the connecting protrusion was formed into a J-shape (see connection protrusion 31 in Fig. fJTJ5) or a gull wing (see connection protrusion 11, 12, 13 in Fig. 2).
It was bent and formed into a predetermined shape, such as a bat lead. However, since this molding is accompanied by a case, it is subject to various restrictions and processing is troublesome.

In addition, after assembling the terminal board, it is necessary to insert the connecting protrusion into the sealing plate and then sealing the opening of the case with the sealing plate, so the connecting protrusion must be bent in advance. I can't leave it behind.

Similarly, for surface-mounted IC packages, it is necessary to bend the connecting protrusions protruding from the sides into a predetermined shape in order to connect them to the conductive paths on the printed circuit board, and for the same reason, It was necessary to perform bending treatment in post-processing.

The present invention aims at improving the method of bending the connecting protrusion in such an electrical component.

Means for Solving the Problems> The present invention uses a shape memory alloy for the connecting protrusion, and bends the connecting protrusion of the terminal board into a predetermined shape in advance so that it can be connected to a predetermined conductive path to a printed circuit board. Write down! ! After letting me
It is characterized in that it is shaped into a flat shape in the martensitic phase region, is assembled into a case in that flat shape, and is then transferred together with the case to a temperature atmosphere of an austenite phase region to return to the memorized shape. .

Shape memory alloys made of nickel, titanium alloys, etc. exhibit a martensite phase at low temperatures and an austenite phase at high temperatures. When heated above the transformation end temperature, it returns to its original shape, and even when this temperature is lowered, it retains its shape.

Here, the martensitic transformation end temperature refers to the temperature at which when the shape memory alloy is gradually cooled, the transformation to the martensitic phase begins, and when it is further cooled, the transformation ends and the martensitic phase is formed. , usually -80 to 80
It is possible to set the temperature relatively arbitrarily within the range of .degree. C. by selecting the alloy composition, etc.

In addition, the austenite transformation end temperature refers to the temperature at which when a shape memory alloy is heated, the transformation to the austenite phase starts, and when it is further cooled, the transformation ends and the austenite phase is formed. 1 Usually -10 to 110 It is possible to set the temperature within the range of ℃.

Therefore, after forming the desired connecting protrusion using a shape memory alloy and memorizing the required bending shape, martensite modification yE
Deform into a flat shape below the end temperature, and in that shape
After that, the case is placed in an atmosphere where the austenite transformation end temperature is higher than the austenite transformation end temperature by heating or the like.

As a result, the connecting protrusion returns to its bent shape and can be connected to a predetermined conductive path to the printed circuit board.

<Example> An embodiment of the invention will be described with reference to FIG. 1.2.

Reference numeral 1 denotes a thin rectangular case made of a synthetic resin material, and the case 1 is formed with a storage space 3 whose opening surface 2 is the negative side. In the storage space 3, from the negative side, there is an input terminal board 4. Series resonator 5. Output side terminal board 6. Conductive plate 7. A parallel resonator 8 and a ground side terminal plate 9 are sequentially laminated.

And input side terminal board 4. Output side terminal board 6. Conductive plate 7.
The ground side terminal plate 9 has a 1° press-contact protuberance formed on its surface for press-contacting with an electrode on one side of the resonator 5.8 to ensure connection with a desired electrode.

Furthermore, the input side terminal board 4. Connecting protrusions 11 and 12° 13 are provided on the output side terminal plate 6 and the ground side terminal plate 9, respectively, on the opening surface 2.
It protrudes outward from the sides. The arrangement positions are such that they do not overlap in the width direction.

The terminal plates 4, 6.9 are made of a shape memory alloy such as an alloy of nickel and titanium, and are assembled by the following procedure.

Step I First, as shown in FIG. 3A, the connecting protrusions 11, 12.13 of the terminal plate 4°6.9 are shaped into a predetermined bent shape (gull wing), and heated to a high temperature higher than the austenite transformation end temperature. Memorize the shape.

Step II Next, the terminal plates 4, 6.9 are deformed into a flat shape below the martensitic transformation completion temperature (see Figure 3). Plastic deformation occurs when excessive stress is applied. That is, in the case of the martensitic phase, deformation due to stress is compensated for by movement of a large amount of martensite at the interface and twin boundaries, and deformation remains even after the stress is removed. Therefore, a certain pressure is applied by means such as press molding! j, and the terminal plates 4, 6.9 are made flat.

Note that by setting the austenite transformation termination temperature to a high temperature of about 90° C. and setting the martensitic transformation termination temperature to room temperature, the flattening can be performed at room temperature.

Step m: Insert the flat terminal plate 4, 6.9 together with other members into the storage space 3 of the case 1, make the connecting protrusion pieces 11, 12.13 protrude from the opening surface 2, and then The stop plate 14 is fitted, and then the epoxy resin 15 is injected (FIG. 3C).

At this time, since the terminal plate 4.6.9 is flat,
It can be easily stored in the storage space 3.

Step (2) The case 1 is placed in a high-temperature furnace 16 and heated to a high temperature equal to or higher than the austenite transformation completion temperature. Due to this heating, due to the properties of the shape memory alloy, the terminal plates 4, 6.
The connecting protrusions 11, 12, and 13 of 9 have a bent shape (the third
Figure 2).

During this heating, in order to prevent expansion, deformation, etc. of Case 1, which is made of a synthetic resin material, the properties of the shape memory alloy are adjusted so that the material of Case J can easily cope with the temperature at which the austenite transformation ends. Set in advance.

Even when the case 1 is taken out of the furnace 16 and left at room temperature, the connecting protrusions 11, 12.13 of the terminal plates 4, 6.9 maintain their bent shapes.

Further, the austenite transformation end temperature can also be set to room temperature. In this case, it is necessary to flatten the terminal plate 4°6.9 in a low temperature range, but in such a low temperature range,
After completing the attachment of the parts to case 1, by returning it to room temperature, the case 1 returns to its memorized shape without the need for heating work.
There is an advantage that the mounting within the storage space 3 can be carried out tightly.

Therefore, from the opening surface 2 of the case l, the connecting protrusion 11°12.1
A ladder-type electric filter F in which 3 protrudes is constructed.

The electric filter F having the above configuration is placed horizontally on the printed circuit board p, and the connecting protrusions 11, 12, 13 are placed horizontally on the printed circuit board p as shown in FIG.
is suitably bent and connected to a required conductive path on the printed circuit board P by soldering or the like, thereby configuring, for example, a filter circuit shown in FIG. 4.

That is, each series resonator 5 is connected to the input/output terminal 20 .
21 and the respective series resonators 5
A resistor 22 disposed on the printed circuit board p is connected in parallel to the resistor 22 disposed on the printed circuit board p.

Further, the parallel resonator 8 is connected to the ground terminal 24 via the connecting protrusion 13 of the ground side terminal plate 9 via the resistor 23 disposed on the printed circuit board p, thereby connecting them in parallel. Thus, by using a plurality of electric filters F, a filter circuit is constructed.

Figure 5 A1 shows an IC package 30 to which the present invention is applied, and connecting protrusions 31, 31 that protrude from both ends and have already been subjected to the tα treatment are placed in a high temperature furnace 32 to complete austenite transformation. By heating it to a high temperature higher than that temperature, it returns to its memorized shape (J-type lead) and is bent. After making the connecting protrusion into a flat shape, store it in the case,
After that, the connecting protrusion is bent by returning it to its memorized shape together with the case under high temperature.
Compared to the case where the connecting protrusion is bent and formed after being housed in a case, this method has excellent effects such as easier bending.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional side view of a ladder-type electric wave device F assembled according to the present invention, and FIG. 2 is a perspective view showing how the ladder-type electrical wave device F is attached to a printed circuit board P. , FIG. 3 is an explanatory diagram showing the assembly process, and FIG. 4 is a filtration circuit diagram to which the electrosonic wave device F is applied. FIG. 5A is an explanatory view showing part of the bending process when applied to the IC puff cage 30. l; Case 2; Opening 5; Series resonator 8; Row resonators in 1 4, 6, 9; Terminal board 11, 12. 13. Connection protrusion 30. IC Package 31, Connecting Piece Applicant: Hiki Tokushu Togyo Co., Ltd., Patent Attorney: Kita Matsuura. Kagome 4 Figure 3 (A) 11.12.13

Claims (1)

[Claims] An electrical component comprising a connecting protrusion protruding laterally from the opening surface of the case for connecting to a required conductive path on a printed circuit board, in which a shape memory alloy is used for the connecting protrusion and the connecting protrusion is printed. After memorizing a predetermined bent shape that can be connected to the required conductive path to the board, it is made into a flat shape in the martensite phase region, and then installed in the case in that flat shape, and then transferred to the temperature atmosphere in the austenite phase region together with the case. A method for bending a connecting protrusion in an electrical component, characterized in that the connecting protrusion in an electrical component is returned to the memorized shape.