JPS63235071A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPS63235071A JPS63235071A JP6693987A JP6693987A JPS63235071A JP S63235071 A JPS63235071 A JP S63235071A JP 6693987 A JP6693987 A JP 6693987A JP 6693987 A JP6693987 A JP 6693987A JP S63235071 A JPS63235071 A JP S63235071A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- soldering
- thread
- string
- soldering iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 45
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052742 iron Inorganic materials 0.000 claims abstract description 16
- 238000002844 melting Methods 0.000 abstract description 6
- 230000008018 melting Effects 0.000 abstract description 6
- 239000006185 dispersion Substances 0.000 abstract 1
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〈発明の分野〉
この発明は糸半田用自動半田付装置に適した半田付方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a soldering method suitable for an automatic soldering device for thread soldering.
〈従来技術とその問題点〉
ｉｆに、糸半田用自動半田付装置を用いた半田付方法は
、第３図に示すように図示しない供給部から糸半田３１
をガイド部材３２で案内させながら一定の送り量で半田
鏝３３の先端部に当てて溶融させるようになっている。<Prior art and its problems> If the soldering method uses an automatic soldering device for thread solder, as shown in FIG.
While being guided by a guide member 32, the soldering iron 33 is applied to the tip of a soldering iron 33 at a constant feed rate and melted.
しかし、上記従来の方法では、糸半田３１が半ｍ旙３３
に当った力のせ単ｍ３１の婉はス侍署が定まらず、延溶
したすして半田湯玉量にばらつきが生じ、こめ結果半田
付部の半田量も不均一的となり、高い信頼性が得られな
い。However, in the above conventional method, the thread solder 31 is half a meter long.
The force exerted by the single meter 31 is not determined, and the amount of solder that spreads varies, and as a result, the amount of solder in the soldered area becomes uneven, making it difficult to obtain high reliability. do not have.
〈発明の目的〉
この発明は上記従来のものの問題点を解消するためにな
されたもので、糸半田自体で溶融量を制限させるように
して、半田付部の半田量の均一化を図り得る半田付方法
を提供することを目的としている。<Purpose of the Invention> The present invention has been made to solve the problems of the conventional methods described above, and provides a solder that can uniformize the amount of solder in the soldered area by limiting the amount of melting with the solder thread itself. The purpose is to provide a method for attaching.
〈発明の構成と効果〉
この発明に係る半田付方法は、供給部から供給される糸
半田が半田鏝に当接する以前に、上記糸半田の横断面が
小さくなるような半切り状部を該糸半田の長手方向へ所
定間隔毎に形成したものである。<Structure and Effects of the Invention> The soldering method according to the present invention applies a half-cut portion such that the cross section of the solder thread becomes small before the solder thread supplied from the supply section contacts the soldering iron. These are formed at predetermined intervals in the longitudinal direction of the solder thread.
この発明によれば、糸半田に半切り状部を形成したから
、糸半田が半田鏝に当った際の熱伝達が上記半切り状部
で規〃１されて溶融量が一定となり、半田付部の半田量
を均一にすることができる。According to this invention, since the half-cut portion is formed in the solder thread, the heat transfer when the solder thread hits the soldering iron is regulated by the half-cut portion, so that the amount of melting is constant, and the soldering The amount of solder can be made uniform.
〈実施例の説明〉
以下、この発明の一実施例を図面にしたがって説明する
。<Description of Embodiment> An embodiment of the present invention will be described below with reference to the drawings.
第１図はこの発明に係る半田付方法を糸半田用自動半田
付装置に適用した例を示すものである。FIG. 1 shows an example in which the soldering method according to the present invention is applied to an automatic soldering device for thread soldering.
同図において、１は糸半田供給ローラなどからなる供給
部、２はこの供給部１かも繰り出される糸半田、３は半
田鏝、４は供給部ｌから繰り出される糸半田２を上記半
田鏝３の先端部まで案内するガイド部材である。上記供
給部ｌと上記ガイド部材４の先端との間には、糸半田２
をはさんで１対の半切り用カッタ５，６が配置されてい
る。これら両方ツタ５，６は第２図に示すように糸半田
２が半田鏝３に当接するに先立って、この糸半田２に横
断面が小さくなるような半切り状部７を長手方向へ一定
間隔で形成するようになっている。In the figure, 1 is a supply unit consisting of a thread solder supply roller, etc., 2 is thread solder that is also fed out from this supply unit 1, 3 is a soldering iron, and 4 is a soldering iron 2 that is fed out from the supply unit 1, and 4 is a solder thread 2 fed out from the supply unit 1. This is a guide member that guides the tip to the tip. A thread solder 2 is provided between the supply portion l and the tip of the guide member 4.
A pair of half-cutting cutters 5 and 6 are arranged with the two sides in between. As shown in FIG. 2, both of these vines 5 and 6 cut a half-cut part 7 in the solder thread 2 so that the cross section becomes smaller in the longitudinal direction, before the solder thread 2 comes into contact with the soldering iron 3. It is designed to be formed at intervals.
つぎに、上記装置による半田付方法を説明する。Next, a soldering method using the above device will be explained.
供給部１から繰り出された糸半田２はガイド部材４で案
内されて半田鏝３の先端側へ一定量づつ送給され、半田
鏝３に当った先端から溶融される。この糸半田２の先端
が半田鏝３に当る前に、この糸半田２にはカッタ５，６
により半切り状部が形成される。このため、糸半田２が
半田鏝３に当った際の半切り状部７の熱容量は他の部分
に比して小さくなり、この部分７により基端側へ向う熱
伝達が妨げられ、糸半田２の延溶が阻止される。このこ
とは換言すれば、糸半田２の基端側へ向うのが阻止され
た熱容量が糸半田２の先端側へ集中して完全溶解を促進
することになる。この結果、糸半田２の溶解による湯玉
の量のばらつきが少なくなり、半田付部の半田量が均一
的になり、品質向上に貢献することができる。The thread solder 2 fed out from the supply section 1 is guided by a guide member 4 and fed in a fixed amount to the tip side of the soldering iron 3, and is melted from the tip that hits the soldering iron 3. Before the tip of this solder wire 2 hits the soldering iron 3, cutters 5 and 6 are attached to the solder wire 2.
A half-cut portion is formed. Therefore, when the solder thread 2 hits the soldering iron 3, the heat capacity of the half-cut portion 7 is smaller than that of other parts, and this portion 7 prevents heat transfer toward the proximal end, and the solder thread 2 2. Melting spread is prevented. In other words, the heat capacity that is prevented from going toward the proximal end of the solder wire 2 is concentrated toward the distal end of the solder wire 2, thereby promoting complete melting. As a result, variations in the amount of hot water beads due to melting of the solder thread 2 are reduced, and the amount of solder in the soldered portion becomes uniform, contributing to quality improvement.
上記糸半田２に半切り状部７を形成する手段は、上記の
ものに限られるものではなく、糸半田２の横断面が小さ
くできるものであればよい。The means for forming the half-cut portion 7 in the solder thread 2 is not limited to the above-mentioned method, and any method may be used as long as the cross section of the solder thread 2 can be made small.
また、上記半田付方法は糸半田を使用するものであれば
、自動半田付装置だけに限定されるものではない。Furthermore, the soldering method described above is not limited to automatic soldering equipment as long as thread soldering is used.
第１図はこの発明に係る半田付方法を糸半田用自動半田
付装置に適用した概略構成図、第２図はこの発明に使用
する糸半田の部分拡大断面図、第３図は従来例の説明図
である。
ｌ・・・供給部、２・・・糸半田、３・・・半田鏝、７
・・・半切り状部。
第１図
一［へ２図
第３閏Fig. 1 is a schematic configuration diagram in which the soldering method according to the present invention is applied to an automatic soldering device for thread solder, Fig. 2 is a partially enlarged sectional view of the thread solder used in this invention, and Fig. 3 is a conventional example. It is an explanatory diagram. l...supply section, 2...solder thread, 3...soldering iron, 7
...Half-cut portion. Figure 1 1 [to Figure 2 Figure 3 Leap]
Claims (1)
以前に、上記糸半田の横断面積が小さくなるような半切
り状部を該糸半田の長手方向へ所定間隔毎に形成するこ
とを特徴とする半田付方法。(1) Before the solder wire supplied from the supply section contacts the soldering iron, half-cut portions are formed at predetermined intervals in the longitudinal direction of the solder wire so that the cross-sectional area of the solder wire becomes smaller. A soldering method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6693987A JPS63235071A (en) | 1987-03-20 | 1987-03-20 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6693987A JPS63235071A (en) | 1987-03-20 | 1987-03-20 | Soldering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63235071A true JPS63235071A (en) | 1988-09-30 |
Family
ID=13330475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6693987A Pending JPS63235071A (en) | 1987-03-20 | 1987-03-20 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63235071A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471775A (en) * | 1990-07-10 | 1992-03-06 | Hamamoto Technical Kk | Automatic brazing method and automatic brazing machine used therefor |
-
1987
- 1987-03-20 JP JP6693987A patent/JPS63235071A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0471775A (en) * | 1990-07-10 | 1992-03-06 | Hamamoto Technical Kk | Automatic brazing method and automatic brazing machine used therefor |
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