JPS63234201A - Thin film body for optical use - Google Patents
Thin film body for optical useInfo
- Publication number
- JPS63234201A JPS63234201A JP6784887A JP6784887A JPS63234201A JP S63234201 A JPS63234201 A JP S63234201A JP 6784887 A JP6784887 A JP 6784887A JP 6784887 A JP6784887 A JP 6784887A JP S63234201 A JPS63234201 A JP S63234201A
- Authority
- JP
- Japan
- Prior art keywords
- polymer
- thin film
- ring opening
- dicyclopentadiene
- film body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 21
- 239000010409 thin film Substances 0.000 title claims abstract description 19
- 229920000642 polymer Polymers 0.000 claims abstract description 32
- 238000007142 ring opening reaction Methods 0.000 claims abstract description 14
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims abstract description 13
- 238000002834 transmittance Methods 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 abstract description 15
- -1 cyclic olefin Chemical class 0.000 abstract description 11
- 238000005984 hydrogenation reaction Methods 0.000 abstract description 11
- 239000000463 material Substances 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 229920005989 resin Polymers 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000178 monomer Substances 0.000 abstract description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 24
- 239000010408 film Substances 0.000 description 15
- 239000000047 product Substances 0.000 description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 239000003054 catalyst Substances 0.000 description 10
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000206 photolithography Methods 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 5
- 239000004926 polymethyl methacrylate Substances 0.000 description 5
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 239000004417 polycarbonate Substances 0.000 description 4
- 229920000515 polycarbonate Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 4
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 3
- RELMFMZEBKVZJC-UHFFFAOYSA-N 1,2,3-trichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1Cl RELMFMZEBKVZJC-UHFFFAOYSA-N 0.000 description 3
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical group ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 3
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 3
- 239000005909 Kieselgur Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229940117389 dichlorobenzene Drugs 0.000 description 3
- 150000008282 halocarbons Chemical class 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003623 transition metal compounds Chemical class 0.000 description 2
- VOITXYVAKOUIBA-UHFFFAOYSA-N triethylaluminium Chemical compound CC[Al](CC)CC VOITXYVAKOUIBA-UHFFFAOYSA-N 0.000 description 2
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 1
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 1
- SHWZFQPXYGHRKT-FDGPNNRMSA-N (z)-4-hydroxypent-3-en-2-one;nickel Chemical compound [Ni].C\C(O)=C\C(C)=O.C\C(O)=C\C(C)=O SHWZFQPXYGHRKT-FDGPNNRMSA-N 0.000 description 1
- DKCPKDPYUFEZCP-UHFFFAOYSA-N 2,6-di-tert-butylphenol Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1O DKCPKDPYUFEZCP-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- NGNBDVOYPDDBFK-UHFFFAOYSA-N 2-[2,4-di(pentan-2-yl)phenoxy]acetyl chloride Chemical compound CCCC(C)C1=CC=C(OCC(Cl)=O)C(C(C)CCC)=C1 NGNBDVOYPDDBFK-UHFFFAOYSA-N 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N 2-propanol Substances CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 239000002638 heterogeneous catalyst Substances 0.000 description 1
- 239000002815 homogeneous catalyst Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- UKVIEHSSVKSQBA-UHFFFAOYSA-N methane;palladium Chemical compound C.[Pd] UKVIEHSSVKSQBA-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 150000005673 monoalkenes Chemical class 0.000 description 1
- UIEKYBOPAVTZKW-UHFFFAOYSA-L naphthalene-2-carboxylate;nickel(2+) Chemical compound [Ni+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 UIEKYBOPAVTZKW-UHFFFAOYSA-L 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011949 solid catalyst Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- RWWNQEOPUOCKGR-UHFFFAOYSA-N tetraethyltin Chemical compound CC[Sn](CC)(CC)CC RWWNQEOPUOCKGR-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- IAQRGUVFOMOMEM-ONEGZZNKSA-N trans-but-2-ene Chemical compound C\C=C\C IAQRGUVFOMOMEM-ONEGZZNKSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- KPGXUAIFQMJJFB-UHFFFAOYSA-H tungsten hexachloride Chemical compound Cl[W](Cl)(Cl)(Cl)(Cl)Cl KPGXUAIFQMJJFB-UHFFFAOYSA-H 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、光学用薄膜体に関し、さらに詳しくは、透明
性、#水性および熟的性質に優れ、かつ特に短波長領域
における光透過率に優れた光学用薄膜体間する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an optical thin film body, and more specifically, to a thin film body for optical use, which has excellent transparency, aqueous properties, and thermal properties, and particularly has excellent light transmittance in the short wavelength region. Between optical thin film bodies.
従来の技術
]ンパクトディスク、ビデオディスク、コンピュータデ
ィスク等の光学記録材料の表面保護層としては、一般に
ガラスあるいは高分子物質が用いられているが、大量生
産する場合には成形加工性の容易さからプラスチック性
の材料が望ましい。この場合、プラスチックに要求され
る特性として、■透明で高い光線透過率を有し、屈折率
が安定しており複屈折率が小さい等の光学的特性が良好
なこと、■プラスチック保護層としてアルミニウム、銀
メッキしたアルミニウム等の記録基盤を保護し得る程度
の耐熱変形性を有すること、吸湿による基盤の腐蝕がな
いこと等の性質を有すること、(■成形加工性の良好な
こと、などが挙げられる。[Prior art] Glass or polymeric substances are generally used as the surface protective layer of optical recording materials such as compact discs, video discs, computer discs, etc.; Plastic material is preferred. In this case, the properties required of the plastic are: ■ Good optical properties such as being transparent, having high light transmittance, stable refractive index, and low birefringence, and ■ Aluminum as the plastic protective layer. , have properties such as heat deformation resistance to the extent that it can protect recording substrates such as silver-plated aluminum, and no corrosion of the substrate due to moisture absorption; It will be done.
現在、このような特性を比較的溝たし得るプラスチック
としてポリカーボネート、ポリメチルメタクリレート等
が用いられているが、ポリカーボネートはガラス転移温
度(Tg)が高いため耐熱性は良好であるが、吸湿性が
やや高く、複屈折を起こしやすく、かつ分子構造上加水
分解性を有する。一方、ポリメチルメタクリレートは透
明で、複屈折率が小さい等、光学的性質は優れているが
、吸湿性が高いので基盤が腐蝕したり、寸法形状の変化
にともなうディスク表面のそりが生じたりする。また、
Tgも100℃付近であるため高温下での変形も無視で
きない。Currently, polycarbonate, polymethyl methacrylate, etc. are used as plastics that can relatively satisfy these characteristics, but polycarbonate has a high glass transition temperature (Tg) and has good heat resistance, but has poor moisture absorption. It is somewhat high, tends to cause birefringence, and has hydrolyzability due to its molecular structure. On the other hand, polymethyl methacrylate is transparent and has excellent optical properties such as a low birefringence, but its high hygroscopicity causes corrosion of the base and warping of the disk surface due to changes in size and shape. . Also,
Since Tg is also around 100°C, deformation at high temperatures cannot be ignored.
また、現在、半導体微細加工技術はフォトリソグラフィ
ーが主流となっているが、半導体素子もLSIからVL
S Iへ高密度化してフォトリソグラフィーでの限界が
2〜3ミクロンとされており、超微細加工技術の開発が
進められ電子線やX線と共に遠紫外線等が注目されてい
る。そして、従来、LSIの製造のためのフォトリソグ
ラフィーにおいては光源に紫外線(350〜450nm
)を使用しているが、近年、集積度の高いウェハやチッ
プの製造のために300nm程度あるいはそれ以下の短
波長の紫外線で露光する技術が開発されてきている。と
ころが、従来からある光学用のプラスチック、例えば、
ポリカーボネートやポリメチルメタクリレートなどは、
300nmにおける光透過率が50%以下と低く、これ
ら短波長の領域においてはフォトレジストの保護膜等の
用途には用いることができなかった。Furthermore, although photolithography is currently the mainstream semiconductor microfabrication technology, semiconductor elements are also changing from LSI to VL.
The limit of photolithography is said to be 2 to 3 microns due to high density SI, and the development of ultra-fine processing technology is progressing, and far ultraviolet rays are attracting attention along with electron beams and X-rays. Conventionally, in photolithography for manufacturing LSI, the light source is ultraviolet rays (350 to 450 nm).
), but in recent years, technology has been developed to expose ultraviolet light with a short wavelength of about 300 nm or less for the production of highly integrated wafers and chips. However, conventional optical plastics, such as
Polycarbonate, polymethyl methacrylate, etc.
The light transmittance at 300 nm was as low as 50% or less, and it could not be used for applications such as photoresist protective films in these short wavelength regions.
発明が解決しようとする問題点
そこで本発明者らはかかる問題の解決された光学用薄膜
体、特に短波長領域における光透過率の高い光学用薄膜
体を得るために鋭意研究した結果、ジシクロペンタジェ
ンの開環重合体またはその部分水添物からなる樹脂材料
が透明性、耐水性−1耐熱性等に優れ、しかも300n
mの光線透過率が80%以上である光学用薄膜体を与え
ることを見出し本発明を完成するに至った。Problems to be Solved by the Invention The present inventors conducted extensive research in order to obtain an optical thin film body that solved these problems, particularly an optical thin film body with high light transmittance in the short wavelength region. A resin material made of a ring-opened polymer of pentadiene or its partially hydrogenated product has excellent transparency, water resistance -1 heat resistance, etc.
The present invention was completed by discovering that it is possible to provide an optical thin film having a light transmittance of 80% or more.
問題点を解決するための手段
本発明の要旨は、ジシクロペンタジェンの開環重合体ま
たはその部分水添物を構成成分とする光学用薄膜体にあ
る。Means for Solving the Problems The gist of the present invention resides in an optical thin film body comprising a ring-opening polymer of dicyclopentadiene or a partially hydrogenated product thereof.
以下、本発明の構成要素について詳述する。Hereinafter, the constituent elements of the present invention will be explained in detail.
(ジシクロペンタジェンとその水添物)本発明で用いる
ジシクロペンタジェンの開環重合体またはその水添物は
、下記[I]式で表わされる構造単位を有する重合体で
あり、従来から公知の物質である。(例えば特公昭57
−17883号、特開昭53−111399号、特公昭
58−43412号など参照)
(以下余白)
ただし式中工は単結合または二重結合を示す、この開環
重合体は、単量体としてジシクロペンタジェンを使用し
、環状オレフィンの公知の開環重合法により製造するこ
とができる。また、この開環重合体の水素添加物も通常
の水素添加反応法を利用して得ることができる。(Dicyclopentadiene and its hydrogenated product) The ring-opening polymer of dicyclopentadiene or its hydrogenated product used in the present invention is a polymer having a structural unit represented by the following formula [I]. It is a known substance. (For example, Tokuko Sho 57
-17883, JP-A No. 53-111399, JP-B No. 58-43412, etc.) (Left space below) However, where the formula is a single bond or a double bond, this ring-opening polymer can be used as a monomer. It can be produced by a known ring-opening polymerization method for cyclic olefins using dicyclopentadiene. Further, a hydrogenated product of this ring-opened polymer can also be obtained using a conventional hydrogenation reaction method.
(重合触媒)
ジシクロペンタジェンの開環重合体は1通常のフルボル
ネン類の重合法により製造されるが、重合触媒としては
、例えば、ルテニウム、ロジウム、パラジウム、オスミ
ウム、イリジウム、白金などのごとき白金属化合物(例
えば、特公昭46−14910号)、またはチタン、ノ
(ナジウム、モリブデン、タングステンなどの遷移金属
化合物と周期律表手工〜■族の有機金属化合物の系など
が挙げられ、この触媒系に第三成分を組み合わせてもよ
い(例えば、特公昭41−20111号。(Polymerization catalyst) The ring-opening polymer of dicyclopentadiene is produced by the usual polymerization method of fulbornenes, but as a polymerization catalyst, for example, platinum such as ruthenium, rhodium, palladium, osmium, iridium, platinum, etc. These catalyst systems include metal compounds (for example, Japanese Patent Publication No. 46-14910), or systems of transition metal compounds such as titanium, sodium, molybdenum, and tungsten, and organometallic compounds of groups 1 to 2 of the periodic table. may be combined with a third component (for example, Japanese Patent Publication No. 41-20111).
特公昭57−17883号、特公昭57−61044号
、特開昭54−86600号、特開昭58−12772
8号など)。JP 57-17883, JP 57-61044, JP 54-86600, JP 58-12772
No. 8 etc.).
重合触媒は、ジシクロペンタジェンの開環重合が可能な
金属化合物であれば特に制限されないが、好ましくは、
遷移金属化合物と有機金属を含む触媒系あるいは、これ
に分子状酸素、アルコール、エーテル、過酸化物、カル
ボン酸、酸黒水物、酸クロリド、エステル、ケトン、含
窒素化合物、含硫黄化合物、含ハロゲン化合物、分子状
ヨウ素、その他のルイス酸等のごとき第三成分を組み合
わせた触媒系である。The polymerization catalyst is not particularly limited as long as it is a metal compound capable of ring-opening polymerization of dicyclopentadiene, but preferably,
A catalyst system containing a transition metal compound and an organic metal, or a catalyst system containing molecular oxygen, alcohol, ether, peroxide, carboxylic acid, acid black hydrate, acid chloride, ester, ketone, nitrogen-containing compound, sulfur-containing compound, etc. It is a catalyst system that combines a third component such as a halogen compound, molecular iodine, and other Lewis acids.
(溶媒)
開環重合は、溶媒を用いなくても可能であるが、不活性
有機溶媒中でも実施することができる。(Solvent) Ring-opening polymerization can be carried out without using a solvent, but it can also be carried out in an inert organic solvent.
具体例として、ベンゼン、トルエン、キシレンなどの芳
香族炭化水素、n−ペンタン、ヘキサン、ヘプタンなど
の脂肪族炭化水素、シクロヘキサンなどの脂環族炭化水
素、メチレンジクロリド、ジクロルエタン、ジクロルエ
チレン、テトラクロルエタン、クロルベンゼン、ジクロ
ルベンゼン、トリクロルベンゼンなどのハロゲン化炭化
水素等が挙げられ、これらの二種以上を混合して使用し
てもよい。Specific examples include aromatic hydrocarbons such as benzene, toluene, and xylene, aliphatic hydrocarbons such as n-pentane, hexane, and heptane, alicyclic hydrocarbons such as cyclohexane, methylene dichloride, dichloroethane, dichloroethylene, and tetrachlor. Examples include halogenated hydrocarbons such as ethane, chlorobenzene, dichlorobenzene, and trichlorobenzene, and two or more of these may be used in combination.
(組合温度)
IJF!環重合の温度条件については、特に制限はない
が、−20″C〜100℃の任意の温度を選択するのが
通常である。(Union Temperature) IJF! There are no particular restrictions on the temperature conditions for ring polymerization, but any temperature from -20''C to 100C is usually selected.
(重合圧力)
重合圧力の条件は、通常θ〜50Kg/Cゴの範囲から
選択することが好ましい。(Polymerization Pressure) The polymerization pressure condition is usually preferably selected from the range of θ to 50 Kg/C.
(開環重合体)
重合体の極限粘度は、一般に0.O1〜20di/gr
、好ましくは0.1〜5dll/grである。(Ring-opening polymer) The intrinsic viscosity of the polymer is generally 0. O1~20di/gr
, preferably 0.1 to 5 dll/gr.
また、重合するに際し、鎖状のモノオレフィン、鎖状の
非共役ジオレフィン、シクロオレフィン等を添加して1
分子量や物性を調節することもできる。具体例として、
ブテン−1、ペンテン−1、ヘキセン−1,オクテン−
1、ブテン−2、ペンテン−2,1,4−へキサジエン
、シクロペンテン、ノルボルネンなどが挙げられる。In addition, when polymerizing, chain monoolefins, chain non-conjugated diolefins, cycloolefins, etc. are added.
It is also possible to adjust the molecular weight and physical properties. As a specific example,
Butene-1, Pentene-1, Hexene-1, Octene-1
1, butene-2, pentene-2,1,4-hexadiene, cyclopentene, norbornene, and the like.
(水素添加)
本発明で用いる部分水素化物は、前記のごとき開環重合
体を部分水素添加してその二重結合の一部を飽和させた
ものである。経済的な見地からその水添率は、50%未
満であることが好ましい。(Hydrogenation) The partially hydrogenated product used in the present invention is obtained by partially hydrogenating the ring-opened polymer as described above to saturate a portion of its double bonds. From an economic standpoint, the hydrogenation rate is preferably less than 50%.
この開環重合体の水素添加反応は通常の方法により行わ
れる〔例えば特公昭58−43412号参照〕、水素化
触媒としては、オレフィン化合物の水素化に際して一般
に使用されているものであれば使用可能であり、特に制
限されないが、例えば、次のようなものがある。不均一
系触媒としては、ニッケル、パラジウム、白金またはこ
れらの金属をカーボン、シリカ、ケイソウ土、アルミナ
、酸化チタン等の担体に担持させた固体触媒、例えばニ
ッケル/シリカ、ニッケル/ケイソウ土、パラジウム/
カーボン、パラジウム/シリカ、パラジウム/ケイソウ
土、パラジウム/アルミナなどが挙げられる。また、均
一系触媒としては、周期律表第■族の金属を基体とする
もの、例えば、ナフテン酸ニッケル/トリエチルアルミ
ニウム、オクテン酸コバル)/n−ブチルリチウム、ニ
ッケルアセチルアセトネート/トリエチルアルミニウム
などのNi 、Co化合物と周期律表第1−m族金属の
有機金属化合物からなるもの、あるいはRh化合物など
が挙げられる。This hydrogenation reaction of the ring-opening polymer is carried out by a conventional method [see, for example, Japanese Patent Publication No. 58-43412]. As the hydrogenation catalyst, any catalyst commonly used in the hydrogenation of olefin compounds can be used. Examples include, but are not limited to, the following: Examples of heterogeneous catalysts include solid catalysts in which nickel, palladium, platinum, or these metals are supported on a carrier such as carbon, silica, diatomaceous earth, alumina, titanium oxide, etc., such as nickel/silica, nickel/diatomaceous earth, palladium/
Examples include carbon, palladium/silica, palladium/diatomaceous earth, palladium/alumina, and the like. In addition, homogeneous catalysts include catalysts based on metals from group Ⅰ of the periodic table, such as nickel naphthenate/triethylaluminum, cobal(octate)/n-butyllithium, nickel acetylacetonate/triethylaluminum, etc. Examples include those consisting of Ni, Co compounds and organometallic compounds of Group 1-m metals of the periodic table, or Rh compounds.
水素添加反応は、触媒の種類により均−系または不均一
系で、l−150気圧の水素圧下、0〜200℃、好ま
しくは20−150℃で行なわれる。水素添加率は、水
素圧1反応温度1反応時間、触媒濃度などを変えること
によって任意に調節することができる。The hydrogenation reaction is carried out homogeneously or heterogeneously depending on the type of catalyst under a hydrogen pressure of 1-150 atm at a temperature of 0 to 200°C, preferably 20 to 150°C. The hydrogenation rate can be arbitrarily adjusted by changing hydrogen pressure, reaction temperature, reaction time, catalyst concentration, etc.
(任意成分)
本発明においては、開環重合物またはその部分水添物に
紫外線吸収剤等の安定剤を透明性の低下しない範囲にお
いて添加することができる。また、これと相溶する他の
重合体を混合して使用することも可能である。(Optional Components) In the present invention, a stabilizer such as an ultraviolet absorber may be added to the ring-opening polymer or its partially hydrogenated product as long as the transparency does not deteriorate. It is also possible to mix and use other polymers that are compatible with this.
(成形法)
本発明で使用するジシクロペンタジェン開環重合体また
はその部分水添物を光学用薄膜体として成形する方法に
は各種の方法があるが、これらの重合体はトルエン等の
溶剤に可溶性であるため。(Forming method) There are various methods for molding the dicyclopentadiene ring-opening polymer or its partially hydrogenated product used in the present invention into an optical thin film. Because it is soluble in
キャスト法、スピンニート法等の成形方法により成形す
ることができる。一般に、ジシクロペンタジェン樹脂は
熱安定性が悪く、溶融押出成形等の加熱を必要とする成
形法では成形時に着色する傾向が見られる。ところが、
キャスト法やスピンコード法などにより加熱をせずに造
膜すると1着色や劣化のない透明なfi1膜体が得られ
る。しかも、得られた薄膜体は、波長300nmでの光
透過率が80%以上と高く、他の透明性フィルムにない
利点を有する。It can be molded by a molding method such as a casting method or a spin-neat method. In general, dicyclopentadiene resins have poor thermal stability, and tend to be colored during molding in molding methods that require heating, such as melt extrusion molding. However,
If a film is formed without heating by a casting method or a spin cord method, a transparent fi1 film body without coloration or deterioration can be obtained. Furthermore, the obtained thin film has a high light transmittance of 80% or more at a wavelength of 300 nm, which is an advantage that other transparent films do not have.
キャスト成形法に使用できる溶剤としては1例えば、ベ
ンゼン、トルエン、キシレンなどの芳香族炭化水素、n
−ペンタン、ヘキサン、ヘプタンなどの脂肪族炭化水素
、シクロヘキサンなどの脂環族炭化水素、メチレンジク
ロリド、ジクロルエタン、ジクロルエチレン、テトラク
ロルエタン。Examples of solvents that can be used in the cast molding method include aromatic hydrocarbons such as benzene, toluene, and xylene;
- Aliphatic hydrocarbons such as pentane, hexane, heptane, alicyclic hydrocarbons such as cyclohexane, methylene dichloride, dichloroethane, dichloroethylene, tetrachloroethane.
クロルベンゼン、ジクロルベンゼン、トリクロルベンゼ
ンなどのハロゲン化炭化水素等が挙げられ;これらの二
種以上を混合して使用してもよい、樹脂溶液の濃度は薄
膜体の所望の厚みに応じて適宜室めることができるが、
通常、0.1〜50重量%の範囲が好ましい。Examples include halogenated hydrocarbons such as chlorobenzene, dichlorobenzene, and trichlorobenzene; two or more of these may be used in combination, and the concentration of the resin solution may be adjusted as appropriate depending on the desired thickness of the thin film body. You can leave the room, but
Usually, a range of 0.1 to 50% by weight is preferred.
スピンコード法に使用できる溶剤としては、沸点が一6
0〜250℃、好ましくは30〜230℃の有機溶剤で
あり、例えば、ベンゼン、トルエン、キシレンなどの芳
香族炭化水素、シクロヘキサンなどの脂環族炭化水素、
メチレンジクロリド、ジクロルエタン、ジクロルエチレ
ン、テトラクロルエタン、クロルベンゼン、ジクロルベ
ンゼン、トリクロルベンゼンなどのハロゲン化炭化水素
等が挙げられ、これらの二種以上を混合して使用しても
よい。Solvents that can be used in the spin code method have a boiling point of 16
An organic solvent having a temperature of 0 to 250°C, preferably 30 to 230°C, such as aromatic hydrocarbons such as benzene, toluene, and xylene, alicyclic hydrocarbons such as cyclohexane,
Examples include halogenated hydrocarbons such as methylene dichloride, dichloroethane, dichloroethylene, tetrachloroethane, chlorobenzene, dichlorobenzene, and trichlorobenzene, and two or more of these may be used in combination.
樹脂溶液の濃度は、0.01〜50重量%、好ましくは
0.5〜20重量%であり1回転数は。The concentration of the resin solution is 0.01 to 50% by weight, preferably 0.5 to 20% by weight, and the number of revolutions is 1.
10〜10.OOOrpm、好ましくは100〜6、O
OOrpmである。10-10. OOOrpm, preferably 100-6, O
OOrpm.
(用途) −
得られた成形品はコンパクトディスク、ビデオディスク
、コンピュータディスク等の光学記録材料の表面保護膜
の他に透明性、耐湿性、耐熱性等の特性を生かしてフォ
トレジストの保護膜、フォトレジストのキャリアフィル
ム等に用いることができる。特に、本発明の光学用薄膜
体は、300nmの光透過率が80%以上と高いので、
フォトリソグラフィーの超微細加工技術におけるフォト
レジスト保護用膜体等として有用である。(Applications) - The obtained molded product can be used as a surface protective film for optical recording materials such as compact discs, video discs, and computer discs, as well as a protective film for photoresists, taking advantage of its properties such as transparency, moisture resistance, and heat resistance. It can be used as a carrier film for photoresist, etc. In particular, since the optical thin film body of the present invention has a high light transmittance of 80% or more at 300 nm,
It is useful as a protective film for photoresist in ultrafine processing technology of photolithography.
実施例
以下に実施例および参考例を挙げて本発明をさらに具体
的に説明する。EXAMPLES The present invention will be explained in more detail with reference to Examples and Reference Examples below.
参考例1
十分乾燥し窒素置換した1、0文オートクレーブに、脱
水精製したトルエン400m1とジシクロペンタジェン
100mJlを仕込み、これに分子量調節剤として1−
ヘキセン0.37ミリモル。Reference Example 1 400 ml of dehydrated and purified toluene and 100 mJl of dicyclopentadiene were charged into a 1.0-liter autoclave that had been thoroughly dried and purged with nitrogen.
Hexene 0.37 mmol.
六塩化タングステン0.370ミリモル、テトラエチル
スズ0.74ミリモルを加え、室温で5時間重合した0
反応終了後、モノエタノールアミン5mJ1を加え、安
定剤として2.6−ジターシャリブチルフェノール(B
HT)Igを加えた襖、大量のメタノール中に反応液を
投入してポリマーを沈澱させ、真空乾燥することにより
トルエン可溶性のポリマー(ポリマーA)を得た。収率
は62%であった・
得られた重合物のプロトンNMRによる解析の結果、δ
=5.0〜5.4ppmにオレフィン二重結合プロトン
に起因する吸収が認められ、その吸収強度が全プロトン
由来の吸収強度に対する理論値(33,3%)とほぼ一
致したことから、上記ポリマーが開環重合していること
が確認された。この開環重合体のガラス転移温度(’D
SCによる)は129℃であり、25℃トルエン中で測
定した極限粘度は、0.90d立/gであった。0.370 mmol of tungsten hexachloride and 0.74 mmol of tetraethyltin were added and polymerized at room temperature for 5 hours.
After the reaction was completed, 5 mJ1 of monoethanolamine was added, and 2,6-ditertiarybutylphenol (B
The reaction solution was poured into a sliding door containing HT)Ig and a large amount of methanol to precipitate the polymer, followed by vacuum drying to obtain a toluene-soluble polymer (Polymer A). The yield was 62%. As a result of proton NMR analysis of the obtained polymer, δ
= 5.0 to 5.4 ppm, absorption due to olefin double bond protons was observed, and the absorption intensity almost matched the theoretical value (33.3%) for the absorption intensity derived from all protons. It was confirmed that ring-opening polymerization occurred. The glass transition temperature ('D
SC) was 129°C, and the intrinsic viscosity measured in toluene at 25°C was 0.90 d/g.
参考例2
11のオートクレーブに参考例1で得たポリマーAのシ
クロヘキサン溶液(濃度5重量%)40.0gとパラジ
ウムカーボン2gを入れ、反応器内を水素で置換後かく
拌しながら80℃に昇温した0反応器内の温度が一定と
なったところで水素圧を70気圧に昇圧した0反応によ
り消費した水素を補充しながら3時間反応させ、次いで
反応物中の触媒を口過した後、多量の7セトンーイソプ
ロビルアルコール(1: 1)混合溶媒中に反応生成物
を沈殿させ、口過、乾燥した。Reference Example 2 40.0 g of the cyclohexane solution (concentration 5% by weight) of Polymer A obtained in Reference Example 1 and 2 g of palladium carbon were placed in the autoclave No. 11, and after purging the inside of the reactor with hydrogen, the temperature was raised to 80°C with stirring. When the temperature inside the heated zero reactor became constant, the hydrogen pressure was increased to 70 atm, and the hydrogen was reacted for 3 hours while replenishing the hydrogen consumed by the zero reaction.Then, after the catalyst in the reactant was passed through the mouth, a large amount The reaction product was precipitated in a mixed solvent of 7 setone-isopropyl alcohol (1:1), filtered, and dried.
得られた生成物についてプロトンN M R(7) M
析を行ない、オレフィン二重結合プロトンに起因する
吸収(δ=5.0〜5.4ppm)の値の比較から水添
率を算出したところ28%であった。For the product obtained, proton N M R (7) M
Analysis was carried out, and the hydrogenation rate was calculated from a comparison of the values of absorption (δ=5.0 to 5.4 ppm) due to olefin double bond protons, and was found to be 28%.
参考例3
分子量調節剤l−ヘキセンを使用しない以外は、全て参
考例1と同様に反応させポリマー(ポリマーB)を得た
。収率は65%であった。得られた重合物の25℃トル
エン中で測定した極限粘度は、1.35d文/gであっ
た。Reference Example 3 A polymer (Polymer B) was obtained by carrying out the reaction in the same manner as in Reference Example 1 except that the molecular weight regulator 1-hexene was not used. The yield was 65%. The intrinsic viscosity of the obtained polymer measured in toluene at 25° C. was 1.35 db/g.
参考例4
参考例3で得たポリマーBを参考例2と同様に水添した
。得られた生成物の水添率は、30%であった。Reference Example 4 Polymer B obtained in Reference Example 3 was hydrogenated in the same manner as in Reference Example 2. The hydrogenation rate of the obtained product was 30%.
実施例1
参考例1〜4で得たポリマーをトルエンに溶解して5重
量%の溶液とした。この溶液をガラス板上に流した後、
溶剤を除去して塗膜を得た0次に、ガラス板を水中に浸
漬し、超音波振動を与えて膜を剥離し、厚さ15Kmの
フィルムを得た・これらのフィルムの光透過率は、30
0nmで83〜85%であった。Example 1 The polymers obtained in Reference Examples 1 to 4 were dissolved in toluene to form a 5% by weight solution. After pouring this solution onto a glass plate,
The solvent was removed to obtain a coating film. Next, the glass plate was immersed in water and the film was peeled off by applying ultrasonic vibrations to obtain a film with a thickness of 15 km. The light transmittance of these films is , 30
It was 83-85% at 0 nm.
以下に得られたフィルムの物性値を第1表に記す。The physical property values of the obtained film are shown in Table 1 below.
またポリカーポネー) (PC)、ポリメチルメタクリ
レ−) (PMMA)についても同様な成形を行なって
得られたフィルムの物性値を第1表に記す。Table 1 shows the physical properties of films obtained by similar molding of polycarbonate (PC) and polymethyl methacrylate (PMMA).
実施例2
参考例1で得たポリマーを51量%のトルエン溶液とし
、この溶液を800回転(rpm)のガラス板上にスピ
ンニートした0次いで、溶剤を除去し、厚さ5牌mの塗
膜を得た。この塗膜の波長300nmにおける光透過率
は83%であり、Tgは129℃、吸水率は0.03%
、引張強度は520 K g / c rn’、破断伸
びは7%であった。Example 2 The polymer obtained in Reference Example 1 was made into a 51% by weight toluene solution, and this solution was spin-neat on a glass plate at 800 revolutions (rpm).Then, the solvent was removed and a coating with a thickness of 5 meters was prepared. A membrane was obtained. The light transmittance of this coating film at a wavelength of 300 nm is 83%, the Tg is 129°C, and the water absorption is 0.03%.
, the tensile strength was 520 K g/c rn', and the elongation at break was 7%.
以上の実施例から、本発明の薄膜体は、光学用薄膜体と
して充分な性能を有しているといえる。From the above examples, it can be said that the thin film body of the present invention has sufficient performance as an optical thin film body.
発明の効果
本発明により、透明性、耐水性および熱的性質に優れ、
特に短波長領域における光透過性が良好な光学用薄膜体
を得ることができ、この薄膜体はフォトリソグラフィー
等の多くの光学分野に適用できる。Effects of the Invention The present invention provides excellent transparency, water resistance, and thermal properties.
It is possible to obtain an optical thin film having good light transmittance particularly in a short wavelength region, and this thin film can be applied to many optical fields such as photolithography.
Claims (1)
の部分水添物からなり、300nmの光透過率が80%
以上の光学用薄膜体。Consists of a solvent-soluble dicyclopentadiene ring-opening polymer or its partially hydrogenated product, and has a light transmittance of 80% at 300 nm.
The above optical thin film body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6784887A JPS63234201A (en) | 1987-03-24 | 1987-03-24 | Thin film body for optical use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6784887A JPS63234201A (en) | 1987-03-24 | 1987-03-24 | Thin film body for optical use |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63234201A true JPS63234201A (en) | 1988-09-29 |
Family
ID=13356786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6784887A Pending JPS63234201A (en) | 1987-03-24 | 1987-03-24 | Thin film body for optical use |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63234201A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0578822A1 (en) | 1991-03-29 | 1994-01-19 | Nippon Zeon Co., Ltd. | Thermoplastic saturated norbornene resin sheet and production thereof |
-
1987
- 1987-03-24 JP JP6784887A patent/JPS63234201A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0578822A1 (en) | 1991-03-29 | 1994-01-19 | Nippon Zeon Co., Ltd. | Thermoplastic saturated norbornene resin sheet and production thereof |
EP0578822B1 (en) * | 1991-03-29 | 1997-07-23 | Nippon Zeon Co., Ltd. | Thermoplastic saturated norbornene resin sheet and production thereof |
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