JPS63232988A - Electronic-part suction nozzle - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to an electronic component suction nozzle used for Vt bonding of electronic components to a circuit board.

(Prior Art) When mounting electronic components on a circuit board, an electronic component mounting machine is used.

Some of these electronic component mounting machines use suction nozzles to mount components onto circuit boards. However, electronic components come in various sizes, for example, lengths ranging from a little over 2 meters to over 20 seconds,
They range in width from just over 11IIIR to just over 10m), and a single suction nozzle cannot cover them all.

Therefore, conventionally, when mounting electronic components of various sizes on the same circuit board, large, medium, and small components are mounted using separate component mounting machines with their own suction nozzles. Or, you can place a nozzle for large parts, a nozzle for medium-sized parts, and a nozzle for small parts on the same index table, and use them by selecting them according to the size of the electronic parts. The suction part is designed to be detachable so that the suction part can be replaced depending on the size of the electronic component.

(Problem that the invention seeks to solve) However, separate parts! A machine that attaches electronic parts has a major problem in that it takes up a considerable amount of equipment space. Regarding these points, although a structure in which a plurality of index suction nozzles are selected and used is somewhat better, it is still large. Moreover, if the ratio of the MW parts and the ratio of each nozzle do not match, some suction nozzles will go unused (while the index table goes around, some nozzles go unused).

Lastly, although the latter structure in which the suction part is replaced satisfies the requirements of equipment area and utilization of the suction nozzle, the suction part must be replaced every time the size of the part changes.
The efficiency of installing parts was impaired by the amount of time spent on installing and removing them.

This invention was made with attention to these problems, and its purpose is to provide a small electronic component suction nozzle that can freely and efficiently handle electronic components of various sizes. Our goal is to provide the following.

[Structure of the Invention] (Means and Effects for Solving the Problems) The present invention includes suction nozzles having at least large, medium and small inner diameters at their suction ends, which are movable concentrically and axially. A nozzle body is configured, and a protruding/retracting means is provided in the nozzle body for shifting one of the suction nozzles in the axial direction so that its tip protrudes from the tip of the other suction nozzle, and a protruding/recessing means that is applied to the tip of the suction nozzle when picking up parts. A shock absorbing means is provided to reduce the impact, and various large and small nozzles are assembled into a compact single layered structure.

(Example) The present invention will be described below based on an example shown in FIGS. 1 and 2. FIG. 1 shows the entire electronic component suction nozzle, and reference numeral 1 denotes a storage tube formed by providing a lid portion 1b on a tube portion 1a. A nozzle main body 2 is provided in a cylindrical storage chamber within this storage cylinder 1.

The nozzle body 2 includes, for example, a suction nozzle 3 for medium-sized parts (hereinafter referred to as a medium nozzle) having a medium-diameter nozzle tip 3a, and a suction nozzle 4 for small-sized parts (hereinafter referred to as "medium nozzle") having a small-diameter nozzle tip 4a. , small nozzle) is arranged so that it can slide freely,
In addition, the middle nozzle 3 is replaced with a bottomed cylindrical suction nozzle 5 for large parts (
It is a heavy structure that is slidably inserted into the large nozzle (hereinafter referred to as the large nozzle). Note that the overall length of the nozzle is 5 for the large nozzle and 4 for the small nozzle. The middle nozzle 3 is set to be quite long. The nozzle tip G13a of the medium nozzle 3 is slidably arranged in the nozzle protrusion 5a provided in the center of the bottom wall of the large nozzle 5 together with the nozzle tip 4a of the small nozzle 4.
The small nozzle 4 and the medium nozzle 3 can coaxially protrude to the outside. In addition, 5b is the nozzle protrusion C
These are a pair of suction holes of the large nozzle 5 provided on both sides of k+5a. The large nozzle 5 is housed in the storage cylinder 1 along with the medium and small nozzles 3 and 4 so as to be movable along the axial direction.

However, each nozzle 3 to 5 is a groove provided in the peripheral wall.

By engaging the slot and the anti-rotation pin 6 provided in the storage cylinder 1,
It has a structure that allows it to move along the axis without rotating.

On the other hand, a large diameter flange portion 7 is provided at the rear end of the middle nozzle 3.
In addition to the large nozzle 5, a 7 flange portion 7b having a smaller diameter is provided at the rear end of the large nozzle 5. Using these flange parts 7a and 7b, the 7-run 9 part 7a and the flange part 7b are placed between the flange part 7a and a stopper member 8 (which regulates the upper limit position of the middle nozzle 3) installed at the upper part of the storage chamber. Between the flange portion 7b and the flange portion 7b
Air chambers 9a, 9b, and 9c for receiving compressed air are formed between the inner surfaces of the storage cylinder 1 that are in sliding contact with the storage cylinder 1. In addition, a middle nozzle 3. A stepped portion 10a for regulating the lower limit position of the large nozzle 5.

10b is provided. Furthermore, the small nozzle 4 is also provided with a structure for restricting the mobile device. Specifically, the rear end of the small nozzle 4 is provided in the through hole 1 in the center of the stopper member 8.
1, and a compression spring coil 12 is wound around the outer periphery from the large diameter part of the tip of the small nozzle 4 to the stopper member 8, and the upper limit of the small nozzle 4 is compressed. It is regulated by a spring coil 12, and its lower limit is regulated by a rotation stopper 6.

Then, by using the structure for regulating the amount of transfer vJ and the air chambers 9a, 9b, and 9G, any of the large, medium, and small nozzles 3 to 5 is made to protrude from the tip of the nozzle body 2.

That is, the protruding structure (protruding and recessing means), for example, determines the length of the nozzle tip 4a to be the longest, determines the length of the nozzle tip 3a to be slightly shorter than the length of the nozzle tip 4a, and further determines the thickness of the bottom of the large nozzle 5. (Length of suction hole 5b) is determined to be considerably shorter than that of the middle nozzle 3. Also, by locking the rotation stop pin 6,
The lower limit of the small nozzle 4 is determined at a point where the tip side of the nozzle tip 4a protrudes from the tip of the storage cylinder 1, and the step portion 10a.

10b, the lower limits of the medium nozzle 3 and the large nozzle 5 are determined at the point where the tip of the nozzle tip 3a and the tip of the large nozzle 5 protrude from the previous nozzle tip 4a. Then, an external compressed air supply device 14 is connected to each air v9a, 9b, 9c through a passage 13 formed in the wall of the storage cylinder 1 (only the one connected to the air chamber 9b is shown). In addition, a control circuit 15 is connected to the compressed air supply device 14. Then, the control circuit 15 injects compressed air into the lower air chamber 9C when the part is a small part, and injects compressed air into the upper air chamber 9C when the part is a medium sized part, based on a signal indicating the size of the electronic part given from an operation unit or a sensor (none of which is shown). Compressed air is injected into the air W9a, and compressed air with a lower pressure than the compressed air (not shown, but depressurized by the built-in regulation of the device) is injected into the lower air chamber 9C. At this time, control is given to inject compressed air into the middle air chamber 9b, and the small nozzle 4. The medium nozzle 3 degrees and the large nozzle 5 are selectively shifted in the axial direction so that each nozzle end can protrude from the nozzle body 2. In addition, each of the small to large nozzles 3 to 5 has a compression spring coil 12.
With the elastic force of the compressed spring coil 12 and the pressure of the compressed air, the nozzles that have been shifted are held still (means for keeping them still), and the elastic force of the compression spring coil 12 and the compressed air are used as a buffer medium to move each small to large nozzle 3. It also has a structure that cushions the shock applied to the tip of 5 when picking up parts (buffer means).

On the other hand, the peripheral wall of the cylindrical portion 1a is provided with a passage 16 that opens inside the suction holes 5b, 5b, as shown in FIG. In other words, only by protruding the large nozzle 5, the suction hole 5
b, 5b can be opened. The passage 16 and the through hole 11 are connected to an external vacuum pump 17 connected to the till 111 circuit 15 through passages, respectively, and the suction holes 5b, 5 of the large nozzle 5 are
b, Suction hole 3C of medium nozzle 3, Suction hole 4C of small nozzle 4
It is possible to apply vacuum pressure to the

Next, the operation of the electron adsorption nozzle configured as described above will be explained.

When picking up small parts, compressed air is injected into the lower air chamber 9C according to a command from the control circuit 15. As a result, the large nozzle 5 is first pushed upward. Subsequently, the bottom of the large nozzle 5 comes into contact with the stepped part at the tip of the middle nozzle 3,
The medium nozzle 3 is also pushed up, and the nozzle tip 4a of the small nozzle 4 is gradually exposed as shown in FIG.

Then, at the position where the movement of the upper limit of each medium nozzle 3 and large nozzle 5 is restricted, the nozzle tip 4a is exposed to the maximum extent. In other words, only the small nozzle 4 protrudes from the other nozzles.

After this, the protruding nozzle tip 4a along with the housing cylinder 1 is guided to the area where the small electronic components are located, and the vacuum pressure is applied to the suction hole 4CI through the through hole 11, and the small components are suctioned in the same manner as before. It will be possible. Note that after being sucked, the parts are transferred to a circuit board (not shown), and parts are mounted.

However, during this kind of work, the electronic parts are not subjected to much shock when they are picked up, so the work can be done smoothly without any trouble.
(component suction or component mounting).

When picking up a medium-sized part, compressed air is injected into the air W9a, and at the same time, compressed air whose pressure is lower than that of the compressed air is injected into the air chamber 9C.

As a result, the middle nozzle 3 is pushed down, and the nozzle tip 3a projects forward from the nozzle tip 4a of the small nozzle 4. At the same time, the large nozzle 5 is pushed up, and the retreating tip of the large nozzle 5 causes the tip of the middle nozzle 3 to protrude largely from the nozzle body 2, as shown in FIG.

After this, as in the case of the small component, the protruding nozzle tip 3a is guided to the area where the medium-sized electronic component is located, and vacuum pressure is applied to the suction hole 3C to suction the medium-sized component.

Also, when picking up a large component, compressed air is injected into the air chamber 9b. As a result, the middle nozzle 3 is pushed up and the nozzle tip 3a is retracted. At the same time, the large nozzle 5 is pushed down to a position where it comes into contact with the stepped portion 10b, and the tip 5C of the large nozzle 5 protrudes downward from the tip of the small nozzle 4, as shown in FIGS. 2 and 3. .

After that, as before, by guiding the tip of the protruding large nozzle 5 to the area where the large electronic component is located and applying vacuum pressure to the suction holes 5b through the opening passage 16, the large component can be suctioned. become.

Thus, it can be seen that with a compact multilayer structure in which a plurality of nozzles 3 to 5 of different sizes are combined into one cylinder, electronic components of various sizes can be handled freely.

Therefore, the equipment area can be reduced.

Furthermore, since the heavy structure acts as one nozzle to suck in electronic components, it is possible to suppress a decrease in the operating rate relative to the equipment area as in the past. Moreover, it is possible to suction electronic components of various sizes without attaching or detaching the suction part.
No extra time is wasted, and the efficiency of parts mounting can be improved accordingly.

Of course, these effects can be achieved by using compressed air to
It also depends on shifting ~5 in the axial direction.

In one example, three nozzles were polymerized on the same line, but of course more nozzles could be polymerized,
A large number of types (sizes) of electronic components may be handled.

[Effects of the Invention] As explained above, according to the present invention, nozzles of various sizes can be assembled into a compact single layered structure.

Therefore, the equipment area can be reduced.

Moreover, it is possible to suppress a decrease in the operating rate relative to the equipment area. Furthermore, since electronic components of various sizes can be sucked without attaching or detaching the suction section, extra time is not wasted, and the mounting efficiency can be increased accordingly.

[Brief explanation of drawings]

Figures 1 to 4 show one embodiment of the present invention.
The figure is a perspective view showing the overall structure of the electronic component suction nozzle together with the small component suction nozzle in a protruding state; FIG. 2 is a perspective view showing the large component suction nozzle in a protruding state;
The figure is a side sectional view thereof, and FIG. 4 is a perspective view showing a state in which the suction nozzle for medium-sized parts is protruded. 1... Storage cylinder, 2... Nozzle body, 3.4.5...
- Suction nozzle for medium-sized parts, suction nozzle for small parts. Suction nozzle for large parts (@worn nozzle), 7a. 7b, 9a, 9b, 9c, 10a, 10b, 12°14
...Flange part, air seedling first stage part, compressed spring coil, compressed air supply device (protruding and submerging means). Representative Patent Attorney Takehiko Suzue Figure 1 Figure 2 Figure 4

Claims (2)

[Claims] (1) A nozzle body comprising suction nozzles having at least large, medium and small inner diameters at the suction end movable concentrically and axially, and one of the suction nozzles being shifted in the axial direction. An electronic component suction nozzle comprising: a protruding/recessing means for causing a tip to protrude from the tip of another suction nozzle; and a buffering means for mitigating a shock applied to the tip of the suction nozzle when picking up a component. (2) The electronic component suction nozzle according to claim 1, wherein the protruding and recessing means also serves as a means for keeping the suction nozzle still in that state after being shifted.