JPS6322745U - - Google Patents
Info
- Publication number
- JPS6322745U JPS6322745U JP11734486U JP11734486U JPS6322745U JP S6322745 U JPS6322745 U JP S6322745U JP 11734486 U JP11734486 U JP 11734486U JP 11734486 U JP11734486 U JP 11734486U JP S6322745 U JPS6322745 U JP S6322745U
- Authority
- JP
- Japan
- Prior art keywords
- outer rings
- feed screw
- workpiece
- sheet
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11734486U JPS6322745U (lv) | 1986-07-30 | 1986-07-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11734486U JPS6322745U (lv) | 1986-07-30 | 1986-07-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6322745U true JPS6322745U (lv) | 1988-02-15 |
Family
ID=31002766
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11734486U Pending JPS6322745U (lv) | 1986-07-30 | 1986-07-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6322745U (lv) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310438A (ja) * | 2005-04-27 | 2006-11-09 | Towa Corp | 電子部品用のエキスパンド装置 |
-
1986
- 1986-07-30 JP JP11734486U patent/JPS6322745U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310438A (ja) * | 2005-04-27 | 2006-11-09 | Towa Corp | 電子部品用のエキスパンド装置 |
JP4677275B2 (ja) * | 2005-04-27 | 2011-04-27 | Towa株式会社 | 電子部品用のエキスパンド装置 |