JPS63221969A - Work chuck - Google Patents

Abstract

PURPOSE:To follow up the face deflection and vertical motion of a surface plate faithfully, and make polishing pressure regulable as well as to improve the extent of polishing accuracy, by installing a face deflection follow-up part and a vertical motion follow-up part both between a body part, transmitting rotation and a work holding part. CONSTITUTION:This work chuck consists of a work holding part 2 setting a work 1, a face deflection follow-up part 4 absorbing face deflection of a surface plate 3 free of rock motion to this work holding part 2, a vertical motion follow-up part 5 absorbing vertical variations of the work holding part 2 to be connected to an upper end of this face deflection follow-up part 4 and to follow up the surface plate 3, and a body part 6 supporting this vertical motion follow-up part and transmitting the rotation. Therefore, it can be faithfully followed to the face deflection and vertical motion of the surface plate 3 and, what is more, polishing pressure can be regulated with adjustment of a weight 10. In consequence, polishing for the work 1 can be done in a highly accurate manner.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a work chuck used for example in lapping processing.

(Prior Art) Conventionally, as a work chuck for wrapping, one shown in FIG. 2 is known. This workpiece chuck has a workpiece attachment body (C) on which a workpiece (W) is attached and a groove (B) is provided, and a workpiece rotation transmission shaft via a bottle (D) loosely inserted into the groove (B). (E) is engaged. Therefore, the pin (D) has play within the groove (B), and this play allows the workpiece (W) to follow the movement of the lapping surface plate (F).

However, the above-mentioned workpiece chuck has a surface plate (F)
The guidance is insufficient for vertical fluctuations in the workpiece rotation transmission shaft (E).
Since the workpiece adheres to the workpiece (C), it gets caught at the contact portion, making it impossible to obtain flexible movement. Also,
It has the disadvantage that the ability to follow surface runout of the surface plate (F) is insufficient.

Another drawback is that it is impossible to change the processing pressure.

(Problems to be Solved by the Invention) As described above, the present invention has been made by focusing on the drawbacks of conventional workpiece chucks, and provides a workpiece chuck that is highly responsive to fluctuations in the processing surface plate. The purpose is to

[Structure of the invention]

(Means and actions for solving the problem) A workpiece holding part that holds a workpiece, and a runout follower part that is connected to this workpiece holding part and swings the workpiece in an oscillating manner following the surface runout of the surface plate. and a vertical movement follower connected to the surface runout follower to move the workpiece up and down following the vertical movement of the surface plate.

(Example) Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows the workpiece chuck of this embodiment.

This workpiece chuck includes a workpiece holding part (2) to which the workpiece (1) is attached, and a surface that is swingably connected to the workpiece holding part (2) and absorbs the surface runout of the surface plate (3). a runout follower (4); a vertical motion follower (5) that is connected to the upper end of the runout follower (4) and absorbs vertical fluctuations of the workpiece holder (2) that follows the surface plate (3); , this vertical movement following section (
5) and a main body part (6) that supports and transmits rotation. Therefore, the workpiece holding part (2) has a lower end surface that is connected to an adhesive surface (a disc-shaped adhesive plate (8) that acts as a force) to which the workpiece (1) is attached with wax or the like, and this attachment surface. It consists of a disk-shaped protrusion (9) that coaxially protrudes from the upper end surface of the mounting plate (8).This protrusion (9) has a circle for adjusting the polishing pressure if necessary. An annular weight 4 is fitted and placed on the adhesive plate (8).On the other hand, the surface runout follower (4) is a so-called universal joint, and the protrusion (9) It consists of a first piece αυ whose one end is fixed and fixed, and a second piece α whose lower end is connected so that it can move in two degrees of freedom with respect to the first piece αυ. The first piece (11) and the second piece α are swingable in the directions of arrows (4a) and (4b) perpendicular to each other. is the spline shaft α which is fixed to the upper end of the second piece Q2, and this spline shaft a3 is in the axial direction, that is, the arrow (14a)
, (14b), and a locking plate (161) that is connected to the upper end of the spline shaft (13) and locks the spline shaft (13). On the other hand, the main body part (6) has a cylindrical support body (6) in which the spline sleeve Q51 is coaxially fitted and fixed.
17), and a connecting body [l] coaxially protruding from the upper end of the support (17) and connected to the lower end of the rotating shaft bracket. The support body (17) is provided with a hollow portion (17a) that allows vertical movement of the spline axis U.

Next, the operation of the workpiece chuck having the above configuration will be described.

First, the workpiece (1) is attached to the attachment surface (7) with wax. Next, attach a weight 4 whose weight corresponds to the polishing pressure of the workpiece (1) against the surface plate (3) to the adhesive plate (8) with the screw (2).
Fix it using 01... Next, connective body u! Screw J to the rotating shaft (1B) and fix it.
) is placed on the surface plate (31), and then the surface plate (3) and the rotating shaft α ladder are rotated in the four directions indicated by the arrow Qυ.Then, the workpiece (1) is moved to a predetermined position determined by the way draw 0). Polished with a polishing pressure of At this time, the surface plate (3)
If there is a runout in the surface, the workpiece (1) and the bonding plate (8) will also be subjected to swinging pressure following this runout, but this swinging pressure will be applied to the first part of the runout following part (4). It is absorbed by the swing of the piece < 11) relative to the second piece a2 in the directions of arrows (4a) and (4b).

Therefore, the workpiece (1) can faithfully follow the surface runout of the surface plate (3). On the other hand, when the position of the surface plate (3) fluctuates in the vertical direction (direction of arrows (14a) and (14b)), this vertical fluctuation acts as vertical pressure on the workpiece (1) and the adhesive plate (8). It works, but
This vertical pressure is absorbed by vertical movement of the spline shaft α4 in the spline sleeve (15) via the surface runout follower (4). Therefore, the workpiece (1) can faithfully follow the vertical fluctuations of the surface plate (3).

As described above, the workpiece chuck of this embodiment includes the surface runout following section (4) and the vertical motion following section (5), so that
It is possible to faithfully follow the surface runout and vertical movement of the surface plate (3). Further, it has the advantage that the polishing pressure can be adjusted by adjusting the weight OQ.

As a result, the workpiece (1) can be polished with high precision.

In addition, instead of the universal joint, 7 is used in the surface runout following part.
A lexiple joint may also be used. Furthermore, the positions of the surface runout follower (4) and the vertical motion follower (5) are swapped, the vertical motion follower (5) is directly connected to the workpiece holding section (2), and the surface runout follower (4) is connected to the main body. It may be directly connected to (6).

〔Effect of the invention〕

The work chuck of the present invention has a surface runout tracking section and a vertical movement tracking section between the main body section that transmits rotation and the workpiece holding section, so it is possible to faithfully follow the vertical movement and surface runout of the surface plate. can. Furthermore, since the weight can be placed on the workpiece holding section, the polishing pressure can be adjusted. As a result, polishing accuracy is improved by using this workpiece chuck.

[Brief explanation of the drawing]

FIG. 1 is a configuration diagram of a workpiece chuck according to an embodiment of the present invention.
FIG. 2 is an explanatory diagram of the prior art. (1): Workpiece, (2): Workpiece holding section. (3): Surface plate, (4): Surface runout follower. (5): Vertical movement follower, 0@: Weight (weight). Agent Patent Attorney Nori Chika Yudo Kikuo Takehana

Claims (4)

[Claims] (1) A workpiece holder having a workpiece holding surface that holds a workpiece that is in pressure contact with the surface plate, and a workpiece holder that is connected to the upper center of the workpiece holder so that it can swing freely and follow the surface runout of the surface plate. and a vertical motion following section that is connected to the surface runout following section and moves the workpiece up and down in accordance with vertical fluctuations of the surface plate. Work chuck. (2) The work chuck according to claim 1, wherein the surface runout follower is a universal joint. (3) The vertical motion following section has a spline shaft connected to the surface runout following section, and a spline sleeve that supports the spline shaft so as to be movable in the axial direction. Work chuck as described. (4) The workpiece holding portion is formed with a weight placement surface on which a weight is placed.
Work chuck as described in section.