JPS6322006U - - Google Patents
Info
- Publication number
- JPS6322006U JPS6322006U JP1986114700U JP11470086U JPS6322006U JP S6322006 U JPS6322006 U JP S6322006U JP 1986114700 U JP1986114700 U JP 1986114700U JP 11470086 U JP11470086 U JP 11470086U JP S6322006 U JPS6322006 U JP S6322006U
- Authority
- JP
- Japan
- Prior art keywords
- stop lamp
- organic polymer
- polymer resin
- emitting diode
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986114700U JPS6322006U (Direct) | 1986-07-26 | 1986-07-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986114700U JPS6322006U (Direct) | 1986-07-26 | 1986-07-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6322006U true JPS6322006U (Direct) | 1988-02-13 |
Family
ID=30997675
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986114700U Pending JPS6322006U (Direct) | 1986-07-26 | 1986-07-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6322006U (Direct) |
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1986
- 1986-07-26 JP JP1986114700U patent/JPS6322006U/ja active Pending