JPS63216322A - Electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The present invention is an electronic component, more specifically, a metal cap is fitted onto an electronic component element having an electrode on its outer circumferential surface, and used as a cylindrical porcelain capacitor or the like. Regarding electronic parts.

Generally, electronic components such as cylindrical porcelain capacitors are formed by sintering a porcelain element, but due to sintering shrinkage or pressure strain during sintering, the diameter of the porcelain element becomes constant. This is difficult and causes so-called "dispersion." Based on this variation,
This type of electronic component has had the problem of poor fit between the porcelain body and the metal cap.

Therefore, in order to solve the above-mentioned problems in the past, as shown in FIGS. 2 and 3, a plurality of protrusions 2 are formed on the inner circumferential surface of a metal cap 1 in the same circle perpendicular to the axial direction. It has been proposed to arrange them around the circumference.

As mentioned above, a protrusion 2 is placed on the inner circumferential side of the metal cap 1 that is about to be unraveled.
If formed, only these protrusions 2 will come into contact with the porcelain body 3.

On the other hand, an outer surface electrode 4 and an inner surface electrode 5 are formed on the porcelain element 3, as shown in FIG. It is formed so as to extend to the outer peripheral surface side.

By the way, when the length l in the axial direction of the folded electrode part 6 is short, the protrusion 2 does not come into contact with the folded electrode part 6, resulting in a product with zero capacitance. .

Therefore, in order to improve the probability of contact between the protrusion 2 and the folded electrode part 6, it is conceivable to form the protrusion 2 at a position closer to the bottom part la, but in such a case, the metal cap 1 and the porcelain There was a problem in that the strength of the fit with the element body 3 was weakened.

It is also conceivable to increase the length l of the folded electrode portion 6 in order to ensure contact with the protrusion 2, but in such a case there is a problem that the capacitance becomes small.

Furthermore, when fitting the metal cap 1 to the porcelain element 3, the protrusion 2 comes into contact with the end of the porcelain element 3 at the same time, and strong stress is applied to the porcelain element 3. Problems such as cracking and chipping occurred in 3.

The present invention was invented in view of the above-mentioned problems, and provides an electronic component in which a metal cap is fitted to an electronic component element having an electrode on its outer peripheral surface. It is characterized in that a plurality of protrusions are formed on the inner peripheral side surface of the metal cap at different distances from the bottom surface.

According to the above configuration, the metal camp is firmly fitted to the electronic component element due to the protrusion formed further away from the bottom surface, and the protrusion formed closer to the bottom surface This ensures reliable electrical contact with electronic component elements. Further, when fitting the metal cap to the electronic component element, the protrusions do not simultaneously contact the end portion of the electronic component element, and no strong stress is applied to the end portion.

2- Consistent administration Embodiments of the present invention will be described below based on the drawings.

FIG. 1 shows an embodiment of a metal cap 10 according to the present invention, in which the left side in the figure is a bottom portion 10a, and the right side is an opening lOb. The side surface portion 10c has a plurality of (for example, eight) protrusions 11a that protrude toward the axis.
1lb and 11c are formed. These protrusions 11a, llb, and llc are not arranged on the same circumference perpendicular to the axis 0 direction, in other words, the distances from the bottom surface 10a are the same, but the distances from the bottom surface 10a are the same. , for example l,>12>1. They are arranged so that they are different from each other.

When the metal camp 10 configured as described above is fitted onto the porcelain element 3, the bottom part 10 is attached to the porcelain element 3.
The protrusion 11a with a large distance from the bottom part 10a comes into contact first, then the protrusion 11b with an intermediate distance from the bottom part 10a makes contact, and finally the protrusion 11c formed at the position closest to the bottom part 10a comes into contact with the protrusion 11a. We will come into contact with each other. That is, protrusion 1
1a.

The contact between 11b and 11c and the porcelain body 3 is through the opening 10b.
The projections 11a are formed on the end portion 3a of the porcelain body 3 (FIG. 4).

11b, IIC stress does not act all at once. Therefore, when the metal cap 10 is fitted onto the porcelain body 3, problems such as cracking or chipping of the porcelain body end 3a due to the protrusions 11a, llb, and llc do not occur.

Furthermore, when the metal cap 10 is completely fitted, a strong fitting force with the porcelain body 3 is ensured by the protrusion 11a disposed at a large distance from the bottom surface portion 10a. On the other hand, the length of the folded electrode portion 6 formed on the outer peripheral surface of the porcelain body end portion 3a due to the protrusion 11c disposed at a small distance from the bottom surface portion 10a! Even if it is small, reliable electrical contact can be ensured.

In addition, in the above-described embodiment, the protrusions 11a and llb.

11c, the distance from the bottom surface portion 10a is divided into three stages and these projections 11a are shown.

11b, the arrangement position of the IIC is not limited to three stages, but can be set in all two or more stages, and theoretically as many stages as the number of protrusions 1a... to be formed. It is. Further, the electronic component element is not limited to a dielectric material, and the shape is not limited to a cylinder.

Furthermore, as is clear from the above explanation, according to the electronic component according to the present invention, when the metal cap is fitted onto the electronic component element side, a large stress is applied to the end of the electronic component element. This eliminates inconveniences such as cracks and chips in electronic component elements. In addition, it is possible to firmly fit the metal camp to the electronic component element, and the length of the folded electrode part formed at the end of the electronic component element is short (both this electrode part Electrical contact between the cap and the metal cap can be ensured.

[Brief explanation of the drawing]

Figure 1 is a side view of a metal cap showing an embodiment of the present invention, Figure 2 is a side view of a conventional electronic component, Figure 3 is a front view of the metal cap, and Figure 4 is an electronic component. It is a sectional view of an element (porcelain body). 3... Porcelain element (cylindrical dielectric element), 10... Metal cap, 10a... Bottom part, 10C... Side part, 11a, llb, 11c...-Protrusion, 11.l, ,
A...Distance. u

Claims (1)

[Claims] In an electronic component in which a metal cap is fitted to an electronic component element having an electrode on the outer peripheral surface, a plurality of protrusions are formed on the inner peripheral surface of the metal cap at different distances from the bottom surface of the metal cap. An electronic component characterized by: