JPS63213952A - Device for fixing semiconductor - Google Patents

Abstract

PURPOSE:To fix a semiconductor easily in a short time without applying large stress to the semiconductor by inserting a protrusion in a radiator plate into the hole of the semiconductor and holding and fastening the semiconductor between the radiator plate and an insulating plate. CONSTITUTION:A positioning recessed section 12 for a semiconductor 1 and a protruding section 11 protruding to the internal bottom of the recessed section 12 are formed to a radiator plate 2 so that the semiconductor 1 can be fixed stably, the protruding section 11 shaped to the radiator plate 2 is inserted into the hole 13 of the semiconductor 1 in the semiconductor 1 when an insulating plate 4 is coupled with the radiator plate 2 by screws 7, a protruding section 9 and the end surface of the semiconductor 1 are brought into contact and positioned, and one surface of the semiconductor 1 is engaged with the recessed section 12. The semiconductor 1 is fast stuck and fastened between the radiator plate 2 and the insulating plate 4 by clamping and fixing the screws 7. Accordingly, the semiconductor and the radiator plate can be fixed without applying large stress to the semiconductor while mounting work can be simplified, thus largely decreasing the mandays of mounting.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a device for fixing a semiconductor and a heat sink.

BACKGROUND OF THE INVENTION In recent years, printed wiring boards on which electronic components such as semiconductors are mounted have come into widespread use in order to improve the performance of equipment. A conventional semiconductor fixing device will be described below with reference to FIGS. The structure was such that the terminal portion 105 of the semiconductor 101 was fixed to the conductive portion of the insulating plate 104 by soldering. Furthermore, the insulating plate 104
Insulating plate 104 and heat sink 1
02 was fixed with screws 109. Also,? E
As shown in FIG. 6, the semiconductor 101 and the heat sink 102 are kept electrically insulated from each other.
An insulator 106 was inserted and fixed between the two.

Problems to be solved by the invention In such a conventional configuration, the semiconductor 101 and the heat sink 102
The rotational torque generated when fixing the semiconductor 10
This has the problem that stress is applied to the semiconductor 101 and the semiconductor 101 is damaged.

Another problem is that when the insulator 106 inserted to keep the semiconductor 101 and the heat sink 102 electrically insulated is fastened together, it takes time and effort to align the holes provided in each component, which reduces productivity. was there.

The book,',,'ifl fpl solves these problems, and allows the heat sink and semiconductor to be closely fixed without applying large stress to the semiconductor, and can be fixed easily in a short time. The overall purpose is to provide a semiconductor fixing device.

Means to Solve the Problems The present invention is composed of an insulating plate such as a printed wiring board, a semiconductor in a hole, and a heat sink provided with a protrusion. A protrusion is inserted into a hole in the semiconductor, and the entire semiconductor is sandwiched and fixed between the heat sink and the insulating plate.

Function: With this configuration, the semiconductor is positioned at predetermined positions on the heat sink and the insulating plate, and is held by the heat sink and the insulating plate in a tight-fitting manner.

EXAMPLE An example of the present invention will be described below with reference to FIGS. 1 to 4.

In the figure, reference numeral 4 denotes an insulating plate such as a printed wiring board, which has a pattern portion 8 with a half 10 for electrical connection of the terminal portion 5 of the semiconductor 1. A bent terminal portion 6 of the semiconductor 1 is soldered to the soldering pattern portion 8 and fixed to the insulating plate 4. The heat sink 2 has a positioning recess 12 for the semiconductor 1 so that the semiconductor 1 can be stably fixed,
A protrusion 11 that protrudes from the inner bottom of this recess 12 is provided. When the insulating plate 4 is coupled to the heat sink 2 with the screws 7, the protrusion 11 provided on the heat sink 2 of the half-4 body 1 is inserted into the hole 13 of the semiconductor 1, and the protrusion 9 and the semiconductor 1 end are inserted into the hole 13 of the semiconductor 1. are positioned in contact with each other, one side of the semiconductor 1 is engaged with the four parts 12, and by further tightening and fixing the screws 7, the semiconductor 1 is tightly fixed between the heat dissipation plate 2 and the insulating plate 40. Become.

In addition, in order to make the heat sink plate 2 non-metallic, six insulators are placed between the semi-conductor 1 and the heat sink plate 2. When the semiconductor 1 generates heat for a long time, since the semiconductor 1 is tightly bonded to the four parts 12 of the heat sink 2, the heat of the semiconductor 1 is reliably transferred to the heat sink 2, and the heat dissipation of the semiconductor 1 is improved. It is done.

As described above, according to this embodiment, the semiconductor 1 can be tightly fixed to the heat sink 2 by inserting the protrusion 11 provided on the heat sink 2 into the hole 13 of the semiconductor 1 and fixing it to the insulating plate 4. At the same time, the work of attaching the semiconductor 1 and the heat sink 2 becomes easier, and the total attachment time can be significantly reduced.

In this embodiment, the protrusions 11 of the heat sink 2 have a length that does not reach the insulating plate 4, but as shown in FIG. The installation will be more secure if you match the hole 1 of the semiconductor 1.
Any structure may be used as long as the protrusion 11 of the heat sink 2 passes through the insulating plate 4 and the heat sink 2, the semiconductor 1 is placed between the insulating plate 4 and the heat sink 2, and the semiconductor 1 can be tightly fixed to the heat sink 2.

Effects of the Invention As is clear from the description of the embodiments above, according to the present invention, when the protrusion provided on the heat sink is inserted into the hole of the semiconductor and fixed to the heat sink, the semiconductor is insulated from the heat sink. By attaching it between the plates, it is possible to completely fix the semiconductor and the heat sink without applying large stress to the semiconductor.
Since the mounting work is easy, the number of man-hours for mounting can be reduced by an order of magnitude, making it possible to realize a complete semiconductor fixing device.

[Brief explanation of the drawing]

FIG. 1 is a dry side view of a semiconductor fixing device according to an embodiment of the present invention;
FIG. 2 is a sectional view taken along line A-A in FIG. 1, FIG. 3 is a perspective view showing the semiconductor in a semi-fixed state, and FIG. 4 is a sectional view similar to FIG. 2 in another embodiment. , 6 and 6 are cross-sectional views of a conventional semiconductor fixing device. 1... Semiconductor, 2... Heat sink, 4...
...Insulating plate, 7...Protrusion, 13...Hole. Name of agent: Patent attorney Toshio Nakao and 1 other person1-
゛+1 is also shown in Fig. 11--6p Fig. 4

Claims (1)

[Claims] It consists of an insulating plate such as a printed wiring board, a semiconductor having a hole, and a heat sink having a protrusion, the protrusion of the heat sink is inserted into the hole of the semiconductor, and the semiconductor is sandwiched between the heat sink and the insulating plate. Semiconductor fixing device that is closely fixed using