JPS63212470A - Id blade - Google Patents

Id blade

Info

Publication number
JPS63212470A
JPS63212470A JP62043878A JP4387887A JPS63212470A JP S63212470 A JPS63212470 A JP S63212470A JP 62043878 A JP62043878 A JP 62043878A JP 4387887 A JP4387887 A JP 4387887A JP S63212470 A JPS63212470 A JP S63212470A
Authority
JP
Japan
Prior art keywords
blade
layer
metal layer
inner circumferential
cutting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62043878A
Other languages
Japanese (ja)
Inventor
Masaru Takahashi
勝 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Diamond Industrial Co Ltd
Original Assignee
Asahi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Diamond Industrial Co Ltd filed Critical Asahi Diamond Industrial Co Ltd
Priority to JP62043878A priority Critical patent/JPS63212470A/en
Publication of JPS63212470A publication Critical patent/JPS63212470A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12Cut-off wheels
    • B24D5/126Cut-off wheels having an internal cutting edge

Abstract

PURPOSE:To minimize warp or saw mark of an ID blade and to ensure cutting quality by jointing an electrodeposition diamond abrasive grain layer having predetermined cutter depth to the inner circumferential edge of a galvanized metal layer having predetermined depth which covers circular inner circumferential section of a core metal. CONSTITUTION:A galvanized metal layer 23 having depth reducing gradually toward the outer circumferential direction of an ID blade covers circular inner circumferential section of a core metal 1. A diamond abrasive grain layer 24 having predetermined depth is deposited onto the inner circumferential edge of the galvanized metal layer 23 to prepare a desired ID blade. Here, the metal layer 23 is homogeneous and there is no local point on both side faces where the stress is not uniform, thereby ID blade does not bend nor warp and insufficient cutting quality can be avoided. Furthermore, since the metal layer 23 and the abrasive grain layer 24 are narrow,contacting area of cutting material with cutting face is reduced thereby unnecessary friction is reduced and occurrence of saw mark can be suppressed.

Description

【発明の詳細な説明】 [産業上の利用分野コ IDブレードは第3図のように、円環状の金属薄板(コ
アメタル)1の内周2に沿ってダイヤモンド砥石層3を
設けた工具で、周縁部で保持して太鼓の皮のように張上
げ、高速回転して内周3で切断を行う。半導体などの素
材を精密切断して薄板とするに適する。本発明はこの種
のIDブレードに係わるものである。
[Detailed Description of the Invention] [Industrial Application Field] As shown in FIG. 3, an ID blade is a tool having a diamond grinding wheel layer 3 along the inner circumference 2 of an annular thin metal plate (core metal) 1. It is held at the periphery and stretched up like the skin of a drum, rotated at high speed, and cut at the inner periphery 3. Suitable for precision cutting materials such as semiconductors into thin plates. The present invention relates to this type of ID blade.

[従来の技術] ダイヤモンド砥石層3は周知の電着法により製作される
。第4図は電着法によるIDブレード内周部の断面構造
で、コアメタル1に接するダイヤモンド砥粒5が、メッ
キ金属6により固定されている。砥粒の単層を作ること
が電着法の特長である。
[Prior Art] The diamond grinding wheel layer 3 is manufactured by a well-known electrodeposition method. FIG. 4 shows a cross-sectional structure of the inner periphery of the ID blade formed by electrodeposition, in which diamond abrasive grains 5 in contact with core metal 1 are fixed by plated metal 6. A feature of the electrodeposition method is that it creates a single layer of abrasive grains.

刃先部7に連続して側面に延びる部8は、電着ダイヤモ
ンド砥石層とコアメタル1との接合面積を十分にして砥
石層の剥離を防ぐに有効である。また被切断材の切断面
にコアメタルが接触して摩擦することを防ぐ「逃げ」を
作り、しかも砥石層8は単層でその厚さVは砥粒径相当
であるため、切断刃の厚さUは極めて薄い。しかし切断
作用を働く刃先部7もまt二重層であるためにIDブレ
ードの寿命が制限されることが、第4図の電着構造の欠
点とされる。なお側面の砥石層8は切断の過程において
被切断材の切断面を研磨仕上げする効用があるとも言わ
れれるが、逆に切断面に無用の研削作用を及ぼして挽目
(ソーマーク)を作る害もある。
The portion 8 extending to the side surface continuously from the cutting edge portion 7 is effective in ensuring a sufficient bonding area between the electrodeposited diamond grindstone layer and the core metal 1 and preventing separation of the grindstone layer. In addition, a "relief" is created to prevent the core metal from coming into contact with the cut surface of the material to be cut and causing friction, and since the grinding wheel layer 8 is a single layer and its thickness V is equivalent to the diameter of the abrasive grain, the thickness of the cutting blade is U is extremely thin. However, a drawback of the electrodeposition structure shown in FIG. 4 is that the life of the ID blade is limited because the blade edge 7 that performs the cutting action is also a double layer. It is said that the grindstone layer 8 on the side has the effect of polishing the cut surface of the material to be cut during the cutting process, but on the other hand, it exerts an unnecessary grinding action on the cut surface and creates saw marks. There is also.

ダイヤモンド電着層を単層にとどまらず厚く堆積させる
ことも可能であるが、厚さの必要な刃先部7ばかりでな
く側面部8も厚くなり、V従って刃厚Uが徒に大きくな
る。この不都合を避けて刃先部のみを深くしたものがい
わゆる複層型のIDブレードで、第5図はその製法を模
式的に示す、第4図のIDブレード10を絶縁体の板1
1,12で挟んで側面の成長を阻み、切断刃の厚さUに
等しい間隙13にダイヤモンド砥粒14をメッキ金属で
固定して第27iJ16を造成する。すなわち従来の電
着法で第1層を完成したIDブレードに追加工をするも
ので、改めて板11.12を用いて装置を組み立てる手
数を要し、この作業の間第1層がメッキ液から空気中に
出されて表面が変質し、その上に造成した第2層との接
合を阻害し、接合面17で剥離し易い傾向がある。
Although it is possible to deposit the diamond electrodeposited layer thickly rather than just a single layer, not only the blade edge portion 7, which requires a thickness, but also the side surface portion 8 become thicker, and V and therefore the blade thickness U become unnecessarily large. A so-called multi-layer ID blade is one in which only the cutting edge is deepened to avoid this inconvenience, and FIG. 5 schematically shows its manufacturing method.
1 and 12 to prevent growth of the side surfaces, and diamond abrasive grains 14 are fixed with plated metal in a gap 13 equal to the thickness U of the cutting blade, thereby forming No. 27iJ16. In other words, additional processing is performed on the ID blade whose first layer has been completed using the conventional electrodeposition method, which requires time and effort to reassemble the device using plates 11 and 12, and during this process, the first layer is removed from the plating solution. When exposed to the air, the surface changes in quality, inhibits bonding with the second layer formed thereon, and tends to peel off at the bonding surface 17.

第2層のダイヤモンド砥粒を第1層とは粒度の異なるも
のとする、あるいは第1層をダイヤモンドを含まぬメッ
キ金属のみとするなどの改良もあり、それぞれに効果は
認められたが、複層のIDブレードにおいては、2度の
電着工程に起因する剥離の問題は避けられない。
Improvements have been made, such as using diamond abrasive grains in the second layer with a different particle size from those in the first layer, or making the first layer only plated metal that does not contain diamonds, and each has been found to be effective. In layered ID blades, peeling problems due to the two-step electrodeposition process are unavoidable.

IDブレードが張上げられた緊張状態では、第3図の内
周円2に沿って引張り応力が作用する。砥石部3は上述
のようにコアメタル1よりも厚いのでより強い引張9に
耐え、これが薄いIDブレードが張上げにより平坦を保
つに寄与する。
When the ID blade is in a tensioned state, tensile stress acts along the inner circumferential circle 2 in FIG. 3. As described above, the grinding wheel portion 3 is thicker than the core metal 1, so it can withstand a stronger tension 9, which contributes to the thin ID blade keeping flat when tensioned.

従来のIDブレードにおいては、砥石層は、メッキ金属
によりこれとは甚だしく異質のダイヤモンド粒を包囲し
て固定した構造であり、またダイヤモンド粒の形状は一
様ではなく分散の均一も期待されないので、緊張状態で
は内部応力は複雑な分布となる。引張応力が集中した局
部に微小クラックが発生し、発達、伝播して■Dブレー
ド破断に導く危険を内蔵する。また側面の砥石層8の内
部応力が表裏で等しくない局所では、IDブレードの板
面が局部的に弯曲する。弯曲は微小で観察されない程度
であっても、切断抵抗によって助長されて切断を傾いた
方向に導き、切断の進行とともに傾きを増すので、切断
された薄板の反りの原因となる。ソーマークなどの切断
面不良もこの原因によると考えられる。
In conventional ID blades, the grinding wheel layer has a structure in which diamond grains, which are extremely different from the above, are surrounded and fixed by plated metal, and the shape of the diamond grains is not uniform and uniform dispersion is not expected. Under tension, internal stress has a complex distribution. There is a built-in risk that microcracks will occur in localized areas where tensile stress is concentrated, develop and propagate, and lead to ■D blade breakage. In addition, in areas where the internal stress of the side grindstone layer 8 is not equal on the front and back sides, the plate surface of the ID blade is locally curved. Even if the curvature is so small that it cannot be observed, it is encouraged by the cutting resistance and guides the cutting in an oblique direction, and the inclination increases as the cutting progresses, causing warping of the cut thin plate. This is thought to be the cause of cut surface defects such as saw marks.

IDブレードは多年にわたり改良が重ねられて性能は向
上しているが、上述のようになお問題を残している。す
なわち(1)刃先部が単層では寿命が短かく、複層では
製・造工程が複雑で、しかも剥離のおそれがある。(2
)電着法によるコアメタル補強効果が完全でなくかえっ
て破断のおそれがある。(3)反り、ソーマークなどの
切断品質不良が除かれない。
Although ID blades have been improved over the years to improve their performance, they still have problems as discussed above. Namely, (1) a single-layer blade edge has a short life, and a multi-layer blade requires a complicated manufacturing process, and there is a risk of peeling. (2
) The reinforcing effect of the core metal by electrodeposition is not perfect and there is a risk of breakage. (3) Cutting quality defects such as warping and saw marks cannot be removed.

[発明が解決しようとする問題点コ 本発明の課題は前記のような難点のないIDブレードを
提供することにある。
[Problems to be Solved by the Invention] An object of the present invention is to provide an ID blade that does not have the above-mentioned difficulties.

[問題点を解決するための手段] 本発明の手段はコアメタルの内周内部を覆って、外周方
向に漸移的に厚さを減ずるメッキ金属層と、その内周縁
に接合する所定刃厚の電着ダイヤモンド砥石層とからな
るものである。
[Means for Solving the Problems] The means of the present invention includes a plated metal layer that covers the inner periphery of the core metal and whose thickness gradually decreases in the outer periphery direction, and a blade of a predetermined thickness that is bonded to the inner periphery of the plated metal layer. It consists of an electrodeposited diamond grinding wheel layer.

[実 施 例コ 第1図は本発明に係るIDブレードの内周、刃先部の断
面構造である。コアメタル1は従来に等しい。23はダ
イヤモンド砥粒を含まないメッキ金属層で、その上端(
内周縁)にダイヤモンド砥粒を含む砥石層24がある。
Embodiment FIG. 1 shows a cross-sectional structure of the inner periphery and cutting edge of an ID blade according to the present invention. Core metal 1 is the same as before. 23 is a plated metal layer that does not contain diamond abrasive grains, and its upper end (
There is a grindstone layer 24 containing diamond abrasive grains (inner peripheral edge).

金属層23は外周方向(図の下方)に次第に厚さを減じ
た斜面である。
The metal layer 23 is a slope whose thickness gradually decreases in the outer circumferential direction (downward in the figure).

第2図は本発明の詳細な説明する一部断面図である。コ
アメタル1に対し所定の間隔Vを保って絶縁板21,2
2を配し、陽極をコアメタル内周円の中、すなわち図の
上方に置いて、まずダイヤモンドなしでメッキを行う。
FIG. 2 is a partially sectional view illustrating the present invention in detail. Insulating plates 21 and 2 are placed at a predetermined distance V from the core metal 1.
2, and the anode is placed inside the inner circumferential circle of the core metal, that is, above the figure, and plating is first performed without diamond.

コアメタルの内周部にはメッキ金属層23が成長するが
、僅かな間隙Vの奥には金属イオンが到達し難いためメ
ッキ層の成長は遅く、図の23の断面形状となる。この
状態でメッキ液中にダイヤモンド砥粒を投入して、引続
き通電すれば任意の深さXまで砥石層24を成長させる
ことができる。
A plated metal layer 23 grows on the inner periphery of the core metal, but since it is difficult for metal ions to reach the depths of the small gap V, the growth of the plated layer is slow, resulting in a cross-sectional shape 23 in the figure. In this state, by putting diamond abrasive grains into the plating solution and continuing to apply electricity, the abrasive layer 24 can be grown to an arbitrary depth X.

[作   用] 本発明のIDブレードは砥石層24の深さXを第4図の
単層量よりもはるかに大きくすることができるので寿命
は長い。砥石FJ24を作成する工程は、メッキ液に浸
漬したまま金属のみの層23の作成に引続いて行われ空
気中に出すことがないので、両層は連続して電解析出し
tこ金属層で構成され、境界面25で剥離するなどの欠
陥はない。
[Function] The ID blade of the present invention has a long life because the depth X of the grindstone layer 24 can be made much larger than the single layer amount shown in FIG. The process of creating the grinding wheel FJ24 is carried out after the creation of the metal-only layer 23 while immersed in the plating solution and is not exposed to the air, so both layers are continuously electrolytically deposited. There are no defects such as peeling at the interface 25.

コアメタル1の内周円2のみでなく両側面にまで金属層
23は連続しているので、コアメタル1と金属層23と
の接合面積は十分で剥離を防止することは第4,5図の
従来品と等しい。
Since the metal layer 23 is continuous not only on the inner circumferential circle 2 of the core metal 1 but also on both side surfaces, the bonding area between the core metal 1 and the metal layer 23 is sufficient to prevent peeling, unlike the conventional method shown in FIGS. equal to goods.

またこの部の総厚さはコアメタル1の厚さtこ金属層2
3の厚さが追加されるので張力に耐える強さが補強され
る点も従来と等しいが、コアメタル1に接合する金属層
23はダイヤモンド砥粒を含まず均質であるから、ID
ブレードを破断に導く局部的応力実生はなく、補強効果
は完全である。
Also, the total thickness of this part is the thickness of the core metal 1 and the metal layer 2.
3 is added, so the strength to withstand tension is reinforced, which is the same as before, but since the metal layer 23 bonded to the core metal 1 is homogeneous and does not contain diamond abrasive grains, ID
There are no local stress seedlings that lead the blade to break, and the reinforcing effect is complete.

金属層23が均質であることから、両側面に応力差のあ
る局所はな(、シたがってIDブレード板面の弯曲と、
これに起因する反りなどの切断品質不良が避けられる。
Since the metal layer 23 is homogeneous, there are no local areas where there is a stress difference on both sides (therefore, the curvature of the ID blade plate surface,
Poor cutting quality such as warpage caused by this can be avoided.

切断刃の厚さUの部は、従来は第4図Wの幅の円環であ
ったが、本発明のIDブレードで1まWよりもはるかに
狭い幅Xに過ぎない。すなわち被切断材の切断面に接す
る面積が小さいので無用の摩擦が軽減され、ソーマーク
の発生も抑制される。
The thickness U of the cutting blade has conventionally been an annular ring with a width shown in FIG. That is, since the area in contact with the cut surface of the material to be cut is small, unnecessary friction is reduced and the generation of saw marks is also suppressed.

[効   果] 以上説明したように、本発明のIDブレードは単層構造
の従来品よりもはるかに長く、従来の複層構造のものと
同等あるいは以上で、しかも後者の欠点とする剥離のお
それがない。また電解析出した金属層によるコアメタル
の補強効果を損う因子がないので、破断することな(強
く張上げることができ、さらに反り、ソーマークなどを
極小として切断品質が保証される。すなわち本発明は従
来の間啄点を一掃したIDブレードを提供できる。
[Effects] As explained above, the ID blade of the present invention is much longer than the conventional product with a single layer structure, is equivalent to or longer than the conventional product with a multilayer structure, and is free from the risk of peeling, which is a drawback of the latter. There is no. In addition, since there is no factor that impairs the reinforcing effect of the core metal by the electrolytically deposited metal layer, it can be stretched strongly without breaking, and the cutting quality is guaranteed by minimizing warping, saw marks, etc. In other words, the present invention can provide an ID blade that eliminates the conventional shortcomings.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係るIDブレードの一部断面図、第2
図は本発明のIDブレードの製法説明図、第3図は従来
のIDブレードの側面図、第4図は電着法によるIDブ
レード内周部の断面図、第5図は従来の複層型IDブレ
ードの製造法の模式的説明図である。 1・・・コアメタル 23・・・メッキ金属1f  2
4・・砥石層
FIG. 1 is a partial sectional view of an ID blade according to the present invention, and FIG.
The figure is an explanatory diagram of the manufacturing method of the ID blade of the present invention, Figure 3 is a side view of a conventional ID blade, Figure 4 is a sectional view of the inner peripheral part of the ID blade made by electrodeposition, and Figure 5 is a conventional multilayer type. It is a typical explanatory view of the manufacturing method of ID blade. 1... Core metal 23... Plated metal 1f 2
4. Grindstone layer

Claims (1)

【特許請求の範囲】[Claims] コアメタルの内周内部を覆って、外周方向に漸移的に厚
さを減ずるメッキ金属層と、その内周縁に接合する所定
刃厚の電着ダイヤモンド砥石層とからなるIDブレード
An ID blade consisting of a plated metal layer that covers the inner periphery of a core metal and whose thickness gradually decreases toward the outer periphery, and an electrodeposited diamond grindstone layer of a predetermined blade thickness that is bonded to the inner periphery of the plated metal layer.
JP62043878A 1987-02-26 1987-02-26 Id blade Pending JPS63212470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62043878A JPS63212470A (en) 1987-02-26 1987-02-26 Id blade

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62043878A JPS63212470A (en) 1987-02-26 1987-02-26 Id blade

Publications (1)

Publication Number Publication Date
JPS63212470A true JPS63212470A (en) 1988-09-05

Family

ID=12675960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62043878A Pending JPS63212470A (en) 1987-02-26 1987-02-26 Id blade

Country Status (1)

Country Link
JP (1) JPS63212470A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996023630A1 (en) * 1995-02-01 1996-08-08 Hiroshi Ishizuka Superabrasive electroplated cutting edge and method of manufacturing the same
JP2014003185A (en) * 2012-06-19 2014-01-09 Disco Abrasive Syst Ltd Cutting blade and cutting method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996023630A1 (en) * 1995-02-01 1996-08-08 Hiroshi Ishizuka Superabrasive electroplated cutting edge and method of manufacturing the same
US6098609A (en) * 1995-02-01 2000-08-08 Ishizuka; Hiroshi Superabrasive electrodeposited cutting edge and method of manufacturing the same
JP2014003185A (en) * 2012-06-19 2014-01-09 Disco Abrasive Syst Ltd Cutting blade and cutting method

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