JPS63210071A - Sheet for burning ceramic - Google Patents
Sheet for burning ceramicInfo
- Publication number
- JPS63210071A JPS63210071A JP62042070A JP4207087A JPS63210071A JP S63210071 A JPS63210071 A JP S63210071A JP 62042070 A JP62042070 A JP 62042070A JP 4207087 A JP4207087 A JP 4207087A JP S63210071 A JPS63210071 A JP S63210071A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- sheet
- substrate
- fiber
- firing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims description 38
- 238000010304 firing Methods 0.000 claims description 20
- 239000000843 powder Substances 0.000 claims description 18
- 239000000835 fiber Substances 0.000 claims description 16
- 239000012784 inorganic fiber Substances 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 35
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000395 magnesium oxide Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229920000126 latex Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 241000397794 Onitis Species 0.000 description 1
- 229920001131 Pulp (paper) Polymers 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- 229920002522 Wood fibre Polymers 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- INJRKJPEYSAMPD-UHFFFAOYSA-N aluminum;silicic acid;hydrate Chemical compound O.[Al].[Al].O[Si](O)(O)O INJRKJPEYSAMPD-UHFFFAOYSA-N 0.000 description 1
- 229910001570 bauxite Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229910052850 kyanite Inorganic materials 0.000 description 1
- 239000010443 kyanite Substances 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000661 sodium alginate Substances 0.000 description 1
- 235000010413 sodium alginate Nutrition 0.000 description 1
- 229940005550 sodium alginate Drugs 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 239000002025 wood fiber Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
Landscapes
- Porous Artificial Stone Or Porous Ceramic Products (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
発明の目的
(産業上の利用分野)
本発明は一般的なセラミック製品の焼成にも利用できる
が、特に電子a器用マイクロ回路基板に使用されるセラ
ミック焼成用シートに関するものである。[Detailed Description of the Invention] Purpose of the Invention (Field of Industrial Application) Although the present invention can be used for firing general ceramic products, it particularly relates to a ceramic firing sheet used for microcircuit boards for electronic A devices. It is.
(従来の技術)
従来、回路基板はセラミック台板上にアルミナ基板、コ
ンデンサ基板等の基板を載置し、同基板を多段に積層し
て同基板の間に機械又は手作業で高融点酸化物の粉末粒
子を散布し、これを焼成したものが使用されていた。こ
の方法においては、高融点酸化物の粉末粒子が均一に分
散されず、基板のそりやうねり、基板同士の付着が起き
るため、満足な回路基板は得られなかった。しかも、製
造工程が増加してコスト高になっていた。(Prior art) Conventionally, circuit boards have been made by placing substrates such as alumina substrates and capacitor substrates on a ceramic base plate, stacking the same substrates in multiple stages, and applying high melting point oxide between the substrates by machine or hand. The product was used by sprinkling powder particles and firing the powder. In this method, the powder particles of the high melting point oxide are not uniformly dispersed, causing warping and waviness of the substrate, and adhesion of the substrates to each other, so that a satisfactory circuit board cannot be obtained. Moreover, the number of manufacturing steps increases, resulting in higher costs.
このような欠点を改良するために、可燃性の紙又は有機
樹脂系シートの表面に敷粉として酸化マグネシウム、二
酸化珪素、アルミナ、二酸化ジルコニウム等の粉末を分
散状態で付着させたシートを上記アルミナ基板、コンデ
ンサ基板の間に挿入する方法が提案されている(特開昭
57−122282号公報)。In order to improve these defects, a sheet of combustible paper or organic resin sheet with dispersed powders of magnesium oxide, silicon dioxide, alumina, zirconium dioxide, etc. adhered to the surface of the alumina substrate is used. A method of inserting the capacitor between capacitor boards has been proposed (Japanese Patent Laid-Open No. 122282/1982).
(発明が解決しようとする問題点)
ところが、このようなシートを用いる方法においても敷
粉散布の場合と同様に焼成後敷粉が基板に付着するの、
で一旦水中に浸して敷粉をとり除く必要があり、そのた
め製造工程が増え製造コストが高くなるという問題点が
ある。(Problems to be Solved by the Invention) However, even in the method using such a sheet, as in the case of spreading powder, the powder adheres to the substrate after baking.
Then, it is necessary to remove the bedding powder by soaking it in water, which increases the number of manufacturing steps and increases the manufacturing cost.
発明の構成
(問題点を解決する手段)
本発明は前記問題点を解決するために、非晶質無機ファ
イバーからなる材料を薄板状に成形するという構成を採
用している。Structure of the Invention (Means for Solving the Problems) In order to solve the above-mentioned problems, the present invention employs a structure in which a material made of amorphous inorganic fiber is molded into a thin plate shape.
ここで非晶質無機ファイバーからなる材料とは、非晶質
無機ファイバーとその他の材料からなるものをいう。Here, the material made of amorphous inorganic fiber refers to a material made of amorphous inorganic fiber and other materials.
上記非晶質無機ファイバーとは、非結晶性のものであっ
てセラミックファイバー、ガラスファイバー等をいう。The above-mentioned amorphous inorganic fiber is non-crystalline and includes ceramic fiber, glass fiber, and the like.
例えばセラミックファイバーは天然のアルミナ・シリカ
組成物、カオリン、ボーキサイト、カヤナイト、耐火粘
土等を電気融解し、その細粒を高圧の空気又は蒸気で吹
き飛ばして繊維化したものである。For example, ceramic fibers are made by electrically melting natural alumina-silica compositions, kaolin, bauxite, kyanite, fireclay, etc., and blowing the fine particles out with high-pressure air or steam to form fibers.
また、その他の材料として(よセラミック焼成用敷粉と
しての無機粉末、有機繊維、有機結合剤等をいう。In addition, other materials include inorganic powder, organic fiber, organic binder, etc. used as a powder for ceramic firing.
セラミック焼成用敷粉としては、従来から知られている
アルミナ、ジルコニア、マグネシア、シリカ等の粉末が
使用される。それらの粒径は数十〜数百μm程度である
。有機繊維としては木材パルプ、合成パルプ等があげら
れる。また、有機結合剤としては天然及び合成の糊料例
えば天然糊料としてはデンプン、ゼラチン、アルギン酸
ソーダ、ゴムラテックス、合成糊料としてはアクリル系
樹脂、合成ラテックス、カルボキシメチルセルロース(
CMC) 、メチルセルロース等があげられる。As the ceramic firing powder, conventionally known powders of alumina, zirconia, magnesia, silica, etc. are used. Their particle size is on the order of tens to hundreds of micrometers. Examples of organic fibers include wood pulp and synthetic pulp. Examples of organic binders include natural and synthetic glues, such as starch, gelatin, sodium alginate, and rubber latex; examples of synthetic glues include acrylic resins, synthetic latex, and carboxymethyl cellulose (
CMC), methylcellulose, etc.
そして、前記非晶質無機ファイバーシートの厚さは0.
OL=10mn+の範囲が適当である。0.01mm未
満では基板同士が付着しやすく、シート化も国運であり
、10mn+を超えても性能は向上せず、かえって製造
コストが高くなる。The thickness of the amorphous inorganic fiber sheet is 0.
A range of OL=10 mn+ is appropriate. If the thickness is less than 0.01 mm, the substrates tend to adhere to each other, and sheeting is also a problem; if it exceeds 10 mm+, the performance will not improve and the manufacturing cost will increase.
また、非晶質無機ファイバーを成形してシートにする方
法としては、木材繊維から紙を抄く常法の技術が採用さ
れる。Furthermore, as a method for forming amorphous inorganic fibers into sheets, a conventional technique for making paper from wood fibers is employed.
(作用)
前記構成を採用したことにより、焼成時非晶質無機ファ
イバーを成形してなるシートとアルミナ基板やコンデン
サ基板等の基板との結晶状態の相違により基板間の付着
性がなく、基板間の反応が防止されるとともに、上記シ
ートを基板より剥離することも容易にできる。(Function) By adopting the above configuration, there is no adhesion between the substrates due to the difference in crystalline state between the sheet made of amorphous inorganic fibers and the substrate such as an alumina substrate or a capacitor substrate during firing, and there is no adhesion between the substrates. reaction is prevented, and the sheet can be easily peeled off from the substrate.
(実施例1)
以下に本発明を具体化した一実施例を図面を用いて説明
する。(Example 1) An example embodying the present invention will be described below with reference to the drawings.
図に示すように焼成用セラミック台板3上には、セラミ
ックファイバーシート2を介して未焼成セラミツク基板
lが積層されている。同未焼成セラミツク基板lは10
段に積層されている。As shown in the figure, an unfired ceramic substrate 1 is laminated on a ceramic base plate 3 for firing with a ceramic fiber sheet 2 interposed therebetween. The unfired ceramic substrate l is 10
Laminated in tiers.
未焼成セラミツク基板lは市販の厚さ1III11のア
ルミナ基板を使用した。その組成は次のとおりである。As the unfired ceramic substrate 1, a commercially available alumina substrate having a thickness of 1III11 was used. Its composition is as follows.
八ho396重量%、Ti0□ 2.0重量%5iOz
1.0重量%、MgO0,8重量%Cr2O,0,
2重ht%
上記セラミックファイバーシート2は、市販のセラミッ
クファイバーを用い、紙を抄紙する常法によりシート化
される。即ち、同シート化は湿シートを形成する抄き綱
部、同シートを脱水する脱水部及び乾燥部からなる紙抄
き機と同様の設備によって行われる。このようにして得
られたシートは、紙状で厚さが均一であり、必要な任意
の厚さに抄きあげることも可能である。8ho396% by weight, Ti0□ 2.0% by weight 5iOz
1.0% by weight, MgO0.8% by weight Cr2O,0,
Double ht% The ceramic fiber sheet 2 is formed into a sheet by a conventional method of paper making using commercially available ceramic fibers. That is, the sheeting is performed using equipment similar to a paper machine, which includes a paper rope section that forms a wet sheet, a dewatering section that dewaters the sheet, and a drying section. The sheet thus obtained is paper-like and has a uniform thickness, and can be made to any desired thickness.
そして、セラミックファイバーシート2は未焼成セラミ
ツク基板lと同一の形状に打ち抜くことによって形成し
た。その厚さは0 、25n+n+で5Qg/mであっ
た。The ceramic fiber sheet 2 was formed by punching into the same shape as the green ceramic substrate 1. Its thickness was 0.25n+n+ and 5Qg/m.
前記のような積層体を約1600℃で2時間焼成した。The laminate as described above was fired at about 1600° C. for 2 hours.
そして、焼成済の回路基板を得た。Then, a fired circuit board was obtained.
なお、前記焼成用セラミック台板3は市販のもので、厚
さ約15mmのアルミナ類のものを使用した。また、前
記未焼成セラミツク基板lは焼成することによって20
%程度収縮するが、セラミックファイバーシート2もそ
れに追随するものであった。The ceramic base plate 3 for firing is a commercially available one, and is made of alumina and has a thickness of about 15 mm. Further, the unfired ceramic substrate l can be heated to 20% by firing.
%, but ceramic fiber sheet 2 also followed this shrinkage.
このようにして得られた回路基板は、セラミックファイ
バーシート2とその両面に隣接するセラミ・ツク基板l
との間の付着がなく、従ってセラミック裁板I同士の付
着、反応がない。The circuit board thus obtained consists of a ceramic fiber sheet 2 and a ceramic substrate l adjacent to both sides of the ceramic fiber sheet 2.
Therefore, there is no adhesion or reaction between the ceramic cut plates I.
また、敷粉を使用していないので、敷粉のかたよりによ
る基板のそりやうねりがなく、基板を剥1)1tする場
合水に浸漬する必要がなく一工程を省略することができ
、コストダウンをはかることができる。In addition, since no bedding powder is used, there is no warping or waviness of the board due to unevenness of the bedding powder, and when peeling the board 1) 1t, there is no need to immerse it in water and one step can be omitted, reducing costs. can be measured.
(実施例2)
上記実施例1のセラミックファイバーに、従来から使用
されているセラミック焼成用敷粉としてのアルミナ扮゛
末(平均粒径40μm)をセラミ・7クフアイバーに対
し重量比で30%を添加混合し、前記実施例1と同様の
方法でシート化し、厚さ0゜5mmで1o OR7mの
薄板となし、これを用い実施例1と同様にして回路基板
を得た。(Example 2) To the ceramic fiber of Example 1 above, 30% by weight of alumina powder (average particle size 40 μm), which has been used as a bedding powder for ceramic firing, was added to the ceramic 7 fiber. They were added and mixed and formed into a sheet in the same manner as in Example 1 to form a thin plate with a thickness of 0.5 mm and a width of 10.degree.
その結果、実施例1と同様の作用及び効果を得た。As a result, the same actions and effects as in Example 1 were obtained.
本発明は上記実施例に限定されるものではなく、次のよ
うに構成することができる。The present invention is not limited to the above embodiments, but can be configured as follows.
(1)セラミック基板lは上記実施例ではアルミナ基板
を使用したが、それに代えてマグネシア基板、コンデン
サ基板、ステアタイト基板等を使用することができる。(1) Although an alumina substrate was used as the ceramic substrate l in the above embodiment, a magnesia substrate, a capacitor substrate, a steatite substrate, etc. can be used instead.
(2)焼成条件は上記実施例では約1600 ”Cで2
時間の条件を採用したが、上記マグネシア基板、コンデ
ンサ基板、ステアタイト基板の場合には、約1350℃
で2時間の条件が採用される。(2) In the above example, the firing conditions were approximately 1600"C and 2
In the case of the magnesia substrate, capacitor substrate, and steatite substrate, approximately 1350℃ was adopted.
The 2 hour condition is adopted.
(3)本発明のセラミック焼成用シートは、非晶質無機
ファイバーを薄板状に成形して得たシートに前記したセ
ラミック焼成用粉末を塗布して使用することができる。(3) The ceramic firing sheet of the present invention can be used by applying the ceramic firing powder described above to a sheet obtained by molding an amorphous inorganic fiber into a thin plate shape.
発明の効果
本発明のセラミック焼成用シートは、焼成時アルミナ基
板やコンデンサ基板にそりを与えることがなく、かつ焼
成後基板間の離型が容易に行われ、さらに製造工程にお
ける筒略化がはかられるので焼成品が低コストで得られ
るという優れた効果を奏する。Effects of the Invention The ceramic firing sheet of the present invention does not warp the alumina substrate or capacitor substrate during firing, and the substrates can be easily released from the mold after firing, and the manufacturing process can be easily simplified. It has the excellent effect that fired products can be obtained at low cost.
図は本発明の実施例のセラミック基板の積層体を示す断
面図である。
特許出願人 田中製紙工業株式会社
代理人 弁理士 恩ITI博宣
自発手続ネrtt正書
昭和63年 2月27日The figure is a sectional view showing a laminate of ceramic substrates according to an embodiment of the present invention. Patent Applicant Tanaka Paper Industries Co., Ltd. Agent Patent Attorney OnITI Hakusen Voluntary Procedures Nett Official Book February 27, 1988
Claims (1)
してなるセラミック焼成用シート。 2、非晶質無機ファイバーはセラミックファイバー又は
ガラスファイバーである特許請求の範囲第1項に記載の
セラミック焼成用シート。 3、非晶質無機ファイバーからなる材料は、セラミック
ファイバー又はガラスファイバーにセラミック焼成用敷
粉としての無機粉末を配合したものである特許請求の範
囲第1項に記載のセラミック焼成用シート。[Scope of Claims] 1. A ceramic firing sheet formed by forming a material made of amorphous inorganic fiber into a thin plate shape. 2. The sheet for ceramic firing according to claim 1, wherein the amorphous inorganic fiber is a ceramic fiber or a glass fiber. 3. The sheet for ceramic firing according to claim 1, wherein the material made of amorphous inorganic fiber is a mixture of ceramic fiber or glass fiber with inorganic powder as a powder for ceramic firing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62042070A JPS63210071A (en) | 1987-02-24 | 1987-02-24 | Sheet for burning ceramic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62042070A JPS63210071A (en) | 1987-02-24 | 1987-02-24 | Sheet for burning ceramic |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63210071A true JPS63210071A (en) | 1988-08-31 |
JPH0479985B2 JPH0479985B2 (en) | 1992-12-17 |
Family
ID=12625818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62042070A Granted JPS63210071A (en) | 1987-02-24 | 1987-02-24 | Sheet for burning ceramic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63210071A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05306164A (en) * | 1991-07-18 | 1993-11-19 | Hotsukou Denshi Kk | Sintering method for ferrite tile |
-
1987
- 1987-02-24 JP JP62042070A patent/JPS63210071A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05306164A (en) * | 1991-07-18 | 1993-11-19 | Hotsukou Denshi Kk | Sintering method for ferrite tile |
Also Published As
Publication number | Publication date |
---|---|
JPH0479985B2 (en) | 1992-12-17 |
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