JPS63207204A - Microwave integrated circuit device - Google Patents

Abstract

PURPOSE:To obtain device which is not influenced by the adhesion of a carrier and a case, selects freely the thickness of the carrier and is satisfactory in an earth connection by providing a coplanar type strip line formed by converting a microstrip line on a substrate and an earth pattern formed near it. CONSTITUTION:Coplanar type lines 13 and 14 formed by converting microstrip lines 10 and 11 on substrates 3 and 4 are provided, earth patterns 8 and 9 are provided near the lines 13 and 14, the section between the lines 13 and 14 or the lines 13 and 14 and a microwave device are connected by a gold ribbon 7 and the section between patterns 8 and 9 or this and the device are connected. An electric wave to propagate the earth of the rear surface of the line 10 is converted to the earth pattern 8, propagated through the gold ribbon 7 to the earth pattern 9 and propagated to the earth of the rear surface of the line 11. Here, the width of the lines 13 and 14 and the interval between the line and the patterns 8 and 9 are made smaller. Thus, the earth connection of the microwave is made satisfactory, the influence of the earth surface of a substrate rear surface is eliminated and the connection between respective devices is made satisfactory.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an improvement in microwave ground connection when mutually coupling microwave devices in a microwave integrated circuit device.

[Conventional technology]

FIG. 3 is a cross-sectional view showing the ground connection of a conventional microwave integrated circuit device disclosed in, for example, Japanese Unexamined Patent Publication No. 59-127320.
, 4 are fixed to the case 5, 3.4 is a microwave integrated circuit board, 5 is a case, and A and B are connection points. The carrier 1.2 has a thickness of λ/2 (λ: wavelength), and the microwave mutual coupling point A is grounded.

Next, the operation will be explained.

The waves propagating on the surface of the conductor pattern on the back side of the substrate 3 propagate from the connection point A to the case S side, and if the connection point B is short-circuited, the microwave is reflected, and the length of A of the wavelength λ at a certain frequency is If we take the lengths of carriers 1 and 2, connection point A becomes ground in terms of microwaves, and point A between carriers 1 and 2 is connected in terms of microwaves. however,
At connection point B, carriers 1 and 2 and case 5 must be in close contact. The thickness of the carrier must be an integral multiple of 2 of the wavelength λ calculated from the frequency used, so
If the frequency deviates from that frequency, stray capacitance etc. will occur.

[Problem that the invention seeks to solve]

Since the conventional microwave integrated circuit device is configured as described above, if the carriers 1 and 2 and the case 5 are not in close contact with each other, stray capacitance will occur and the characteristics will shift. In particular, when the temperature changes, there is a possibility that the adhesive state will deviate and the characteristics will deviate. Furthermore, the thickness of the carrier must be set to 2 of the operating frequency λ, and there is a problem in that if the frequency deviates, the characteristics will deviate due to the generation of stray capacitance.

This invention was made to solve the above problems, and is not affected by the degree of adhesion between the carrier and the case.
The purpose of the present invention is to provide a device in which the thickness of the carrier can be freely selected and a good ground connection can be obtained.

[Means for solving problems]

A microwave integrated circuit device according to the present invention includes a coplanar strip line formed by converting a marked cross strip line on a substrate, and a ground pattern formed in the vicinity of the coplanar strip line. The strip lines or the coplanar strip line and the microwave device are connected, and the ground patterns or the ground pattern and the microwave device are connected.

[Effect]

In this invention, with the above configuration, ground connection can be made regardless of the machining accuracy of the back surface of the board or the ground surface of the back surface of the board, so that good ground connection for microwaves can be achieved and workability can be improved.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a microwave integrated circuit according to an embodiment of the present invention.
In the figure, 1.2 is a carrier, 3, 4
5 is a microwave integrated circuit board, 5 is a case, 6 is a gold wire that connects the coplanar line 13.14, 7 is a gold ribbon that connects a ground pattern 8.9, and 8.9 is a microwave integrated circuit board 3. The ground patterns 10 and 11 formed on the microwave integrated circuit board 3 are respectively
．． Mark loss strip lines 13 and 14 formed in 4 are coplanar type lines obtained by converting the mark loss strip lines 10 and 11, respectively.

Next, the operation will be explained.

Radio waves propagating through the ground on the back side of the strip line 10 on the board 3 are converted to the ground pattern 8 on the top surface of the board 3, which is provided close to the coplanar line 13, and pass through the gold ribbon 7 to the coplanar line on the board 4. It propagates to the ground pattern 9 provided close to the line 14, and then to the ground on the back surface of the strip line 11 on the board 4. Here, in order to reduce the influence of the back side of the board, the coplanar type line 13, 14
The width of the coplanar line 13.14 and the surrounding ground patterns 8, 9 may be reduced to about 30 microns (for example). The ribbon 7 needs to be left slightly slack in order to absorb temperature stress.

In this embodiment, a good microwave ground,
Connection can be obtained, and the influence of the ground plane on the back side of the board is eliminated, making it possible to improve the connection between each device.

In the above embodiment, the microwave integrated circuit board and the other side to be connected are the same integrated circuit board, but this may be another microwave device as shown in FIG. By connecting the ground pattern 8 on device case 3 and the ground of device case 5 with a gold ribbon 16, and connecting the coplanar line 13 and device case 15 with a core wire, the same effect as in the above embodiment can be obtained. .

〔Effect of the invention〕

As described above, according to the microwave integrated circuit device of the present invention, there is a coplanar strip line formed by converting a mark cross strip line on a substrate, and a ground pattern formed near the coplanar strip line. and connect the coplanar strip lines or the coplanar strip line and the microwave device, and connect the ground patterns or the ground pattern and the microwave device, thereby providing a good microwave ground connection. This has the effect of eliminating the influence of the ground plane on the back side of the board and making it possible to improve the connection between each device.

[Brief explanation of the drawing]

FIG. 1 is a top view and a cross-sectional view showing a microwave integrated circuit device according to an embodiment of the present invention, and FIG. 2 is a top view and a cross-sectional view showing a microwave integrated circuit device according to another embodiment of the invention. , FIG. 3 is a cross-sectional view showing a conventional microwave integrated circuit device. In the bacteria, 1 and 2 are carriers, 3.4 is a board, 5 is a case, 6 is a wire, 7 is a gold ribbon, 8.9 is a ground pattern, 10.11 is a strip line, 12 is a core wire, 13
．． 14 is a coplanar type line, and 15 is a device case. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) In a microwave integrated circuit device in which microwave integrated circuits are connected to each other or a microwave integrated circuit and another microwave device are connected, a mark cross strip is formed on the microwave integrated circuit board near the connection part. A coplanar strip line provided by converting a line, and a ground pattern provided near the coplanar strip line on the microwave integrated circuit board, and between the coplanar strip lines or between the coplanar strip lines. and the microwave device, and a connection is made between the ground patterns or between the ground pattern and the ground of the microwave device.