JPS63206911A - Metallic mold device for production of magnetic disk substrate - Google Patents
Metallic mold device for production of magnetic disk substrateInfo
- Publication number
- JPS63206911A JPS63206911A JP3935387A JP3935387A JPS63206911A JP S63206911 A JPS63206911 A JP S63206911A JP 3935387 A JP3935387 A JP 3935387A JP 3935387 A JP3935387 A JP 3935387A JP S63206911 A JPS63206911 A JP S63206911A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- air
- magnetic disk
- disk substrate
- metallic mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 33
- 238000007664 blowing Methods 0.000 claims abstract description 18
- 238000010438 heat treatment Methods 0.000 claims description 16
- 238000001746 injection moulding Methods 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims description 4
- 238000003780 insertion Methods 0.000 description 6
- 230000037431 insertion Effects 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
この発明は、磁気ディスク(ハードディスク)の下地層
および磁性層形成前の状態の磁気ディスク基板を射出成
形する磁気ディスク基板成形金型装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a magnetic disk substrate molding device for injection molding a magnetic disk substrate in a state before forming an underlayer and a magnetic layer of a magnetic disk (hard disk).
従来、コンピュータやパソコン、ワードプロセッサなど
の記録媒体として、ハードディスクと呼ばれる磁気ディ
スクが用いられている。この種の磁気ディスクの磁気デ
ィスク基板として、現在アルミ合金製のものから、耐熱
性プラスチック材料を用いたものへ移行して低コスト化
を図ろうとする動きがある。Conventionally, magnetic disks called hard disks have been used as recording media for computers, personal computers, word processors, and the like. There is currently a movement to reduce costs by shifting from aluminum alloy magnetic disk substrates to those using heat-resistant plastic materials as magnetic disk substrates for this type of magnetic disk.
樹脂製磁気ディスク基板に要求される表面粗さはR,□
が0.08μm以下で、平坦度10μm/Φ951以下
と極めて精密な射出成形技術が必要となってくる0表面
粗さは射出成形金型の表面粗さに転写されるため、金型
の鏡面加工技術で対応可能と考えられる。The surface roughness required for resin magnetic disk substrates is R, □
The surface roughness is less than 0.08μm and the flatness is less than 10μm/Φ951, which requires extremely precise injection molding technology.Since the surface roughness is transferred to the surface roughness of the injection mold, mirror finishing of the mold is required. It is thought that this can be handled with technology.
平坦度に起因する要因としては、樹脂流動性不均一によ
る熱変形、金型離型不良による応力変形等さまざまであ
り、いまだ解決が成されていない。There are various factors that cause flatness, such as thermal deformation due to non-uniform resin fluidity, stress deformation due to poor mold release, etc., and no solution has been found yet.
特に、金型面を鏡面とすると、成形品である磁気ディス
ク基板と金型との密着が強く、エジェクタピンで突き上
げた場合に、内部が一瞬真空状態となる。これを無理に
突き上げると、変形が生じる。In particular, when the surface of the mold is mirror-finished, the mold is in close contact with the magnetic disk substrate, which is a molded product, and when the mold is pushed up with an ejector pin, the interior momentarily becomes a vacuum state. If this is pushed up forcibly, deformation will occur.
そこで、離型時にエアーを吹き込むことを考えたが、供
給するエアーの温度不均一により、離型された磁気ディ
スク基板の温度分布が不均一となり、微妙な変形が生じ
る。磁気ディスク基板に要求される平坦度は厳しく、こ
のような微妙な変形であっても使用することができない
。Therefore, we considered blowing air during demolding, but due to the nonuniform temperature of the supplied air, the temperature distribution of the demolded magnetic disk substrate becomes nonuniform, causing subtle deformation. The flatness required for magnetic disk substrates is so strict that even such subtle deformations cannot be used.
この発明の目的は、離型時の変形がなく、十分に安定し
た平坦度が得られ、離型性の良い磁気ディスク基板成形
金型装置を提供することである。An object of the present invention is to provide a magnetic disk substrate molding device that is free from deformation during mold release, provides sufficiently stable flatness, and has good mold releasability.
この発明の磁気ディスク基板成形金型装置は、磁気ディ
スク基板を射出成形する金型と、この金型の構成部材間
の隙間からキャビティ内にエアーを吹き込むエアー吹込
手段と、このエアー吹込手段の吹込エアーを加熱するエ
アー加熱手段とを備えたものである。The magnetic disk substrate molding device of the present invention includes a mold for injection molding a magnetic disk substrate, an air blowing means for blowing air into a cavity from a gap between constituent members of the mold, and a blowing means for blowing air into a cavity from a gap between constituent members of the mold. It is equipped with an air heating means for heating the air.
この構成によると、加熱したエアーを離型時に金型内に
吹き込むことにより、成形された磁気ディスク基板と金
型との間の真空状態が解消され、離型性が向上する。そ
のため、離型時の磁気ディスク基板の変形や反りを防止
できる。また、加熱したエアーを吹き込むので、冷風を
吹き込む場合と異なり、離型された磁気ディスク基板の
温度不均一がなくなり、より一層平坦度が高められる。According to this configuration, by blowing heated air into the mold at the time of mold release, the vacuum state between the molded magnetic disk substrate and the mold is eliminated, and the mold releasability is improved. Therefore, deformation and warping of the magnetic disk substrate during demolding can be prevented. Furthermore, since heated air is blown in, unlike the case where cold air is blown in, temperature non-uniformity of the released magnetic disk substrate is eliminated, and the flatness is further improved.
さらに、離型性がよくなることから、作業性も向上する
。Furthermore, since mold releasability is improved, workability is also improved.
実施例
この発明の一実施例を第1図および第2図に基づいて説
明する。この磁気ディスク基板成形金型装置は、磁気デ
ィスク基板1を射出成形する金型2と、この金型2の構
成部材間の隙間3a、3bからキャビティ2a内にエア
ーを吹き込むエアー吹込手段4と、このエアー吹込手段
4の吹込エアーを加熱するエアー加熱手段5とを備えた
ものである。第2図は成形された磁気ディスク基板lを
示し、中央には2次加工等で中心孔lbを形成してゲー
ト1aを取り除く。Embodiment An embodiment of the present invention will be explained based on FIGS. 1 and 2. This magnetic disk substrate molding device includes a mold 2 for injection molding a magnetic disk substrate 1, an air blowing means 4 for blowing air into a cavity 2a from gaps 3a and 3b between constituent members of the mold 2. The air heating device 5 is provided with an air heating device 5 for heating the air blown by the air blowing device 4. FIG. 2 shows a molded magnetic disk substrate 1, in which a center hole lb is formed in the center by secondary processing and the gate 1a is removed.
金型2は、各々金型構成材となる金型本体6とスプルー
7とを有し、エジェクタビン8がエジェクタピン挿入孔
9に挿入されている。金型本体6は固定側金型本体6a
と可動側金型本体6bとに分割されている。エアー吹込
手段4は、金型本体6の上下に設けた熱盤11内の風路
12と、この風路12aに配管20およびディスペンサ
13を介して送風する送風機(図示せず)とからなる。The mold 2 has a mold body 6 and a sprue 7, each of which constitutes the mold, and an ejector pin 8 is inserted into an ejector pin insertion hole 9. The mold body 6 is a stationary mold body 6a.
and a movable mold body 6b. The air blowing means 4 includes an air passage 12 in a hot platen 11 provided above and below the mold body 6, and a blower (not shown) that blows air into this air passage 12a via a pipe 20 and a dispenser 13.
熱盤11はヒータlOを埋め込んだものであり、ヒータ
10は温度コントローラ14に制御されて風路12内の
エアーを適正温度に加熱する。温度コントローラ14は
金型本体6に設けた温度センサ19と接続しである。こ
れら熱盤11およびヒータ10などでエアー加熱手段5
が構成される。The heating plate 11 has a heater lO embedded therein, and the heater 10 is controlled by a temperature controller 14 to heat the air in the air passage 12 to an appropriate temperature. The temperature controller 14 is connected to a temperature sensor 19 provided in the mold body 6. Air heating means 5 using these heating plates 11, heaters 10, etc.
is configured.
上下の熱g111の風路12は各々これら熱盤11と金
型本体6との間の隙間3c、3dに開口し、この隙間3
c、3dから前記隙間3a、3bに連通している。隙間
3aはエジェクタピン8とエジェクタピン挿入孔9との
間に形成されたものである。隙間3bはスプルー7と金
型本体6との間に形成されたものである。隙間3a、3
bは、各々0、0 O5〜0.01mm程度としである
。下方の熱盤: 11と金型本体6との間には風路12
の開口とエジェクタピン挿入孔9とを連通させた隙間3
dを密閉するシール材16.17が設けである。上方の
熱111と金型本体6との間には隙間3cを密閉するシ
ール材15が設けである。シール材15〜17はOリン
グなどからなる。The air passages 12 for the upper and lower heat g111 open into gaps 3c and 3d between these heating plates 11 and the mold body 6, respectively.
c and 3d communicate with the gaps 3a and 3b. The gap 3a is formed between the ejector pin 8 and the ejector pin insertion hole 9. The gap 3b is formed between the sprue 7 and the mold body 6. Gap 3a, 3
b is approximately 0,005 to 0.01 mm, respectively. There is an air passage 12 between the lower heating plate 11 and the mold body 6.
A gap 3 that communicates the opening of the ejector pin insertion hole 9 with the ejector pin insertion hole 9.
A sealing material 16, 17 is provided to seal d. A sealing material 15 is provided between the upper heat 111 and the mold body 6 to seal the gap 3c. The sealing materials 15 to 17 are made of O-rings or the like.
この構成によると、熱盤11内の風路12で適度に加熱
されたエアーをスプルー7およびエジェクタピン挿入孔
9の隙間3a、3bから金型2内の中心に吹き込むこと
により、成形された磁気ディスク基板1と金型2との間
の真空状態が解消され、離型性が向上する。そのため、
離型時の磁気ディスク基板1の変形や反りを防止できる
。加熱したエアーを吹き込むので、冷風を吹き込む場合
と異なり、離型された磁気ディスク基板1の温度不均一
がなくなり、より一層平坦度が高められる。According to this configuration, by blowing air moderately heated in the air passage 12 in the heating plate 11 into the center of the mold 2 through the gaps 3a and 3b between the sprue 7 and the ejector pin insertion hole 9, the magnetic The vacuum state between the disk substrate 1 and the mold 2 is eliminated, and mold releasability is improved. Therefore,
Deformation and warping of the magnetic disk substrate 1 during demolding can be prevented. Since heated air is blown, unlike the case where cold air is blown, temperature non-uniformity of the released magnetic disk substrate 1 is eliminated, and the flatness is further improved.
さらに、離型性がよくなることから、作業性も向上する
。エアーの吹込は、ディスペンサ13を用いることによ
り、型開きしたと同時にタイミング良く行う。エアーの
加熱は熱盤11内の風路12で行うので、均一に加熱で
きる。また、金型6の固定側および可動側に各々位置す
るスプルー7およびエジェクタピン挿入孔9の隙間3a
、3bから吹き込むので、成形された磁気ディスク基板
Iの上下両表面に全周に均一に供給される。これらによ
り、より一層離型性の向上、平k1度の向上が得られる
。Furthermore, since mold releasability is improved, workability is also improved. By using the dispenser 13, air is blown in a timely manner at the same time as the mold is opened. Since the air is heated in the air passage 12 within the heating plate 11, it can be heated uniformly. Also, a gap 3a between the sprue 7 and the ejector pin insertion hole 9 located on the fixed side and the movable side of the mold 6, respectively.
, 3b, so that it is uniformly supplied to both the upper and lower surfaces of the molded magnetic disk substrate I over the entire circumference. As a result, the mold releasability and the flat k1 degree can be further improved.
この発明の磁気ディスク基板成形金型装置によれば、加
熱したエアーを離型時に金型内に吹き込むことにより、
成形された磁気ディスク基板と金型との間の真空状態が
解消され、離型性が向上する。そのため、離型時の磁気
ディスク基板の変形や反りを防止できる。また、加熱し
たエアーを吹き込むので、冷風を吹き込む場合と異なり
、離型された磁気ディスク基板の温度不均一がなくなり
、より一層平坦度が高められる。さらに、離型性がよく
なることから、作業性も向上するという効果がある。According to the magnetic disk substrate mold device of the present invention, by blowing heated air into the mold during demolding,
The vacuum state between the molded magnetic disk substrate and the mold is eliminated, improving mold releasability. Therefore, deformation and warping of the magnetic disk substrate during demolding can be prevented. Furthermore, since heated air is blown in, unlike the case where cold air is blown in, temperature non-uniformity of the released magnetic disk substrate is eliminated, and the flatness is further improved. Furthermore, since mold releasability is improved, workability is also improved.
第1図はこの発明の一実施例の断面図、第2図はその磁
気ディスク基板の斜視図である。
1・・・磁気ディスク基板、2・・・金型、3a、3b
・・・隙間、4・・・エアー供給手段、5・・・エアー
加熱手段、6・・・金型本体、7・・・スプルー、8・
・・エジェクタピン、11・・・熱盤FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a perspective view of the magnetic disk substrate. 1... Magnetic disk substrate, 2... Mold, 3a, 3b
...Gap, 4.Air supply means, 5.Air heating means, 6.Mold body, 7.Sprue, 8.
...Ejector pin, 11...Heating plate
Claims (1)
成部材間の隙間からキャビティ内にエアーを吹き込むエ
アー吹込手段と、このエアー吹込手段の吹込エアーを加
熱するエアー加熱手段とを備えた磁気ディスク基板成形
金型装置。A magnetic mold comprising a mold for injection molding a magnetic disk substrate, an air blowing means for blowing air into the cavity from a gap between the constituent members of the mold, and an air heating means for heating the air blown by the air blowing means. Disc substrate mold equipment.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3935387A JPS63206911A (en) | 1987-02-23 | 1987-02-23 | Metallic mold device for production of magnetic disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3935387A JPS63206911A (en) | 1987-02-23 | 1987-02-23 | Metallic mold device for production of magnetic disk substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63206911A true JPS63206911A (en) | 1988-08-26 |
Family
ID=12550711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3935387A Pending JPS63206911A (en) | 1987-02-23 | 1987-02-23 | Metallic mold device for production of magnetic disk substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63206911A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01278321A (en) * | 1988-04-30 | 1989-11-08 | Nec Home Electron Ltd | Injection molding device |
JPH02150327A (en) * | 1988-12-01 | 1990-06-08 | Canon Inc | Molding method of base plate of optical disk |
-
1987
- 1987-02-23 JP JP3935387A patent/JPS63206911A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01278321A (en) * | 1988-04-30 | 1989-11-08 | Nec Home Electron Ltd | Injection molding device |
JPH02150327A (en) * | 1988-12-01 | 1990-06-08 | Canon Inc | Molding method of base plate of optical disk |
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