JPS6320609Y2 - - Google Patents
Info
- Publication number
- JPS6320609Y2 JPS6320609Y2 JP1981169151U JP16915181U JPS6320609Y2 JP S6320609 Y2 JPS6320609 Y2 JP S6320609Y2 JP 1981169151 U JP1981169151 U JP 1981169151U JP 16915181 U JP16915181 U JP 16915181U JP S6320609 Y2 JPS6320609 Y2 JP S6320609Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- conductive member
- glass
- water
- paraffin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000005357 flat glass Substances 0.000 claims description 9
- 239000005871 repellent Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims description 3
- 239000012188 paraffin wax Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Description
本考案は端子と導電性部材との接合構造に関
し、例えば自動車のリヤウインドガラス表面に付
着する水蒸気、氷雪等を除去し、透視性を確保す
るためにガラス表面に焼付けるブスバーと、この
ブスバーに給電する端子との接合構造に関する。
一般に自動車のリヤウインドガラスには銀ペー
ストを所定パターンにプリントし、これを焼付け
ることで曇り止め用の熱線とこの熱線の両端を接
続するブスバーとを形成し、このブスバーに給電
用の端子を接合するようにしている。
ところで、ブスバー等を形成するには、織布或
いは金属性ステンシル等の多数の微細な孔を有す
るスクリーン版を用いて、所定の細い線条に浸出
印刷し、これを乾燥せしめた後焼付けるようにし
ている。したがつて、焼付後のブスバーをミクロ
的に観察すれば多数の微細な孔を有するポーラス
状となつている。
このため、上記微細な孔に、H2OやO2が入り
込み、ブスバーの劣化、ガラス構造の破壊を来た
し、端子の接着強度が低下し、剥離する等の問題
がある。
本考案者は上述の如き従来の問題点に鑑み、こ
れを有効に解決すべく本考案を成したものであ
り、その目的とする処は、ブスバーなどのポーラ
スな導電性部材と端子との接合状態を長期間に亘
つて強固に保持し得る端子の接合構造を提供する
にある。
斯る目的を達成すべく本考案は、半田層を介し
てポーラスな導電性部材と端子とを接合する構造
において、該導電性部材の少くとも端子が接合す
る部分の内部にパラフイン等の撥水性物質を介在
せしめたことをその要旨としている。
以下に本考案の好適一実施例を添付図面に基い
て詳述する。
第１図は本考案に係る端子の接合構造を適用し
た自動車のウインドガラスを示すものである。図
中１はリヤウインドガラスであり、このリヤウイ
ンドガラス１の裏面には、微細な銀粒子と低融点
ガラス粉末とを溶媒によつてペースト状とし、こ
のペーストを所定のパターンを有する織布或いは
金属製ステンシルからなるスクリーンを用いてプ
リントし、このプリントした銀ペーストを乾燥し
たのち約700℃に加熱して焼付けてなる帯状のブ
スバー２，２、及びこのブスバー２，２を接続す
る線状の熱線３……を形成している。
そして、上記ブスバー２，２の中央部には給電
用の端子４，４を接合しており、これら端子４，
４によつてブスバー２，２に給電し、熱線３……
にジユール熱を発生せしめることで、ガラス１表
面に付着した水蒸気、氷雪等を消去するようにし
ている。
第２図は上記端子４の接合部分を拡大して示し
たものであり、端子４は図示しないメス型端子に
嵌合するオス型接続片５と、このオス型接続片５
の下端に一体的に設けられた足部６，６とからな
り、この足部６，６の下面には接合力を強化する
ための突起７，７を形成している。
斯る端子４を接合する方法を以下に述べる。先
ずガラス１表面に銀ペーストを焼成してなる導電
性のブスバー２の表面のうち、端子４を接合する
部分にパラフイン、ロジン、ワツクス、シリコー
ン、グリース等の撥水性物質を塗り、この表面に
半田層８を介して端子４の足部６，６を接合する
ようにする。すると、半田の熱によつて撥水性物
質は溶解し、第２図に示す如く撥水性物質の粒子
９……はブスバー２の内部の微細な孔内に入り込
むとともに、半田層８の近傍のブスバー２表面を
覆うこととなる。そのため、微細な孔内にH2O
等が入り込むことがなく、ブスバーの劣化、ガラ
ス構造の破壊を来たすことがない。
次に具体的実験結果を従来例と比較した表を以
下に示す。
The present invention relates to a bonding structure between a terminal and a conductive member, and includes a busbar that is baked onto the glass surface to remove water vapor, ice and snow, etc. that adhere to the surface of a rear window glass of an automobile and ensure transparency. It relates to a joint structure with a terminal for power supply. Generally, silver paste is printed in a predetermined pattern on the rear window glass of an automobile, and this is baked to form a hot wire for anti-fogging and a bus bar that connects both ends of the hot wire, and a terminal for power supply is connected to this bus bar. I'm trying to connect it. By the way, in order to form busbars, etc., a screen plate with many fine holes such as woven cloth or a metal stencil is used to perform leaching printing on predetermined thin lines, and after drying, it is baked. I have to. Therefore, microscopic observation of the bus bar after baking shows that it has a porous shape with many fine pores. Therefore, there are problems such as H 2 O and O 2 entering the fine holes, causing deterioration of the bus bar and destruction of the glass structure, reducing the adhesive strength of the terminal, and causing peeling. In view of the above-mentioned conventional problems, the present inventor created the present invention to effectively solve the problems, and the purpose is to connect porous conductive members such as bus bars and terminals. It is an object of the present invention to provide a terminal joining structure that can firmly maintain a state for a long period of time. In order to achieve such an object, the present invention provides a structure in which a porous conductive member and a terminal are bonded via a solder layer, in which a water repellent material such as paraffin is applied to at least the portion of the conductive member where the terminal is bonded. The gist of this is that a substance is involved. A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 shows an automobile window glass to which the terminal joining structure according to the present invention is applied. In the figure, reference numeral 1 is a rear window glass. On the back side of the rear window glass 1, fine silver particles and low melting point glass powder are made into a paste using a solvent, and this paste is coated with a woven fabric having a predetermined pattern. The printed silver paste is printed using a screen made of a metal stencil, and after drying, it is heated and baked at about 700°C to form band-shaped busbars 2, 2, and linear busbars 2, 2 connecting these busbars 2, 2. It forms hot wire 3... Terminals 4, 4 for power feeding are connected to the center portions of the bus bars 2, 2, and these terminals 4,
4 supplies power to the busbars 2, 2, and the hot wire 3...
By generating Joule heat, water vapor, ice and snow adhering to the surface of the glass 1 are erased. FIG. 2 is an enlarged view of the connecting portion of the terminal 4, and the terminal 4 includes a male connecting piece 5 that fits into a female terminal (not shown), and this male connecting piece 5.
It consists of foot parts 6, 6 integrally provided at the lower end, and protrusions 7, 7 are formed on the lower surfaces of the foot parts 6, 6 to strengthen the bonding force. A method for joining such terminals 4 will be described below. First, a water-repellent substance such as paraffin, rosin, wax, silicone, or grease is applied to the surface of the conductive bus bar 2, which is made by baking silver paste on the surface of the glass 1, where the terminals 4 are to be bonded, and solder is applied to this surface. The legs 6, 6 of the terminal 4 are joined via the layer 8. Then, the water-repellent substance is melted by the heat of the solder, and as shown in FIG. 2 surfaces will be covered. Therefore, H 2 O inside the minute pores
etc. will not enter, causing deterioration of the bus bar and destruction of the glass structure. Next, a table comparing specific experimental results with conventional examples is shown below.
【表】
尚、上記実験の温度は50℃、湿度は95％とし、
用いた銀ペースト、端子、半田及びフラツクスは
パラフイン（溶解温度70℃）処理したものとしな
いものとで同一のものとし、接着面積も双方とも
64mm2とした。更にパラフインの具体的な塗り付け
方法は、端子を付ける前にパラフインの塊りをブ
スバー上に手でこすりつけ、次いで端子を接着
し、この後、端子が熱いうちに再度パラフインの
塊りを端子に接触させてパラフインを端子部にも
付着せしめるようにした。
以上の説明及び実験結果から明らかな如く、本
考案によれば、給電用端子を銀ペーストなどから
なるポーラスな導電性部材に半田層を介して接合
するにあたつて、上記導電性部材の少くとも端子
を接合する部分の内部に、パラフイン等の撥水性
物質を介在せしめる構造としたので、導電性部材
の内部にH2O等が入り込むことがなく、もつて
導電性部材或いはこれが接着しているガラスの構
造の破壊を来すことがなく、更に前記撥水性物質
の摩耗、剥離等を生ずることがないため前述した
効果が永続的に持続する。したがつて端子の接合
強度特に耐湿強度を長期間に亘つて強固に保持し
得る利点を有する。[Table] The temperature in the above experiment was 50℃, the humidity was 95%,
The silver paste, terminals, solder, and flux used were the same with and without paraffin treatment (melting temperature 70°C), and the adhesive area was the same for both.
It was set to 64mm 2 . Furthermore, the specific method of applying paraffin is to rub a lump of paraffin on the bus bar by hand before attaching the terminal, then glue the terminal, and then apply a lump of paraffin again to the terminal while it is still hot. The paraffin was also attached to the terminals by contacting them. As is clear from the above explanation and experimental results, according to the present invention, when bonding a power supply terminal to a porous conductive member made of silver paste or the like via a solder layer, it is possible to Since the structure is such that a water-repellent substance such as paraffin is interposed inside the part where the terminals are joined, H 2 O etc. do not enter the inside of the conductive member, and the conductive member or it is bonded together. The above-mentioned effect is maintained permanently because the structure of the glass is not destroyed, and the water-repellent material is not abraded or peeled off. Therefore, it has the advantage that the bonding strength, particularly the moisture resistance strength, of the terminal can be firmly maintained for a long period of time.
図面は本考案の好適一実施例を示すものであ
り、第１図は本考案に係る端子の接合構造を適用
した自動車のリヤウインドガラスの平面図、第２
図は同端子の接合部を拡大した縦断側面図であ
る。
尚、図面中１は板ガラス、２は導電性部材、４
は給電用端子、８は半田層、９は撥水性物質であ
る。
The drawings show a preferred embodiment of the present invention, and FIG. 1 is a plan view of an automobile rear window glass to which the terminal joining structure according to the present invention is applied, and FIG.
The figure is an enlarged longitudinal cross-sectional side view of the joint portion of the same terminal. In the drawings, 1 is a plate glass, 2 is a conductive member, and 4 is a plate glass.
is a power supply terminal, 8 is a solder layer, and 9 is a water-repellent material.
Claims (1)
有する金属ペーストからなる導電性部材の表面
に、半田層を介して給電用端子を接合するように
した構造において、上記導電性部材表面の少なく
とも端子が接合する部分の上記微細な孔内に撥水
性物質を充填せしめたことを特徴とする端子の接
合構造。 In a structure in which a power supply terminal is bonded via a solder layer to the surface of a conductive member made of a metal paste that is baked onto the surface of a plate glass and has many fine holes, at least the terminal on the surface of the conductive member is A terminal joining structure characterized in that a water-repellent substance is filled in the fine pores of the joining part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16915181U JPS5875061U (en) | 1981-11-13 | 1981-11-13 | Terminal joint structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16915181U JPS5875061U (en) | 1981-11-13 | 1981-11-13 | Terminal joint structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5875061U JPS5875061U (en) | 1983-05-20 |
| JPS6320609Y2 true JPS6320609Y2 (en) | 1988-06-08 |
Family
ID=29961149
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16915181U Granted JPS5875061U (en) | 1981-11-13 | 1981-11-13 | Terminal joint structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5875061U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003017161A (en) * | 2001-07-04 | 2003-01-17 | Furukawa Electric Co Ltd:The | Terminal board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745213Y2 (en) * | 1977-03-24 | 1982-10-05 | ||
| JPS55167863U (en) * | 1979-04-13 | 1980-12-02 |
-
1981
- 1981-11-13 JP JP16915181U patent/JPS5875061U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5875061U (en) | 1983-05-20 |
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