JPS63204688A - Surface mount board - Google Patents
Surface mount boardInfo
- Publication number
- JPS63204688A JPS63204688A JP3629787A JP3629787A JPS63204688A JP S63204688 A JPS63204688 A JP S63204688A JP 3629787 A JP3629787 A JP 3629787A JP 3629787 A JP3629787 A JP 3629787A JP S63204688 A JPS63204688 A JP S63204688A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- metal
- copper
- roughening
- surface mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 51
- 229910052751 metal Inorganic materials 0.000 claims description 51
- 238000007788 roughening Methods 0.000 claims description 48
- 239000010949 copper Substances 0.000 claims description 44
- 229910052802 copper Inorganic materials 0.000 claims description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 30
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 17
- 230000003746 surface roughness Effects 0.000 claims description 15
- 238000005253 cladding Methods 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 10
- 239000012808 vapor phase Substances 0.000 claims description 7
- 239000002131 composite material Substances 0.000 claims description 5
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 83
- 229920001721 polyimide Polymers 0.000 description 22
- 238000000034 method Methods 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 10
- 239000010408 film Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 229910001374 Invar Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000000740 bleeding effect Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000009304 pastoral farming Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、金属ベースのプリント配線板等に用いられる
表面実装用基板に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a surface mounting substrate used for metal-based printed wiring boards and the like.
〈従来の技術〉
金属ベースの表面実装用基板は、熱放牧性、加工性、導
電性に優れるため、ＩＣ表面実装基板やハイブリッドＩ
Ｃ基板等に多用されている。そのなかでも、銅／インバ
ー（Ｆｅ−約３６．５％Ｎｘ合金）／銅なる３層構造の
クラッド材による基板は、特に熱放牧性に優れかつ導電
性並びに低熱膨張性（Ｓｉチップに近い）に優れるため
、近年、注目されている。<Conventional technology> Metal-based surface mount substrates have excellent heat grazing properties, processability, and conductivity, so they are suitable for IC surface mount substrates and hybrid IC substrates.
It is often used for C substrates, etc. Among these, a substrate made of a three-layer cladding material of copper/Invar (Fe-approximately 36.5% Nx alloy)/copper has particularly excellent thermal grazing properties, conductivity, and low thermal expansion (close to Si chips). It has attracted attention in recent years due to its excellent properties.
このような金属ベースの表面実装用基板には、絶縁処理
として金属基板表面にポリイミド系フィルムのような絶
縁層を接着することが行われているが、この絶縁層の接
着強度を高めるために、金属基板表面に粗面化処理が施
される。For such metal-based surface mount substrates, an insulating layer such as a polyimide film is bonded to the surface of the metal substrate as an insulation treatment, but in order to increase the adhesive strength of this insulating layer, Roughening treatment is performed on the surface of the metal substrate.
従来、この粗面化処理は、湿式エツチング、湿式電解エ
ツチングまたは湿式めっき等によって金属基板表面に微
細な凹凸を形成し、その凹凸面の投錨効果によって、ポ
リイミド系フィルムの接着強度を高めていた。Conventionally, this surface roughening treatment involves forming fine irregularities on the surface of a metal substrate by wet etching, wet electrolytic etching, wet plating, etc., and the anchoring effect of the irregular surface increases the adhesive strength of the polyimide film.
しかしながら、湿式による粗面化処理には、次のような
欠点がある。However, wet surface roughening treatment has the following drawbacks.
■従来の粗面化処理は、湿式のため、例えばＣｕ／イン
バー／Ｇｕの３層クラッド材による基板の場合、Ｃｕ表
面の酸化、しみ（部分的なＣｕ表面の酸化）、にじみ（
エツチング液のにじみ出し）等により安定した表面品質
が保てず、ポリイミド系フィルムの接着性がそれほど向
−トしない。■ Conventional surface roughening treatment is a wet process, so for example, in the case of a substrate made of a three-layer cladding material of Cu/Invar/Gu, oxidation of the Cu surface, stains (partial oxidation of the Cu surface), and bleeding (
Stable surface quality cannot be maintained due to oozing of etching solution, etc., and the adhesion of the polyimide film is not very good.
■前記いずれの粗面化処理方法も、湿式であり、めっき
液またはエツチング液、さらには洗浄のための多量の水
を使用するので、これらの排液処理設備が必要であり、
費用がかかる。■All of the above surface roughening treatment methods are wet methods and use plating solution or etching solution, as well as a large amount of water for cleaning, so they require drainage treatment equipment.
It's expensive.
■湿式による粗面化処理では、処理条件によっては、金
属基板表面に水酸化被膜が生成することがあり、ポリイ
ミド系フィルムとの接着性が悪くなる。(2) In wet surface roughening treatment, depending on the treatment conditions, a hydroxide film may be formed on the surface of the metal substrate, resulting in poor adhesion to the polyimide film.
■前記方法の粗面化処理では、表面粗さがＲｍａｘ＝
５．５〜３０−程度となるが、これでは表面粗さが粗す
ぎて比較的薄い、例えば１０〇−厚のポリイミド系フィ
ルムを接着した場合、層間の絶縁性が劣る。■In the surface roughening treatment of the above method, the surface roughness is Rmax=
The surface roughness is approximately 5.5 to 30 mm, but this results in too rough a surface, resulting in poor interlayer insulation when a relatively thin polyimide film, for example 100 mm thick, is adhered.
〈発明が解決しようとする問題点〉
本発明の目的は、上述した従来技術の欠点を解消し、乾
式法を用いた粗面化処理によりポリイミド系フィルムの
ような絶縁層の接着性を大幅に向上することができる表
面実装用基板を提供することにある。<Problems to be Solved by the Invention> The purpose of the present invention is to eliminate the above-mentioned drawbacks of the prior art and to significantly improve the adhesion of an insulating layer such as a polyimide film by roughening treatment using a dry method. An object of the present invention is to provide a surface mounting substrate that can be improved.
〈問題点を解決するための手段〉 このような目的は、以下の本発明によって達成される。〈Means for solving problems〉 Such objects are achieved by the following invention.
即ち本発明は、絶縁層を接着して用いる銅／Ｆｅ−Ｎｉ
系合金／銅なる３層構造のクラッド材による表面実装用
基板において、
前記絶縁層を接着する側の銅層表面に、少なくとも１層
の気相めっきによる金属粗化層を設けてなることを特徴
とする表面実装基板を提供するものである。That is, the present invention uses copper/Fe-Ni to bond an insulating layer.
A surface mounting board made of a three-layer cladding material of alloy/copper, characterized in that at least one metal roughening layer formed by vapor phase plating is provided on the surface of the copper layer on the side to which the insulating layer is bonded. The present invention provides a surface mount board that can be used as a surface mount board.
そして、金属粗化層は銅、銅系合金、Ｎｉ、 Ｎｉ系合
金の粗化層とするのがよい。The metal roughening layer is preferably a roughening layer of copper, copper-based alloy, Ni, or Ni-based alloy.
また、金属粗化層は異種金属の複合層であるのがよい。Further, the metal roughening layer is preferably a composite layer of different metals.
金属粗化層の合計厚さは０．００１〜２００−であるの
がよい。The total thickness of the metal roughening layer is preferably from 0.001 to 200-200.
そして、金属粗化層の表面粗さが表面最大高さＲｍａｘ
＝ Ｉ Ｘ １０−’〜５−であるのがよい。Then, the surface roughness of the metal roughening layer is the maximum surface height Rmax
It is preferable that = I X 10-' to 5-.
以下、本発明の表面実装用基板を添付図面に示す好適実
施例について詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the surface mounting substrate of the present invention shown in the accompanying drawings will be described in detail.
第１図および第２図は、それぞれ本発明の表面実装用基
板の断面構造を示す部分断面側面図である。これらの図
に示すように、本発明の表面実装用基板１の基板本体は
、銅層２および４の間に、Ｆｅ−Ｎｉ系合金層好ましく
はインバー（Ｆｅ−約３６．５％Ｎｉ合金）層３を介装
した３層構造のクラッド材（以下、ｒｃｒｃＣＩＣクラ
ッド材う）で構成されている。ＣＩＣクラッド材の構成
比は使用目的に応じて任意のものが可能である。なお、
ＣＩＣクラッド材の銅層２．４は、純銅に限らず、銅系
合金で構成されたものでもよい。FIG. 1 and FIG. 2 are partial cross-sectional side views showing the cross-sectional structure of the surface mounting substrate of the present invention, respectively. As shown in these figures, the board body of the surface mounting board 1 of the present invention has an Fe-Ni alloy layer preferably invar (Fe-about 36.5% Ni alloy) between the copper layers 2 and 4. It is composed of a three-layer cladding material (hereinafter referred to as rcrcCIC cladding material) with layer 3 interposed therebetween. The composition ratio of the CIC cladding material can be arbitrary depending on the purpose of use. In addition,
The copper layer 2.4 of the CIC cladding material is not limited to pure copper, and may be made of a copper-based alloy.
このＣＩＣクラッド材の片面または両面にはポリイミド
系フィルムのような絶縁層が接着されるが、この絶縁層
を接着する側の銅層、即ち第１図における銅層２の表面
に気相めっきによる金属粗化層５が形成されている。こ
の金属粗化層５の形成により、絶縁層（ポリイミド系フ
ィルム）の接着性が高まる。An insulating layer such as a polyimide film is adhered to one or both sides of this CIC clad material, and the copper layer on the side to which this insulating layer is adhered, that is, the surface of the copper layer 2 in Fig. 1, is coated with vapor phase plating. A metal roughening layer 5 is formed. Formation of this metal roughening layer 5 increases the adhesiveness of the insulating layer (polyimide film).
金属粗化層５を構成する金属はいかなるものでもよいが
、ここでは銅または銅系合金（例えばＣｕ−０，１％Ｚ
ｒ、Ｃｕ−３％Ｎｉ）あるいはＮｉまたはＮｉ系合金（
例えばＮｉ −５％Ｓｎ −１％Ｐ）であるのがよい。The metal roughening layer 5 may be made of any metal, but here copper or a copper-based alloy (for example, Cu-0.1% Z
r, Cu-3%Ni) or Ni or Ni-based alloy (
For example, Ni-5%Sn-1%P) is preferable.
気相めっきによると、銅または銅系合金による金属粗化
層５は、ＣＩＣクラッド材の銅層２との接着力が高くか
つ絶縁層との接着力が高い。また、ＮｉまたはＮｉ系合
金による金属粗化層５はそれに加えてＣＩＣクラッド材
の銅層２の酸化を防止する保護層としての作用がある。According to vapor phase plating, the metal roughening layer 5 made of copper or a copper-based alloy has high adhesive strength with the copper layer 2 of the CIC cladding material and high adhesive strength with the insulating layer. In addition, the metal roughening layer 5 made of Ni or Ni-based alloy also functions as a protective layer for preventing oxidation of the copper layer 2 of the CIC cladding material.
すなわち、気相めっきによる金属粗化層は、湿式のめっ
き等の場合のように液のにじみの問題がなく、その分だ
けその表面粗さが小さくても相対的な接着効果が向−Ｌ
し、また気相めっきによる場合はその生成膜が緻密な結
晶粒をもフて構成されるため、その酸化膜も緻密で強固
なものとなり、これが結果として絶縁層との接着効果を
向上させることになるものと思われる。In other words, the metal roughening layer formed by vapor phase plating does not have the problem of liquid bleeding as in the case of wet plating, and therefore the relative adhesion effect is improved even if the surface roughness is small.
However, in the case of vapor phase plating, the resulting film is composed of dense crystal grains, so the oxide film also becomes dense and strong, which improves the adhesion effect with the insulating layer. It seems that it will become.
第１図では単一金属または合金による一層の金属粗化層
５が形成されているが、これに限らず、第２図に示すよ
うに異種金属による金属粗化層６および７を２層以上積
層したものでもよい。この場合でも金属粗化層６．７の
いずれか一方または双方は銅または銅系合金あるいはＮ
ｉまたはＮｉ系合金で構成するのがよい。In FIG. 1, one layer of metal roughening layer 5 is formed of a single metal or an alloy, but the invention is not limited to this, and as shown in FIG. 2, two or more metal roughening layers 6 and 7 of different metals are formed. A layered structure may also be used. Even in this case, either one or both of the metal roughening layers 6.7 is copper, a copper-based alloy, or N.
It is preferable to use Ni or Ni-based alloy.
このような金属粗化層の合計厚さは、０．００１〜２０
０戸程度とするのがよい。その理由は、厚さ０．００１
−未満では粗化層としての効果が少なくなり、また厚さ
２００−を超えると熱伝導性、低熱膨張性が阻害される
からである。The total thickness of such a metal roughening layer is between 0.001 and 20
It is best to set the number to about 0. The reason is that the thickness is 0.001
This is because if the thickness is less than -, the effect as a roughened layer will be reduced, and if it exceeds 200 -, thermal conductivity and low thermal expansion properties will be inhibited.
また金属粗化層の表面８の表面粗さは、表面最大高さＲ
ｔｎａｘ−Ｉ Ｘ １０−３〜５−とするのがよい。表
面最大高さＲｍａｘの下限値をＩ Ｘ １０−３４とし
たのは、１ ｘ １０−３−未満では粗化層としての効
果が少ないからであり、上限値を５戸としたのは、５−
を超え、特に１０−を超えると、そのような粗さがポリ
イミド系フィルム等の絶縁層における必要な絶縁特性の
確保を困難にするからである。Further, the surface roughness of the surface 8 of the metal roughening layer is determined by the maximum surface height R
It is preferable to use tnax-IX 10-3 to 5-. The reason why the lower limit of the maximum surface height Rmax was set to I x 10-34 is that less than 1 x 10-3 is less effective as a roughening layer, and the upper limit was set to 5 because it is less than 1 x 10-3. −
This is because, if the roughness exceeds 10 -, in particular, such roughness makes it difficult to ensure necessary insulation properties in an insulating layer such as a polyimide film.
なお金属粗化層の形成方法である気相めっきとは、例え
ば、蒸着法、スパッタリング、イオンブレーティング、
ＣＶＯ、またはこれに類する方法のような広義の乾式薄
膜形成方法をいう。Note that vapor phase plating, which is a method for forming a metal roughening layer, includes, for example, vapor deposition, sputtering, ion blasting,
It refers to a dry thin film forming method in a broad sense, such as CVO or a similar method.
また、金属粗化層はＣＩＣクラッド材の銅層の圧延面に
直接形成してもよいが、形成の前処理として、銅層表面
をブラシ等で機械的に研摩し、あるいは従来のエツチン
グ粗面化処理を行った後に金属粗化層の形成を行っても
よい。The metal roughening layer may be formed directly on the rolled surface of the copper layer of the CIC cladding material, but as a pretreatment for formation, the surface of the copper layer may be mechanically polished with a brush or the like, or the surface of the copper layer may be polished using conventional etching. The metal roughening layer may be formed after the chemical treatment.
〈実施例〉
（本発明例１）
第３図に示す構造の真空蒸着装置１０（内圧１Ｏ−５ｔ
ｏｒｒ）を用いて、第１図に示すように銅／インバー／
銅の３層構造のクラッド材（厚さの比１：３：１）の基
板１（板厚１．０ｍ■Ｘ １００ｍｍ Ｘ１００ｍｍ
）に蒸発材料Ｉ２であるＣｕＪＢよびＮｆ（別のルツボ
）を各々成膜速度３０人／ｗｉｎで５戸厚に成膜した。<Example> (Example 1 of the present invention) A vacuum evaporation apparatus 10 having the structure shown in FIG.
orr) as shown in Figure 1.
Substrate 1 (plate thickness 1.0 m x 100 mm
), CuJB and Nf (separate crucibles), which are evaporation materials I2, were each deposited to a thickness of 5 layers at a deposition rate of 30 people/win.
この金属蒸着相゛化層の表面粗さを測定したところ、Ｃ
ｕ粗化層の表面粗さはＲｍａｘ−４ｐｍ、別の試料のＮ
ｉ粗化層の表面粗さはＲｎ＋ａｘ−３−であフた。 こ
れらの基板の金属蒸着粗化層表面に接着剤を塗布し５０
−厚のポリイミド系フィルムを熱プレスで圧着した。When the surface roughness of this metal vapor-deposited phased layer was measured, it was found that C
u The surface roughness of the roughened layer is Rmax-4pm, and the N of another sample is
The surface roughness of the i-roughened layer was Rn+ax-3-. Adhesive was applied to the surface of the metal evaporated roughened layer of these substrates, and
- A thick polyimide film was bonded using a hot press.
これらの試料を第５図に示すように幅１０ｍｍの試験片
とし、ポリイミド系フィルムの引剥し試験（Ｔピール試
験）を行い接着強度を調べた。その結果を表１に示す。These samples were made into test pieces having a width of 10 mm as shown in FIG. 5, and a polyimide film peel test (T-peel test) was conducted to examine the adhesive strength. The results are shown in Table 1.
（本発明例２）
第４図に示す構造のイオンスパッタ装置１５（Ａｒ ：
１０−２〜１０−’ｔｏｒｒ）を用いて、本発明例１
と同様の基板にＣｕおよびＮｉをカソードとして成膜速
度１５λ／ｓｅｃで、最小厚さ５−成膜した。Ｃｕ粗化
層およびＮｉ粗化層の表面粗さは、ともにＲｍａｘ＝４
Ｐであった。(Example 2 of the present invention) Ion sputtering device 15 (Ar:
Inventive Example 1
A film was formed to a minimum thickness of 5 on the same substrate as above at a film formation rate of 15λ/sec using Cu and Ni as cathodes. The surface roughness of both the Cu roughened layer and the Ni roughened layer is Rmax=4
It was P.
これらの基板の金属粗化層表面に本発明例１と同様にし
てポリイミド系フィルムを接着し、同様のポリイミド系
フィルムの引剥し試験を行フた。A polyimide film was adhered to the surface of the metal roughened layer of these substrates in the same manner as in Invention Example 1, and the same peeling test of the polyimide film was conducted.
その結果を表１に示す。The results are shown in Table 1.
（本発明例３）
イオンブレーティング装置を用いて、本発明例１と同様
の基板に蒸着材料であるＣｕおよびＮｉを別個に用意し
、まず成膜速度３０人／ｍｉｎでＣｕ粗化層を厚さ３−
成膜し、その上にＮｉ粗化層を厚さ３−成膜した。この
複合層の表面の表面粗さを測定したところ、Ｒｍａｘ＝
４−であった。なお、クラッド材の銅層表面は、ブラ
シにより機械的研摩がなされており、その表面粗さがＲ
ＩＩＩａｘ−１２−であるものを使用した。(Example 3 of the present invention) Cu and Ni, which are evaporation materials, were separately prepared on the same substrate as in Example 1 of the present invention using an ion blating apparatus, and a Cu roughened layer was first formed at a deposition rate of 30 persons/min. Thickness 3-
A Ni roughened layer was formed thereon to a thickness of 3 mm. When the surface roughness of the surface of this composite layer was measured, Rmax=
It was 4-. The surface of the copper layer of the cladding material is mechanically polished with a brush, and the surface roughness is R.
IIIax-12- was used.
この基板の金属粗化層表面に本発明例１と同様にしてポ
リイミド系フィルムを接着し、同様のポリイミド系フィ
ルムの引剥し試験を行った。その結果を表１に示す。A polyimide film was adhered to the surface of the metal roughening layer of this substrate in the same manner as in Invention Example 1, and the same peeling test of the polyimide film was conducted. The results are shown in Table 1.
（比較例）
本発明例１と同様の基板に、従来法であるエツチング粗
面化処理（表面粗さＲｍａｘ＝ ８４ ）を行フだもの
と、何もしない無処理のものとを作製し、同様にしてポ
リイミド系フィルムを接着し、同様のポリイミド系フィ
ルムの引剥し試験を行った。(Comparative example) On the same substrate as in Example 1 of the present invention, one without etching roughening treatment (surface roughness Rmax = 84), which is a conventional method, and one without any treatment were prepared. A polyimide film was adhered in the same manner, and a similar peeling test of the polyimide film was conducted.
その結果を表１に示す。The results are shown in Table 1.
表 １
上記表１かられかるように、本発明によるＣｕ粗化層、
Ｎｉ粗化層およびＧｕ／Ｎｉ粗化層の複合層を有する試
料はいずれも、従来のエツチング粗面化処理を施した試
料（接着力が安定し強いもの）と同等の優れたフィルム
の接着性を存する。Table 1 As can be seen from Table 1 above, the Cu roughened layer according to the present invention,
Both the samples with the Ni roughened layer and the composite layer of the Gu/Ni roughened layer had excellent film adhesion, equivalent to that of the sample subjected to the conventional etching surface roughening treatment (those with stable and strong adhesion). exists.
〈発明の効果〉
本発明の表面実装用基板によれば、銅／Ｆｅ−Ｎｉ系合
金／銅なる３層構造のクラッド材の絶縁層を接着する側
の銅層表面に、少なくとも１層の金属粗化層を設けたこ
とにより、次のような効果を生じる。<Effects of the Invention> According to the surface mounting board of the present invention, at least one metal layer is formed on the surface of the copper layer on the side to which the insulating layer of the 3-layer cladding material of copper/Fe-Ni alloy/copper is bonded. By providing the roughened layer, the following effects are produced.
（１）従来の粗面化処理は、湿式のため、Ｃｕ表面のし
み、にじみ等により安定した表面品質を保つことが困難
であったが、本発明では乾式により金属粗化層を形成す
るので、安定した表面品質が得られ、よってポリイミド
系フィルムのような絶縁層との接着性が良好となる。(1) Conventional surface roughening treatment is a wet process, which makes it difficult to maintain stable surface quality due to stains and bleeding on the Cu surface, but in the present invention, a metal roughening layer is formed using a dry process. , a stable surface quality is obtained, and therefore good adhesion with an insulating layer such as a polyimide film.
（２）従来の粗面化処理では、処理液や洗浄液のための
多量の排液処理設備が必要であったが、本発明では、こ
れが不用なので、製造コスト、設備コストの面で有利で
ある。(2) Conventional surface roughening treatment requires a large amount of wastewater treatment equipment for processing liquids and cleaning liquids, but the present invention does not require this, which is advantageous in terms of manufacturing costs and equipment costs. .
（３）従来法のように粗面化処理後の水洗浄がないため
、基板表面に水酸化被膜の生成がなく、ポリイミド系フ
ィルムとの接着性が安定し、均一な製品を量産する上で
有利である。(3) Unlike conventional methods, there is no water washing after surface roughening treatment, so there is no formation of a hydroxide film on the substrate surface, and the adhesion with the polyimide film is stable, making it easier to mass-produce uniform products. It's advantageous.
（４）蒸着、イオンブレーティング、またはイオンスパ
ッタリング等により金属粗化層を形成することにより、
その表面粗さを成膜速度、温度、出力等により自由に制
御でき、よって比較的薄いポリイミド系フィルムを接着
する場合でも金属粗化層の表面粗さを小さくすることが
でき、電気絶縁性を十分確保できる。(4) By forming a metal roughening layer by vapor deposition, ion blating, ion sputtering, etc.
The surface roughness can be freely controlled by controlling the deposition rate, temperature, output, etc. Therefore, even when bonding a relatively thin polyimide film, the surface roughness of the metal roughened layer can be reduced, and the electrical insulation properties can be improved. We can secure enough.
（５）金属粗化層の構成金属の選定、さらには金属粗化
層の複合化により、表面の後工程での加熱等により酸化
の促進を抑制することができる。(5) By selecting the constituent metals of the metal roughening layer and further by making the metal roughening layer composite, it is possible to suppress the promotion of oxidation by heating or the like in a subsequent process of the surface.
第１図および第２図は、それぞれ本発明の表面実装用基
板の断面構造を示す部分断面側面図である。
第３図は、金属粗化層の形成に用いる真空蒸着装置の構
造を模式的に示す断面図である。
第４図は、金属粗化層の形成に用いるイオンスパッタ装
置の構造を模式的に示す断面図である。
第５図は、ポリイミドフィルムの引剥し試験の実施状態
を示す斜視図である。
符号の説明
１・・・表面実装用基板、
２．４−・・銅層、
３・−インバ一層、
５．６．７−・・金属粗化層。
８・・・表面、
９・・・ポリイミド系フィルム、
１０−・・真空蒸着装置、
１１−一基板ホルダー、
１２−・・蒸着材料、
１３−・・加熱ヒーター、
１４・−排気系、
１５−・・イオンスパッタ装置、
１６−・・アノード、
１７・−カソード、
１８−−ＣｕまたはＮ１
ＦＩＧ、１
ＦＩＧ、２
Ｆ Ｉ Ｇ、 ４
Ｆ Ｉ （３，５FIG. 1 and FIG. 2 are partial cross-sectional side views showing the cross-sectional structure of the surface mounting substrate of the present invention, respectively. FIG. 3 is a cross-sectional view schematically showing the structure of a vacuum evaporation apparatus used to form a roughened metal layer. FIG. 4 is a cross-sectional view schematically showing the structure of an ion sputtering apparatus used for forming a roughened metal layer. FIG. 5 is a perspective view showing a state in which a polyimide film is subjected to a peel test. Explanation of symbols 1...Surface mounting board, 2.4--Copper layer, 3--Invar single layer, 5.6.7--Metal roughening layer. 8--Surface, 9--Polyimide film, 10--Vacuum deposition device, 11--Substrate holder, 12--Vapor deposition material, 13--Heating heater, 14--Exhaust system, 15- ...Ion sputtering device, 16--Anode, 17--Cathode, 18--Cu or N1 FIG, 1 FIG, 2 FI G, 4 FI (3,5
Claims (6)
銅からなる３層構造のクラッド材による表面実装用基板
において、 前記絶縁層を接着する側の銅層表面に、少なくとも１層
の気相めっきによる金属粗化層を設けてなることを特徴
とする表面実装基板。(1) Copper/Fe-Ni alloy used by bonding the insulating layer
A surface mounting board made of a three-layer cladding material made of copper, characterized in that at least one metal roughening layer formed by vapor phase plating is provided on the surface of the copper layer on the side to which the insulating layer is bonded. Surface mount board.
る特許請求の範囲第１項に記載の表面実装用基板。(2) The surface mounting substrate according to claim 1, wherein the metal roughening layer is a roughening layer of copper or a copper-based alloy.
である特許請求の範囲第１項に記載の表面実装用基板。(3) The surface mounting substrate according to claim 1, wherein the metal roughening layer is a roughening layer of Ni or a Ni-based alloy.
求の範囲第１項に記載の表面実装用基板。(4) The surface mounting substrate according to claim 1, wherein the metal roughening layer is a composite layer of different metals.
μｍである特許請求の範囲第１項ないし第４項のいずれ
かに記載の表面実装用基板。(5) The total thickness of the metal roughening layer is 0.001 to 200.
The surface mounting substrate according to any one of claims 1 to 4, which has a diameter of μm.
ｘ＝１×１０＾−＾３〜５μｍである特許請求の範囲第
１項ないし第５項のいずれかに記載の表面実装用基板。(6) The surface roughness of the metal roughening layer is the maximum surface height Rma
The surface mounting substrate according to any one of claims 1 to 5, wherein x=1×10^-^3 to 5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3629787A JPS63204688A (en) | 1987-02-19 | 1987-02-19 | Surface mount board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3629787A JPS63204688A (en) | 1987-02-19 | 1987-02-19 | Surface mount board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63204688A true JPS63204688A (en) | 1988-08-24 |
Family
ID=12465877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3629787A Pending JPS63204688A (en) | 1987-02-19 | 1987-02-19 | Surface mount board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63204688A (en) |
-
1987
- 1987-02-19 JP JP3629787A patent/JPS63204688A/en active Pending
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