JPS63204529A - Information recording medium and its production - Google Patents

Information recording medium and its production

Info

Publication number
JPS63204529A
JPS63204529A JP62037096A JP3709687A JPS63204529A JP S63204529 A JPS63204529 A JP S63204529A JP 62037096 A JP62037096 A JP 62037096A JP 3709687 A JP3709687 A JP 3709687A JP S63204529 A JPS63204529 A JP S63204529A
Authority
JP
Japan
Prior art keywords
spacer
ring
shaped
substrate
recording medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62037096A
Other languages
Japanese (ja)
Inventor
Hideki Matsuzawa
秀樹 松澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Holdings Corp
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Priority to JP62037096A priority Critical patent/JPS63204529A/en
Publication of JPS63204529A publication Critical patent/JPS63204529A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • B29C65/088Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations using several cooperating sonotrodes, i.e. interacting with each other, e.g. for realising the same joint
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112Single lapped joints
    • B29C66/1122Single lap to lap joints, i.e. overlap joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/302Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3022Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined
    • B29C66/30223Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being integral with at least one of the parts to be joined said melt initiators being rib-like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/302Particular design of joint configurations the area to be joined comprising melt initiators
    • B29C66/3024Particular design of joint configurations the area to be joined comprising melt initiators said melt initiators being non-integral with the parts to be joined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/40General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45Joining of substantially the whole surface of the articles
    • B29C66/452Joining of substantially the whole surface of the articles the article having a disc form, e.g. making CDs or DVDs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/70General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00Carriers for sound or information
    • B29L2017/001Carriers of records containing fine grooves or impressions, e.g. disc records for needle playback, cylinder records
    • B29L2017/003Records or discs
    • B29L2017/005CD''s, DVD''s

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Optical Record Carriers And Manufacture Thereof (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To permit satisfactory joining by providing joints between substrates and spacers on both sides of spacers and welding annular projections of diameters different from each other to the substrates. CONSTITUTION:The disk substrate 51 is installed on a receiving jig 58, on which the inner spacer 53 and outer spacer 55 are placed. An ultrasonic welding horn 57 is then lowered to melt the annular projections 54b, 56b which are provided on the inside and outside spacers on the side in contact with the substrates, by which the ultrasonic welding is executed. The upper disk substrate is then put on the lower substrate with the spacer formed with the welded part of the inner spacer and the welded part of the outer spacer on the lower side. These substrates are subjected to the ultrasonic welding operation. Two sheets of the substrates 51a, 51b of the resultant information recording medium are welded and joined to each other with the respective recording layers 52a, 52b positioned on the inside. The good durability to the exfoliation of the substrates and the spacers by a change in environmental conditions, etc., is thereby obtd.

Description

【発明の詳細な説明】 [発明の分野] 本発明は、情報記録媒体およびその製造法に関するもの
である。さらに、ty t、 <は本発明は、エアーサ
ンドイッチ構造の情報記録媒体の製造法に係る改良に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to an information recording medium and a method for manufacturing the same. Furthermore, the present invention relates to an improvement in a method for manufacturing an information recording medium having an air sandwich structure.

[発明の技術的背に」] 近年において、レーザービーム等の高エネルギー密度の
ビームを用いる情報記録媒体が開発され、実用化されて
いる。この情報記録媒体は光ディスクと称され、ビデオ
・ディスク、オーディオ・ディスク、さらには人容!1
1静11−画像フアイルおよび大容丑コンピュータ用デ
ィスク・メモリーとして使用されつるものである。
[Technical background of the invention] In recent years, information recording media that use high energy density beams such as laser beams have been developed and put into practical use. This information recording medium is called an optical disc, and includes video discs, audio discs, and even human discs! 1
1 - Used as image files and disk memory for large-capacity computers.

光ディスクは、基本構造としてプラスチック、ガラス等
からなる円盤状の透明J^板と、この上に設けられた記
録層とを有する。記録層が設けられる側の基板表面には
、基板の平面性の改み、記録層との接着力の四トあるい
は光ディスクの感度の向トなとの点から、高分子−物質
からなる上塗層または中間層が設けられている場合があ
る。
The basic structure of an optical disk is a disk-shaped transparent plate made of plastic, glass, etc., and a recording layer provided thereon. The surface of the substrate on which the recording layer is provided is coated with an overcoat made of a polymeric material, from the viewpoint of improving the flatness of the substrate, improving the adhesive strength with the recording layer, and improving the sensitivity of the optical disc. Layers or intermediate layers may be provided.

尤ディスクとしては各種の態様のものが知られているか
、近年では、基板を記録層が内側になるようにして、内
外のスペーサを介して接合したエアーサンドイッチ構造
のものが一般的となっている。
Various types of disks are known, and in recent years, air sandwich structures in which the substrate is joined with the recording layer on the inside through inner and outer spacers have become common. .

従来、エアーサンドイッチ構造の光ディスクの組1′/
′、は、ディスク基板に内側スペーサおよび外側スペー
サを接着剤、特に紫外線峡化型接着剤を用いて接、/′
iして行なうものが一般的であった。しかし、接着剤を
用いて各部材を接合する場合には、−ディスク当り接着
剤塗布および接着剤同化に各々数1−秒から数分の時間
を要し、:11産性に乏しいため、これを解決する手段
として、両側表面に突起を備えたスペーサを用い、超?
″f波融着法によりその突起を熔融して、J、4板に融
着させることからなる接合方法が考えられている(例、
特開昭61−80535号公報)。たたし、スペーサの
突起を溶融する場合において、ディスク基板の片側から
遠い側の突起は溶融しにくいため、遠い側の突起と基板
とが接合の強度不足を引き起こすとの問題を生ずる。
Conventionally, a set 1' of optical discs with an air sandwich structure
′, the inner spacer and the outer spacer are attached to the disk substrate using an adhesive, especially an ultraviolet ray-curable adhesive, /′
It was common to do this by However, when joining each member using adhesive, it takes several seconds to several minutes to apply the adhesive and assimilate the adhesive per disk, and the productivity is poor. As a means to solve this problem, we used a spacer with protrusions on both sides to create a super
A joining method has been considered in which the protrusions are melted using the f-wave fusion method and fused to the J4 plate (for example,
JP-A-61-80535). However, when the protrusions of the spacer are melted, the protrusions on the far side from one side of the disk substrate are difficult to melt, resulting in a problem of insufficient bonding strength between the protrusions on the far side and the substrate.

1−記の問題を解決するために、ト記特開昭61−80
535号公報には、第1図のように、トドから超音波振
動ホーンを当てて、突起を同時に充分に溶融させて基板
に接合する技術が示されている。すなわち、Mif波融
着機10は、M f″f波発振機18から発振する超?
°f波をコンバータ17を経て超音波融着ホーン15.
16により融着させるように構成されている。融着操作
を行なうに際しては、ド側の超音波融着ホーン16の上
に、まず記録層12をイfする基板11が置かれ、その
ににそれぞれの両側表面に突起を有する内側スペーサ1
3と外側スペーサ14が置かれ、次いで別の基板19が
その上に置かれる。そして、その上に−を側の超音波融
着ホーン15があてられ、上下から同時にM?′!f波
かスペーサに送られ、融着が行なわれる。しかし、この
ような構造のM&波融着機は般的ではなく、特別に製作
する必要があり、技術的には超z″を波の振動位相のマ
ツチング、振動強度のバランスを正確に調整する必要が
あり、構成が複雑になるという問題があった。
In order to solve the problem described in 1-1,
As shown in FIG. 1, Japanese Patent No. 535 discloses a technique in which an ultrasonic vibrating horn is applied from a sea lion to sufficiently melt the protrusions at the same time and bond them to the substrate. That is, the Mif wave fusion splicer 10 emits super?
The °f waves are passed through a converter 17 to an ultrasonic welding horn 15.
16 for fusion bonding. When performing the fusing operation, first the substrate 11 on which the recording layer 12 is to be attached is placed on the ultrasonic fusing horn 16 on the side, and then the inner spacer 1 having protrusions on both sides of the substrate is placed on the substrate 11.
3 and an outer spacer 14 are placed and then another substrate 19 is placed on top. Then, the - side ultrasonic welding horn 15 is placed on top of it, and M? ′! F-waves are sent to the spacer to effect fusion. However, M & wave fusing machines with this type of structure are not common, and must be specially manufactured.Technically, it is necessary to match the vibration phase of ultra-Z'' waves and accurately adjust the balance of vibration intensity. However, there was a problem in that the configuration was complicated.

また、同しく特開昭61−80535号公報中において
、まずスペーサと下側の基板とをスペーサに設けた突起
を溶融して接合し、次いで」−側の基板を、残るスペー
サの突起を溶融して接合するという一114+!に分け
ることも提案されている。
Also, in JP-A No. 61-80535, the spacer and the lower substrate are first joined by melting the protrusions provided on the spacer, and then the − side substrate is bonded by melting the remaining protrusions of the spacer. 114+ to join! It has also been proposed to divide it into

この場合、スペーサの両側に設けられた突起は対称位置
にあり、一方の側からkiir’を波を付与しても、他
方の側の突起も若干熔融してしまうので、最初にスペー
サと下側のJl(板とを接合するときには、基板と接合
させない側の而に設けられたスペーサの突起を、突起の
逃げ溝か設けられた受は治ttにより収容して、基板と
接合する側の突起のみが溶融するようにする必要がある
。しかし、受は治几に突起の逃げ溝を設けることは、超
音波融着機の構造が複雑になるのみならず、融11する
製造[稈をも複雑にして、実用ト好ましくない。
In this case, the protrusions provided on both sides of the spacer are in symmetrical positions, and even if you wave kiir' from one side, the protrusions on the other side will also melt slightly, so first Jl (When joining the board, the protrusion of the spacer provided on the side not to be joined to the board is accommodated by the relief groove of the projection or the support provided on the side that is not joined to the board, and the protrusion on the side to be joined to the board is However, providing relief grooves for the protrusions in the holder not only complicates the structure of the ultrasonic welding machine, but also makes it difficult to manufacture the culm. It's complicated and not practical.

[発11の[1的] 未発)Jlは、ノ、(板と内外スペーサが良好に接合さ
れた情報記録媒体およびその製造法を提供することを[
1的とする。
[Issue 11 [1] Unpublished) Jl aims to provide an information recording medium in which a plate and an inner and outer spacer are well bonded, and a method for manufacturing the same.
1 target.

[発明の要旨] 本発明は、少なくとも一方の基板に記録層が備えられて
なる二枚の円盤状基板がリング状内側スペーサとリング
状外側スペーサとを介して記録層が内側になるように接
合されたエアーサンドイッチ構造の情報記録媒体であっ
て、基板とスペーサとの接合が、各スペーサの両側に設
けられ、1いに直径の異なるリング状突起の基板への融
着によりなされていることを特徴とする情報記録媒体か
らなるものである。
[Summary of the Invention] The present invention provides two disc-shaped substrates each having a recording layer on at least one of the substrates, which are joined together via a ring-shaped inner spacer and a ring-shaped outer spacer so that the recording layer is on the inside. This is an information recording medium with an air sandwich structure, in which the substrate and the spacer are bonded to each other by fusing ring-shaped protrusions with different diameters to the substrate, which are provided on both sides of each spacer. It consists of a characteristic information recording medium.

また、本発明のエアーサンドイッチ構造の情報記録媒体
は、一方の基板の表面に、互いに直径の異なるリング状
突起が両側にそれぞれ備えられたリング状内側スペーサ
およびリング状外側スペーサを接触させて、各スペーサ
の突起と基板とを超1″を波融着させる工程、および他
の一方の基板と上記各スペーサの未融11突起とを接触
させて、各スペーサの突起と基板とを超音波融着させる
工程を含むことを特徴とする製造法により製造すること
ができる。
Further, in the information recording medium of the air sandwich structure of the present invention, a ring-shaped inner spacer and a ring-shaped outer spacer each provided with ring-shaped projections having different diameters on both sides are brought into contact with the surface of one substrate. A step of ultrasonically welding the protrusions of the spacers and the substrate by a 1" wave, and bringing the other one of the substrates into contact with the unfused 11 protrusions of each spacer, and ultrasonically welding the protrusions of each spacer and the substrate. It can be manufactured by a manufacturing method characterized by including a step of causing.

c発I11の詳細な記述コ 未発IIを、添付した図面を参照しながら詳しく説明す
る。
Detailed description of c-release I11 C-release II will be explained in detail with reference to the attached drawings.

本発明の情報記録媒体の製造に用いるスペーサの代表的
なjL様を、第2図、第3図および第4図に示す。
Typical types of spacers used in manufacturing the information recording medium of the present invention are shown in FIGS. 2, 3, and 4.

第2図は、内側スペーサ20の断面図を示している。内
側スペーサ20の両側には断面三角形状のリング状突起
21aおよびリング状突起21bがその直径を違えて設
けられている。リング状突起21aおよびリング状突起
21bの内周側および外周側の)に、部にはスペーサの
表面であるノフ板接触面23よりも低くされた樹脂流入
部22が設けられており、超音波融着法により溶融した
樹脂が流れ込むようにされている。
FIG. 2 shows a cross-sectional view of the inner spacer 20. On both sides of the inner spacer 20, a ring-shaped projection 21a and a ring-shaped projection 21b each having a triangular cross section are provided with different diameters. On the inner and outer circumferential sides of the ring-shaped protrusion 21a and the ring-shaped protrusion 21b, resin inflow portions 22 are provided which are lower than the nof plate contact surface 23, which is the surface of the spacer. The molten resin is allowed to flow in using the fusion method.

第3図は、外側スペーサ30の断面図を示している。外
側スペーサ30の両側には断面三角形状の突起31aお
よびリング状突起31bがその直径を違えて設けられて
いる。リング状突起31aおよびリング状突起31bの
内周側および外周側の基部にはスペーサの表面である基
板接触面33よりも低くされた樹脂流入部32が設けら
れており、超1°?波融11法により溶融した樹脂が流
れ込むようにしである。
FIG. 3 shows a cross-sectional view of the outer spacer 30. A protrusion 31a having a triangular cross section and a ring-shaped protrusion 31b having different diameters are provided on both sides of the outer spacer 30. At the inner and outer bases of the ring-shaped projections 31a and 31b, resin inflow portions 32 are provided that are lower than the substrate contact surface 33, which is the surface of the spacer, and have an angle of more than 1°? The resin melted by the wave melting 11 method is made to flow in.

第4図は、スペーサの一部を切り取った斜視図である。FIG. 4 is a partially cutaway perspective view of the spacer.

スペーサ40の両側には三角断面状の形状のリング状突
起41aおよびリング状突起41bかその直径を違えて
設けられている。リンク状突起41aおよびリング状突
起41bの内周側および外周側の基部にはスペーサの表
面であるJ、11.仮接触面43よりも低くされた樹脂
流入部42か設けられており、超音波融着法により溶融
した樹脂か流れ込むようにしである。また、スペーサ4
0の内周面と外周部との間の気体の流通をilT (屯
にして、エアーサンド構造の密閉時に発生しやすい、内
外の圧力差による記録媒体の変形を防ぐようにするため
に溝部44か設けられている。この溝は透孔に代えるこ
ともできる。
On both sides of the spacer 40, a ring-shaped projection 41a and a ring-shaped projection 41b each having a triangular cross-sectional shape are provided with different diameters. The inner and outer bases of the link-shaped projection 41a and the ring-shaped projection 41b are provided with spacer surfaces J, 11. A resin inflow section 42 is provided which is lower than the temporary contact surface 43, and is designed to allow resin melted by ultrasonic fusion to flow therein. Also, spacer 4
In order to prevent gas flow between the inner circumferential surface and the outer circumferential portion of the air sand structure, the grooves 44 This groove can also be replaced with a through hole.

次に、第5図と第6図とにより本発明の情報記録媒体の
製造1−程を示す。
Next, FIG. 5 and FIG. 6 show step 1 of manufacturing the information recording medium of the present invention.

第5図において、まず受は冶几58にディスク基板51
を(記録層52があるときはそれをにに向けて)設置し
、その上に内側スペーサ53および外側スペーサ55を
乗せる。次に超音波融着ホーン57を下降させて、内外
スペーサに設けられた」1L板と接する側のリング状突
起54bおよびリンク状突起56bを溶融して超?°を
波融着を実施する。この装置において、超t′を波融着
ホーン57の先端は、内外スペーサーの1−側のリング
状突起54aおよびリング状突起56aには接触しない
ような構成にしておく。
In FIG. 5, the receiver first places the disk substrate 51 on the jig 58.
(if there is a recording layer 52, it should be facing toward), and the inner spacer 53 and the outer spacer 55 are placed thereon. Next, the ultrasonic welding horn 57 is lowered to melt the ring-shaped protrusion 54b and the link-shaped protrusion 56b provided on the inner and outer spacers on the side that contacts the 1L plate. ° Carry out wave fusion. In this device, the tip of the ultra-t' wave welding horn 57 is configured so as not to come into contact with the ring-shaped protrusion 54a and the ring-shaped protrusion 56a on the 1- side of the inner and outer spacers.

L記の第5図に示した操作により、ド側に内側スペーサ
の融着済の部分63および外側スペーサの融11部64
が形成されたスペーサ付き下側基板の1−に、ト側ディ
スクJ、I−板(記録層52がある場合にはそれを1−
側に向けて)をかぶせ、第5図により示した操作と同様
の超音波融着操作を実施する。なお、このとき用いる超
fr、波融着ホーン61は第5図のものとは異なり、内
外スペーサの上側にあるリング状突起54a、56aを
覆うように構成されている。そして、未溶融のリング状
突起54a、56aが溶融されて内外スペーサと基板と
の超音波融着が完了する。
By the operation shown in FIG.
1- of the lower substrate with a spacer on which the disk J and I- plate (if there is a recording layer 52, place it 1-)
(toward the side) and perform an ultrasonic welding operation similar to that shown in FIG. Note that the ultra-fr wave welding horn 61 used at this time is different from the one shown in FIG. 5, and is configured to cover the ring-shaped protrusions 54a and 56a on the upper sides of the inner and outer spacers. Then, the unmelted ring-shaped protrusions 54a and 56a are melted, and the ultrasonic welding between the inner and outer spacers and the substrate is completed.

なお、第6図の融着過程において、スペーサの突起高さ
くAの寸法)が超音波融着完了時にはゼロとなり、ディ
スクの空隙62の体積が減少するため、空隙62と外気
の間に気体の流通口を設けないと空隙62内の圧力がト
昇し、ディスクJ^板を変形させ、記録ITt生性能等
に問題が生ずることがある。これを防止するため、内外
スペーサの少なくとも一方の、少なくとも一箇所に第4
図に示したような溝44を設けることが好ましい。
In addition, in the fusion process shown in Fig. 6, the height of the spacer protrusion (dimension A) becomes zero when the ultrasonic fusion is completed, and the volume of the gap 62 in the disk decreases, so there is no gas between the gap 62 and the outside air. If a flow port is not provided, the pressure within the gap 62 will rise, deforming the disk J^ plate, and causing problems in recording ITt raw performance and the like. In order to prevent this, at least one of the inner and outer spacers has a fourth
Preferably, a groove 44 as shown in the figure is provided.

第7図に、第5図および第6図の工程を経て完成したエ
アーサンドイッチJ%IJの情報記録媒体(光ディスク
)の断面図を示しである。
FIG. 7 shows a cross-sectional view of an air sandwich J%IJ information recording medium (optical disc) completed through the steps shown in FIGS. 5 and 6.

すなわち、得られた情報記録媒体は、二枚の基板51a
、51bが、それぞれの記録層52a、52bを内側に
して、内側スペーサ53、および外側スペーサ54を介
して融着接合している。この基板とスペーサと融着接合
は、それぞれのスペーサの突起か設けられていた部分を
中心にして実現している。
That is, the obtained information recording medium has two substrates 51a.
, 51b are fusion-bonded via an inner spacer 53 and an outer spacer 54 with their respective recording layers 52a and 52b facing inside. This fusion bonding between the substrate and the spacer is achieved centering on the portion where the protrusion of each spacer was provided.

なお、上記の説明は、本発明の情報記録媒体の好ましい
態様および好ましい製造法を述べたものであって、本発
明は、上記の態様および製造法に限定されるわけではな
い。たとえば、突起の形状は、断面が二角でなくともよ
く、公知の超音波融11技術において利用される任意の
形状の突起が利用される。また、スペーサ表面に設けら
れる突起の数は、それぞれの面に一個つつである必要は
ない。また、直径の大きい突起が設けられた側のスペー
サ面を先に融着させることもできる。
Note that the above description describes preferred embodiments and preferred manufacturing methods of the information recording medium of the present invention, and the present invention is not limited to the above-described embodiments and manufacturing methods. For example, the shape of the protrusion need not be square in cross section, and any shape of the protrusion used in the known ultrasonic melting 11 technique may be used. Further, the number of protrusions provided on the spacer surface does not need to be one on each surface. Alternatively, the spacer surface on the side where the protrusion with a larger diameter is provided can be fused first.

本発明の情報記録媒体を構成する基板、記録層およびス
ペーサとしては、本発明の特徴的構成の部分以外につい
ては、公知のものが任意に利用できるので、これらにつ
いて、以下に簡単に説明する。
As the substrate, recording layer, and spacer constituting the information recording medium of the present invention, any known substrate, recording layer, and spacer can be used except for the parts that are characteristic of the present invention, and these will be briefly described below.

本発明において使用する基板は、従来より情報記録媒体
の基板として用いられている各種の材料から任、0に選
択することができる。基板の光学的特性、を面性、加工
性、取扱い性、経時安定性および製造コストなどの点か
ら、基板材料の例としては、セルキャストポリメチルメ
タクリレート、射出成形ポリメチルメタクリレート等の
アクリル樹脂:ポリ塩化ビニル、塩化ビニル共重合体等
の塩化ビニル系樹脂:エポキシ樹脂;およびポリカーボ
ネートなどの合成樹脂を好ましく挙げることかできる。
The substrate used in the present invention can be arbitrarily selected from various materials conventionally used as substrates for information recording media. In terms of the optical properties of the substrate, surface properties, processability, handling, stability over time, and manufacturing costs, examples of substrate materials include acrylic resins such as cell cast polymethyl methacrylate and injection molded polymethyl methacrylate: Preferred examples include vinyl chloride resins such as polyvinyl chloride and vinyl chloride copolymers; epoxy resins; and synthetic resins such as polycarbonate.

これらのうちで寸度安定性、透明性および・ト面性など
の点から、好ましいものはポリメチルメタクリレート、
ポリカーボネート、およびエポキシ樹脂である。
Among these, polymethyl methacrylate, polymethyl methacrylate,
Polycarbonate and epoxy resin.

記録層か設けられる側の基板表面には、゛ト面性の数片
、接着力の向上および記録層の変質の防止の目的で、F
塗層(および/または中間層)が設けられていてもよい
The surface of the substrate on which the recording layer is provided is coated with several pieces of F to improve adhesion and prevent deterioration of the recording layer.
A coating layer (and/or intermediate layer) may be provided.

ドlq¥層(および/または中間層)の材料とじては、
たとえば、ポリメチルメタクリレート、アクリル酸・メ
タクリル酸共重合体、ニトロセルロース、ポリエチレン
、ポリプロピレン、ポリカーボネート等の高分子物質ニ
ジランカップリング剤などの有機物質;および無機酸化
物(Si02、Al120.等)、無機弗化物(MgF
2)などの無機物質を挙げることができる。
As for the material of the layer (and/or intermediate layer),
For example, organic substances such as polymeric substances such as polymethyl methacrylate, acrylic acid/methacrylic acid copolymers, nitrocellulose, polyethylene, polypropylene, and polycarbonate; and inorganic oxides (Si02, Al120, etc.), Inorganic fluoride (MgF
Examples include inorganic substances such as 2).

記録層に用いられる材料の例としては、Te、Zn、I
 n、Sn、Zr、Al2、Ti、Cu、Ge、Au、
Pt等の金属;Bi、As、Sb等の゛i金属:Si等
の゛r−導体:およびこれらの合金またはこわらの組合
わせを挙げることができる。
Examples of materials used for the recording layer include Te, Zn, I
n, Sn, Zr, Al2, Ti, Cu, Ge, Au,
Examples include metals such as Pt; i-metals such as Bi, As, and Sb; r-conductors such as Si; and combinations of these alloys or stiff materials.

また、これらの金属、゛h金金属たは半導体の硫化物、
酸化物、ホウ化物、ケイ素化合物、炭化物および′や化
物等の化合物:およびこれらの化合物と金属との混合物
も記録層に用いることができる。あるいは、色素、色素
とポリマー、色素と前掲の金属および半金属との組合わ
せを利用することもできる。
In addition, these metals, ゛h gold metal or semiconductor sulfide,
Compounds such as oxides, borides, silicon compounds, carbides and oxides; and mixtures of these compounds with metals can also be used in the recording layer. Alternatively, combinations of dyes, dyes and polymers, and dyes and the aforementioned metals and metalloids can also be used.

記録層には、さらに記録層材料として公知の各種の金属
、゛h金金属るいはそれらの化合物などが含有されてい
てもよい。
The recording layer may further contain various known metals, such as gold metal or compounds thereof, as recording layer materials.

記録層は、上記材料を蒸着、スパッタリング、イオンブ
レーティング、塗41などの方法により基板にに直接に
または下塗層を介して形成することができる。記録層は
単層または重層でもよいが、その層JrJは光情報記録
に要求される光学濃度の点から一般に100〜5500
λの範囲であり、好ましくは150〜1000又の範囲
でる。
The recording layer can be formed on the substrate directly or via an undercoat layer using the above-mentioned materials by vapor deposition, sputtering, ion blasting, coating 41, or other methods. The recording layer may be a single layer or a multilayer, but the layer JrJ is generally 100 to 5500 in terms of optical density required for optical information recording.
It is in the range of λ, preferably in the range of 150 to 1000.

なお、基板の記録層が設けられる側とは反対側の表面に
は耐傷性、防湿性などを高めるために、たとえば二酸化
ケイ素、酸化スズ、弗化マグネシウムなどの無機物質:
熱可塑性樹脂、光硬化型樹脂などの高分子物質からなる
薄膜が真空蒸着、スパッタリングまたは塗布等の方法に
より設けられていてもよい。
Note that the surface of the substrate opposite to the side on which the recording layer is provided is coated with inorganic substances such as silicon dioxide, tin oxide, and magnesium fluoride to improve scratch resistance and moisture resistance.
A thin film made of a polymeric substance such as a thermoplastic resin or a photocurable resin may be provided by a method such as vacuum deposition, sputtering, or coating.

スペーサとしては、熱+4塑性樹脂製のものを用いる。As the spacer, one made of thermo+4 plastic resin is used.

超音波融着法により、基板と良好に融着するものであれ
ば、その材料に特に限定はない。本発明の目的上、7.
H板材料と同様の材料を使用することが特に好ましい。
There is no particular limitation on the material as long as it can be well fused to the substrate by the ultrasonic fusion method. For the purposes of the present invention, 7.
It is particularly preferred to use a material similar to the H-plate material.

[発明の効果] 本発明の情報記録媒体は、内外スペーサの両側にt7−
いに直径が異なるリング状突起が設けられており、スペ
ーサに対し」^板が一枚づつ超音波融着されるため、リ
ング状突起が充分に溶融して、基板と内外スペーサとが
良好な接合を形成する。
[Effects of the Invention] The information recording medium of the present invention has t7-
The ring-shaped protrusions are provided with different diameters, and the plates are ultrasonically welded one by one to the spacer, so the ring-shaped protrusions are sufficiently melted to form a good bond between the substrate and the inner and outer spacers. Form a junction.

従って環境状況の変化などによるJ、(板とスペーサと
の剥離に対する良好な耐久性が得られる。
Therefore, good durability against peeling between the plate and the spacer due to changes in environmental conditions can be obtained.

また本発明の情報記録媒体の製造法は、上記のように良
好な接合をしている情報記録媒体を、従来の超?“f波
融着機および超音波融着技術を使用して、製造すること
ができる。従って、複雑な超音波融着機を使用しなくて
もすみ、特別に超音波融着機を製作する必要がない。ま
た、製造工程が簡素化されており、hf産性も良い。
Furthermore, the method for manufacturing an information recording medium of the present invention can produce an information recording medium with good bonding as described above, compared to conventional methods. “It can be manufactured using f-wave fusion machine and ultrasonic fusion technology.Therefore, there is no need to use complicated ultrasonic fusion machine, and specially fabricated ultrasonic fusion machine. There is no need. Furthermore, the manufacturing process is simplified and the HF productivity is good.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、上下から超音波ホーンを対向させて配置しk
Mrf波融着機による公知の超音波融着法を示す断面図
である。 第2図は、リング状突起を備えた内側スペーサの断面図
である。 第3図は、リング状突起を備えた外側スペーサの断面図
である。 第4図は、スペーサの部分斜視図である。 第5図および第6図は、本発明の情報記録媒体の製造工
程の例を示す断面図である。 第7図は、本発明の情報記録媒体の構成の例を示す断面
図である。 10.50.65: M rf 波融Rat17.59
:コンバータ 18.60:超音波発振機 15.16.57.61:超音波ホーン13、!4,2
0.3o、4oニスペーサ11.51:基板 12.52:記録層 21a、21b、31a、31b、41a。 41b、54a、54b、56a、56b、リンク状突
起 22.32.42 : PA脂流入部 44:溝部 23.33.43 : J、t、板接触面62:空隙 63.64:融着部 51a、5 l b : J、p板 52a、52b:記録層 53:内側スペーサ 54:外側スペーサ 特許出願人 富ト写真フィルム株式会社代 理 人 ブ
を埋ト  柳 川 泰 男第2図 第3図 第4図 第5図 へり 第6図 第7図
Figure 1 shows how the ultrasonic horns are placed facing each other from above and below.
1 is a cross-sectional view showing a known ultrasonic welding method using an Mrf wave welder. FIG. 2 is a cross-sectional view of an inner spacer with a ring-shaped protrusion. FIG. 3 is a cross-sectional view of an outer spacer with a ring-shaped protrusion. FIG. 4 is a partial perspective view of the spacer. 5 and 6 are cross-sectional views showing an example of the manufacturing process of the information recording medium of the present invention. FIG. 7 is a sectional view showing an example of the structure of the information recording medium of the present invention. 10.50.65: M rf wave melt Rat17.59
: Converter 18.60: Ultrasonic oscillator 15.16.57.61: Ultrasonic horn 13,! 4,2
0.3o, 4o spacer 11.51: substrate 12.52: recording layer 21a, 21b, 31a, 31b, 41a. 41b, 54a, 54b, 56a, 56b, link-shaped projections 22.32.42: PA fat inflow section 44: groove section 23.33.43: J, t, plate contact surface 62: gap 63.64: fused section 51a , 5 l b: J, P plates 52a, 52b: Recording layer 53: Inner spacer 54: Outer spacer Patent applicant: Tomito Photo Film Co., Ltd. Representative Yasushi Yanagawa Figure 2 Figure 3 Figure 4 Figure 5 Edge Figure 6 Figure 7

Claims (1)

【特許請求の範囲】 1、少なくとも一方の基板に記録層が備えられてなる二
枚の円盤状基板がリング状内側スペーサとリング状外側
スペーサとを介して記録層が内側になるように接合され
たエアーサンドイッチ構造の情報記録媒体であって、基
板とスペーサとの接合が、各スペーサの両側に設けられ
、互いに直径の異なるリング状突起の基板への融着によ
りなされていることを特徴とする情報記録媒体。 2、リング状内側スペーサとリング状外側スペーサの少
なくとも一方に、スペーサの内周面と外周面との間の気
体の流通を可能にする溝部もしくは透孔が備えられてい
ることを特徴とする特許請求の範囲第1項記載の情報記
録媒体。 3、少なくとも一方の基板に記録層が備えられてなる二
枚の円盤状基板がリング状内側スペーサとリング状外側
スペーサとを介して記録層が内側になるように接合され
たエアーサンドイッチ構造の情報記録媒体の製造法であ
って、 一方の基板の表面に、互いに直径の異なるリング状突起
が両側にそれぞれ備えられたリング状内側スペーサおよ
びリング状外側スペーサを接触させて、各スペーサの突
起と基板とを超音波融着させる工程、および他の一方の
基板と上記各スペーサの未融着突起とを接触させて、各
スペーサの突起と基板とを超音波融着させる工程とを含
むことを特徴とする情報記録媒体の製造法。 4、突起の内周側および/または外周側の基部がスペー
サの表面よりも低くされたスペーサを用いることを特徴
とする特許請求の範囲第3項記載の情報記録媒体の製造
法。 5、スペーサの突起の断面形状が三角形をなすことを特
徴とする特許請求の範囲第3項記載の情報記録媒体の製
造法。 6、リング状内側スペーサとリング状外側スペーサの少
なくとも一方が、スペーサの内周面と外周面との間の気
体の流通を可能にする溝部もしくは透孔が備えられてい
ることを特徴とする特許請求の範囲第3項記載の情報記
録媒体の製造法。 
[Claims] 1. Two disc-shaped substrates each having a recording layer on at least one of the substrates are joined together via a ring-shaped inner spacer and a ring-shaped outer spacer so that the recording layer is on the inside. An information recording medium having an air sandwich structure, characterized in that the substrate and the spacer are bonded to each other by welding ring-shaped protrusions that are provided on both sides of each spacer and have different diameters to the substrate. Information recording medium. 2. A patent characterized in that at least one of the ring-shaped inner spacer and the ring-shaped outer spacer is provided with a groove or a through hole that allows gas to flow between the inner circumferential surface and the outer circumferential surface of the spacer. An information recording medium according to claim 1. 3. Information on an air sandwich structure in which two disc-shaped substrates each having a recording layer on at least one substrate are joined via a ring-shaped inner spacer and a ring-shaped outer spacer so that the recording layer is on the inside. A method for manufacturing a recording medium, the method comprising: contacting a ring-shaped inner spacer and a ring-shaped outer spacer each having ring-shaped projections with different diameters on both sides with the surface of one substrate; the projections of each spacer and the substrate; and a step of bringing the other one of the substrates into contact with the unfused protrusions of each spacer and ultrasonically welding the protrusions of each spacer and the substrate. A method for manufacturing an information recording medium. 4. The method for manufacturing an information recording medium according to claim 3, characterized in that a spacer is used in which the inner and/or outer bases of the protrusions are lower than the surface of the spacer. 5. The method of manufacturing an information recording medium according to claim 3, wherein the protrusion of the spacer has a triangular cross-sectional shape. 6. A patent characterized in that at least one of the ring-shaped inner spacer and the ring-shaped outer spacer is provided with a groove or a through hole that allows gas to flow between the inner circumferential surface and the outer circumferential surface of the spacer. A method for manufacturing an information recording medium according to claim 3.
JP62037096A 1987-02-20 1987-02-20 Information recording medium and its production Pending JPS63204529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62037096A JPS63204529A (en) 1987-02-20 1987-02-20 Information recording medium and its production

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62037096A JPS63204529A (en) 1987-02-20 1987-02-20 Information recording medium and its production

Publications (1)

Publication Number Publication Date
JPS63204529A true JPS63204529A (en) 1988-08-24

Family

ID=12488046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62037096A Pending JPS63204529A (en) 1987-02-20 1987-02-20 Information recording medium and its production

Country Status (1)

Country Link
JP (1) JPS63204529A (en)

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