JPS6320446U - - Google Patents

Info

Publication number
JPS6320446U
JPS6320446U JP11410786U JP11410786U JPS6320446U JP S6320446 U JPS6320446 U JP S6320446U JP 11410786 U JP11410786 U JP 11410786U JP 11410786 U JP11410786 U JP 11410786U JP S6320446 U JPS6320446 U JP S6320446U
Authority
JP
Japan
Prior art keywords
lead
semiconductor device
molded
molded resin
side surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11410786U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11410786U priority Critical patent/JPS6320446U/ja
Publication of JPS6320446U publication Critical patent/JPS6320446U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP11410786U 1986-07-24 1986-07-24 Pending JPS6320446U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11410786U JPS6320446U (zh) 1986-07-24 1986-07-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11410786U JPS6320446U (zh) 1986-07-24 1986-07-24

Publications (1)

Publication Number Publication Date
JPS6320446U true JPS6320446U (zh) 1988-02-10

Family

ID=30996537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11410786U Pending JPS6320446U (zh) 1986-07-24 1986-07-24

Country Status (1)

Country Link
JP (1) JPS6320446U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340456A (ja) * 1989-07-07 1991-02-21 Matsushita Electron Corp 樹脂封止半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340456A (ja) * 1989-07-07 1991-02-21 Matsushita Electron Corp 樹脂封止半導体装置

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