JPH0233453U - - Google Patents
Info
- Publication number
- JPH0233453U JPH0233453U JP11135188U JP11135188U JPH0233453U JP H0233453 U JPH0233453 U JP H0233453U JP 11135188 U JP11135188 U JP 11135188U JP 11135188 U JP11135188 U JP 11135188U JP H0233453 U JPH0233453 U JP H0233453U
- Authority
- JP
- Japan
- Prior art keywords
- portions
- terminals
- integrated
- external connection
- sealing resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135188U JPH0233453U (zh) | 1988-08-24 | 1988-08-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11135188U JPH0233453U (zh) | 1988-08-24 | 1988-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0233453U true JPH0233453U (zh) | 1990-03-02 |
Family
ID=31349317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11135188U Pending JPH0233453U (zh) | 1988-08-24 | 1988-08-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0233453U (zh) |
-
1988
- 1988-08-24 JP JP11135188U patent/JPH0233453U/ja active Pending