JPS63201337U - - Google Patents
Info
- Publication number
- JPS63201337U JPS63201337U JP9307687U JP9307687U JPS63201337U JP S63201337 U JPS63201337 U JP S63201337U JP 9307687 U JP9307687 U JP 9307687U JP 9307687 U JP9307687 U JP 9307687U JP S63201337 U JPS63201337 U JP S63201337U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- integrated circuit
- hybrid integrated
- substrate
- molding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000012778 molding material Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 239000011800 void material Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9307687U JPS63201337U (en, 2012) | 1987-06-16 | 1987-06-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9307687U JPS63201337U (en, 2012) | 1987-06-16 | 1987-06-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63201337U true JPS63201337U (en, 2012) | 1988-12-26 |
Family
ID=30955349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9307687U Pending JPS63201337U (en, 2012) | 1987-06-16 | 1987-06-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63201337U (en, 2012) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094744A (ja) * | 1983-10-27 | 1985-05-27 | Nippon Denso Co Ltd | 混成集積回路装置 |
-
1987
- 1987-06-16 JP JP9307687U patent/JPS63201337U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094744A (ja) * | 1983-10-27 | 1985-05-27 | Nippon Denso Co Ltd | 混成集積回路装置 |