JPS6320038U - - Google Patents
Info
- Publication number
- JPS6320038U JPS6320038U JP11388386U JP11388386U JPS6320038U JP S6320038 U JPS6320038 U JP S6320038U JP 11388386 U JP11388386 U JP 11388386U JP 11388386 U JP11388386 U JP 11388386U JP S6320038 U JPS6320038 U JP S6320038U
- Authority
- JP
- Japan
- Prior art keywords
- pressure sensor
- diaphragm
- semiconductor pressure
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
第１図は従来の半導体圧力センサの断面構造図
、第２図及び第３図は本考案の実施例をしめす断
面構造図であり、１はダイアフラム、２はステム
ホルダ、３はセンサステム、４はリード線、５は
金属リング、６はフランジ部である。
FIG. 1 is a cross-sectional structural diagram of a conventional semiconductor pressure sensor, and FIGS. 2 and 3 are cross-sectional structural diagrams showing an embodiment of the present invention, where 1 is a diaphragm, 2 is a stem holder, 3 is a sensor stem, and 4 is a The lead wire, 5 is a metal ring, and 6 is a flange portion.
Claims (1)
、ステムホルダ端部にダイアフラムを固着し、且
つ内部に流体を封入した半導体圧力センサにおい
て、キヤツプ形ダイアフラムをステムホルダ端部
側からみて凹状になるようにステムホルダ端部に
固着したことを特徴とする半導体圧力センサ。 (2) ダイアフラムにフランジを設けた実用新案
登録請求の範囲第(1)項の半導体圧力センサ。 (3) ダイアフラムの周縁部に金属リングを結合
せしめた実用新案登録請求の範囲第(1)項の半導
体圧力センサ。[Scope of Claim for Utility Model Registration] (1) In a semiconductor pressure sensor in which a sensor stem is installed inside a stem holder, a diaphragm is fixed to the end of the stem holder, and a fluid is sealed inside, the cap-shaped diaphragm is inserted from the end of the stem holder. A semiconductor pressure sensor, characterized in that it is fixed to the end of a stem holder so as to have a concave shape when viewed from the outside. (2) A semiconductor pressure sensor according to claim (1) of the utility model registration, in which a diaphragm is provided with a flange. (3) The semiconductor pressure sensor according to claim (1) of the utility model registration, in which a metal ring is bonded to the peripheral edge of the diaphragm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11388386U JPS6320038U (en) | 1986-07-24 | 1986-07-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11388386U JPS6320038U (en) | 1986-07-24 | 1986-07-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6320038U true JPS6320038U (en) | 1988-02-09 |
Family
ID=30996100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11388386U Pending JPS6320038U (en) | 1986-07-24 | 1986-07-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6320038U (en) |
-
1986
- 1986-07-24 JP JP11388386U patent/JPS6320038U/ja active Pending
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