JPS63197377U - - Google Patents

Info

Publication number
JPS63197377U
JPS63197377U JP8875187U JP8875187U JPS63197377U JP S63197377 U JPS63197377 U JP S63197377U JP 8875187 U JP8875187 U JP 8875187U JP 8875187 U JP8875187 U JP 8875187U JP S63197377 U JPS63197377 U JP S63197377U
Authority
JP
Japan
Prior art keywords
hole
board
paint
tapered portion
sucked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8875187U
Other languages
English (en)
Other versions
JPH0627981Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987088751U priority Critical patent/JPH0627981Y2/ja
Publication of JPS63197377U publication Critical patent/JPS63197377U/ja
Application granted granted Critical
Publication of JPH0627981Y2 publication Critical patent/JPH0627981Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例の要部断面図、第２
図は従来の基板にペーストを被着せしめている状
況を示す断面図、第３図イ，ロは従来の基板に条
件を変えてペーストを被着させた場合の被着状況
を示す断面図である。 ３……基板、４……テーパ部、Ａ……径の大き
い孔、Ｂ……径の小さい孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. 径の異なる複数のスルーホール印刷用貫通孔を
    有し、一方の面に導電塗料を塗布してこれを他方
    の面側より吸引することにより、前記塗料が前記
    貫通孔内壁に被着せしめられるプリント回路形成
    用基板において、前記貫通孔のうち径の大きい貫
    通孔の前記一方の面側に、該一方の面側に行くに
    従つて拡径するテーパ部を形成したことを特徴と
    するプリント回路形成用基板。
JP1987088751U 1987-06-09 1987-06-09 プリント回路形成用基板 Expired - Lifetime JPH0627981Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987088751U JPH0627981Y2 (ja) 1987-06-09 1987-06-09 プリント回路形成用基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987088751U JPH0627981Y2 (ja) 1987-06-09 1987-06-09 プリント回路形成用基板

Publications (2)

Publication Number Publication Date
JPS63197377U true JPS63197377U (ja) 1988-12-19
JPH0627981Y2 JPH0627981Y2 (ja) 1994-07-27

Family

ID=30947126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987088751U Expired - Lifetime JPH0627981Y2 (ja) 1987-06-09 1987-06-09 プリント回路形成用基板

Country Status (1)

Country Link
JP (1) JPH0627981Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832236A (ja) * 1994-07-13 1996-02-02 Nec Corp 多層セラミック基板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096875U (ja) * 1983-12-09 1985-07-02 アルプス電気株式会社 両面回路基板
JPS61104579U (ja) * 1984-12-13 1986-07-03

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6096875U (ja) * 1983-12-09 1985-07-02 アルプス電気株式会社 両面回路基板
JPS61104579U (ja) * 1984-12-13 1986-07-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832236A (ja) * 1994-07-13 1996-02-02 Nec Corp 多層セラミック基板

Also Published As

Publication number Publication date
JPH0627981Y2 (ja) 1994-07-27

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