JPS63197356U - - Google Patents
Info
- Publication number
- JPS63197356U JPS63197356U JP8986187U JP8986187U JPS63197356U JP S63197356 U JPS63197356 U JP S63197356U JP 8986187 U JP8986187 U JP 8986187U JP 8986187 U JP8986187 U JP 8986187U JP S63197356 U JPS63197356 U JP S63197356U
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- chip
- substrate
- bonding
- metallized wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000012212 insulator Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8986187U JPS63197356U (sl) | 1987-06-10 | 1987-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8986187U JPS63197356U (sl) | 1987-06-10 | 1987-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197356U true JPS63197356U (sl) | 1988-12-19 |
Family
ID=30949226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8986187U Pending JPS63197356U (sl) | 1987-06-10 | 1987-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197356U (sl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993017457A1 (en) * | 1989-07-01 | 1993-09-02 | Ryo Enomoto | Substrate for mounting semiconductor and method of producing the same |
-
1987
- 1987-06-10 JP JP8986187U patent/JPS63197356U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993017457A1 (en) * | 1989-07-01 | 1993-09-02 | Ryo Enomoto | Substrate for mounting semiconductor and method of producing the same |