JPS63197336U - - Google Patents
Info
- Publication number
- JPS63197336U JPS63197336U JP8814887U JP8814887U JPS63197336U JP S63197336 U JPS63197336 U JP S63197336U JP 8814887 U JP8814887 U JP 8814887U JP 8814887 U JP8814887 U JP 8814887U JP S63197336 U JPS63197336 U JP S63197336U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chips
- semiconductor
- bonding wires
- sealed
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8814887U JPS63197336U (fr) | 1987-06-08 | 1987-06-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8814887U JPS63197336U (fr) | 1987-06-08 | 1987-06-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63197336U true JPS63197336U (fr) | 1988-12-19 |
Family
ID=30945996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8814887U Pending JPS63197336U (fr) | 1987-06-08 | 1987-06-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63197336U (fr) |
-
1987
- 1987-06-08 JP JP8814887U patent/JPS63197336U/ja active Pending