JPS63197336U - - Google Patents

Info

Publication number
JPS63197336U
JPS63197336U JP8814887U JP8814887U JPS63197336U JP S63197336 U JPS63197336 U JP S63197336U JP 8814887 U JP8814887 U JP 8814887U JP 8814887 U JP8814887 U JP 8814887U JP S63197336 U JPS63197336 U JP S63197336U
Authority
JP
Japan
Prior art keywords
semiconductor chips
semiconductor
bonding wires
sealed
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8814887U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8814887U priority Critical patent/JPS63197336U/ja
Publication of JPS63197336U publication Critical patent/JPS63197336U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP8814887U 1987-06-08 1987-06-08 Pending JPS63197336U (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8814887U JPS63197336U (fr) 1987-06-08 1987-06-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8814887U JPS63197336U (fr) 1987-06-08 1987-06-08

Publications (1)

Publication Number Publication Date
JPS63197336U true JPS63197336U (fr) 1988-12-19

Family

ID=30945996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8814887U Pending JPS63197336U (fr) 1987-06-08 1987-06-08

Country Status (1)

Country Link
JP (1) JPS63197336U (fr)

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