JPS63197049U - - Google Patents
Info
- Publication number
- JPS63197049U JPS63197049U JP1987088872U JP8887287U JPS63197049U JP S63197049 U JPS63197049 U JP S63197049U JP 1987088872 U JP1987088872 U JP 1987088872U JP 8887287 U JP8887287 U JP 8887287U JP S63197049 U JPS63197049 U JP S63197049U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- carrier
- holding
- pores
- distributing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011148 porous material Substances 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- 239000012050 conventional carrier Substances 0.000 description 2
Description
第１図〜第４図はそれぞれ本考案のキヤリヤの
第１〜第４実施例を示す正面図、第５図はその使
用状態の要部断面図、第６図は従来のキヤリヤの
正面図、第７図Ａ〜Ｄは従来のキヤリヤの歪につ
いて説明する断面図である。
１０，２０，３０，４０……キヤリヤ、１２，
２２……ワーク保持穴、１３，２３，３３，４３
……細孔。
1 to 4 are front views showing the first to fourth embodiments of the carrier of the present invention, FIG. 5 is a sectional view of essential parts of the carrier in use, and FIG. 6 is a front view of a conventional carrier. FIGS. 7A to 7D are cross-sectional views illustrating distortion of conventional carriers. 10, 20, 30, 40... Carrier, 12,
22...Work holding hole, 13, 23, 33, 43
……pore.
Claims (1)
重複しない位置に、応力を分散、吸収させるため
の複数の細孔を円周状に配設したことを特徴とす
る平面研磨装置用キヤリヤ。 A carrier for a flat surface polishing apparatus, characterized in that a plurality of pores for distributing and absorbing stress are arranged in a circumferential manner at positions that do not overlap with workpiece holding holes for fitting and holding a workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088872U JPH0713964Y2 (en) | 1987-06-09 | 1987-06-09 | Carrier for flat polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088872U JPH0713964Y2 (en) | 1987-06-09 | 1987-06-09 | Carrier for flat polishing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63197049U true JPS63197049U (en) | 1988-12-19 |
| JPH0713964Y2 JPH0713964Y2 (en) | 1995-04-05 |
Family
ID=30947352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987088872U Expired - Lifetime JPH0713964Y2 (en) | 1987-06-09 | 1987-06-09 | Carrier for flat polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713964Y2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007015105A (en) * | 2006-09-25 | 2007-01-25 | Hoya Corp | Polishing carrier, polishing method, and manufacturing method of substrate for information recording medium |
| JP2012181897A (en) * | 2011-03-02 | 2012-09-20 | Asahi Glass Co Ltd | Manufacturing method of glass substrate and warping direction detection device of carrier used for the method |
| JP2015503457A (en) * | 2011-12-27 | 2015-02-02 | コウベ プレシジョン テクノロジー エスディーエヌ．ビーエイチディー．Ｋｏｂｅ Ｐｒｅｃｉｓｉｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｓｄｎ．Ｂｈｄ． | Apparatus and method for providing improved polishing lines on aluminum substrate disks |
| JP2016112646A (en) * | 2014-12-16 | 2016-06-23 | 大研工業株式会社 | Grinding method of thin plate work |
| JP2018047552A (en) * | 2017-12-25 | 2018-03-29 | 信越半導体株式会社 | Evaluation method and design method of wafer holding carrier |
-
1987
- 1987-06-09 JP JP1987088872U patent/JPH0713964Y2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007015105A (en) * | 2006-09-25 | 2007-01-25 | Hoya Corp | Polishing carrier, polishing method, and manufacturing method of substrate for information recording medium |
| JP2012181897A (en) * | 2011-03-02 | 2012-09-20 | Asahi Glass Co Ltd | Manufacturing method of glass substrate and warping direction detection device of carrier used for the method |
| JP2015503457A (en) * | 2011-12-27 | 2015-02-02 | コウベ プレシジョン テクノロジー エスディーエヌ．ビーエイチディー．Ｋｏｂｅ Ｐｒｅｃｉｓｉｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｓｄｎ．Ｂｈｄ． | Apparatus and method for providing improved polishing lines on aluminum substrate disks |
| JP2016112646A (en) * | 2014-12-16 | 2016-06-23 | 大研工業株式会社 | Grinding method of thin plate work |
| JP2018047552A (en) * | 2017-12-25 | 2018-03-29 | 信越半導体株式会社 | Evaluation method and design method of wafer holding carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0713964Y2 (en) | 1995-04-05 |
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