JPS63196356U - - Google Patents
Info
- Publication number
- JPS63196356U JPS63196356U JP8832787U JP8832787U JPS63196356U JP S63196356 U JPS63196356 U JP S63196356U JP 8832787 U JP8832787 U JP 8832787U JP 8832787 U JP8832787 U JP 8832787U JP S63196356 U JPS63196356 U JP S63196356U
- Authority
- JP
- Japan
- Prior art keywords
- solder tank
- tank
- cam
- solder
- trochanter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１〜５図はこの考案の第１実施例を示し、第
１図はハンダ付け装置の概略側面図、第２図はハ
ンダ付け装置の概略正面図、第３図はハンダ槽の
降下状態の概略説明図、第４図はハンダ槽の引出
状態の概略説明図、第５図はハンダ槽の収納状態
の概略説明図である。第６，７図はこの考案の第
２実施例を示し、第６図はハンダ槽の降下状態の
概略説明図、第７図はハンダ槽の収納状態の概略
説明図である。第８，９図はこの考案の第３実施
例を示し、第８図はブレーキモータを付設した状
態の一部概略正面図、第９図はブレーキモータを
付設した状態の概略側面図である。
図において、２はハンダ付け装置、４はハンダ
槽、６は基板、８は搬送機構、１０は上下動機構
、１２は架台、１６は保持体、１８はカム、２０
は傾斜カム面、２２はローラ、２４は移動支持台
、２８は載置台、３４はねじ軸、４２はハンドル
、そして４４はストツパである。
Figures 1 to 5 show the first embodiment of this invention, Figure 1 is a schematic side view of the soldering device, Figure 2 is a schematic front view of the soldering device, and Figure 3 is the lowered state of the soldering tank. 4 is a schematic explanatory diagram of the solder tank in a pulled out state, and FIG. 5 is a schematic explanatory diagram of the solder tank in a stored state. 6 and 7 show a second embodiment of this invention, FIG. 6 is a schematic explanatory diagram of the lowered state of the solder tank, and FIG. 7 is a schematic explanatory diagram of the stored state of the solder tank. 8 and 9 show a third embodiment of this invention, FIG. 8 being a partial schematic front view with a brake motor attached, and FIG. 9 a schematic side view with the brake motor attached. In the figure, 2 is a soldering device, 4 is a soldering bath, 6 is a substrate, 8 is a transport mechanism, 10 is a vertical movement mechanism, 12 is a pedestal, 16 is a holder, 18 is a cam, and 20
22 is an inclined cam surface, 22 is a roller, 24 is a movable support base, 28 is a mounting base, 34 is a screw shaft, 42 is a handle, and 44 is a stopper.
Claims (1)
を収容するハンダ槽を設け、このハンダ槽を上下
方向に移動させるべく傾斜カム面を有するカムと
このカムの傾斜カム面に接する転子とからなるハ
ンダ槽上下動機構を設け、このハンダ槽上下動機
構の前記カムと前記転子とを相対移動させること
により前記ハンダ槽を上下動させる構成としたこ
とを特徴とするハンダ槽の支持装置。 A solder tank is provided which contains a solder melt to be deposited on a predetermined location on the lower surface of a substrate, and is composed of a cam having an inclined cam surface to move the solder tank in the vertical direction, and a trochanter in contact with the inclined cam surface of the cam. 1. A support device for a solder tank, characterized in that a tank vertical movement mechanism is provided, and the solder tank is moved up and down by relatively moving the cam and the trochanter of the solder tank vertical movement mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088327U JPH0511019Y2 (en) | 1987-06-08 | 1987-06-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987088327U JPH0511019Y2 (en) | 1987-06-08 | 1987-06-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63196356U true JPS63196356U (en) | 1988-12-16 |
| JPH0511019Y2 JPH0511019Y2 (en) | 1993-03-17 |
Family
ID=30946342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987088327U Expired - Lifetime JPH0511019Y2 (en) | 1987-06-08 | 1987-06-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0511019Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56149484U (en) * | 1981-03-25 | 1981-11-10 | ||
| JPS59140063U (en) * | 1983-03-08 | 1984-09-19 | 近藤 権士 | solder bath |
-
1987
- 1987-06-08 JP JP1987088327U patent/JPH0511019Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56149484U (en) * | 1981-03-25 | 1981-11-10 | ||
| JPS59140063U (en) * | 1983-03-08 | 1984-09-19 | 近藤 権士 | solder bath |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0511019Y2 (en) | 1993-03-17 |
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