JPH044051U - - Google Patents

Info

Publication number
JPH044051U
JPH044051U JP4628990U JP4628990U JPH044051U JP H044051 U JPH044051 U JP H044051U JP 4628990 U JP4628990 U JP 4628990U JP 4628990 U JP4628990 U JP 4628990U JP H044051 U JPH044051 U JP H044051U
Authority
JP
Japan
Prior art keywords
solder
plating device
scraping plate
scraping
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4628990U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4628990U priority Critical patent/JPH044051U/ja
Publication of JPH044051U publication Critical patent/JPH044051U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Coating With Molten Metal (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例に係る半田めつき装
置の斜視図、第2図は同装置の断面図断面図、第
3図は本考案の他の実施例に係る半田めつき装置
の断面図、第4図は掻落し板の他の例を示す断面
図、第5図は従来の半田めつき装置の概略断面図
である。 1……半田槽、5……溶融半田、6,6a,6
b……移動水平軸、8,8a,8b,8c……掻
落し板。
FIG. 1 is a perspective view of a solder plating device according to an embodiment of the present invention, FIG. 2 is a sectional view of the same device, and FIG. 3 is a perspective view of a solder plating device according to another embodiment of the present invention. 4 is a sectional view showing another example of a scraping plate, and FIG. 5 is a schematic sectional view of a conventional solder plating device. 1... Solder tank, 5... Molten solder, 6, 6a, 6
b...Movement horizontal axis, 8, 8a, 8b, 8c...Scraping plate.

Claims (1)

【実用新案登録請求の範囲】 半田槽に貯溜された溶融半田表面の酸化物を掻
落す掻落し板を備えた半田めつき装置において、 上記掻落し板を半田槽上方の移動水平軸に揺動
自在に取付けたことを特徴とする半田めつき装置
[Scope of Claim for Utility Model Registration] A solder plating device equipped with a scraping plate for scraping off oxides on the surface of molten solder stored in a solder tank, in which the scraping plate is oscillated on a horizontal axis of movement above the solder tank. A solder plating device characterized by being freely installed.
JP4628990U 1990-04-26 1990-04-26 Pending JPH044051U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4628990U JPH044051U (en) 1990-04-26 1990-04-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4628990U JPH044051U (en) 1990-04-26 1990-04-26

Publications (1)

Publication Number Publication Date
JPH044051U true JPH044051U (en) 1992-01-14

Family

ID=31561243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4628990U Pending JPH044051U (en) 1990-04-26 1990-04-26

Country Status (1)

Country Link
JP (1) JPH044051U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101482319B1 (en) * 2012-11-07 2015-01-13 주식회사 포스코 Apparatus for collecting top dross of plating bath

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101482319B1 (en) * 2012-11-07 2015-01-13 주식회사 포스코 Apparatus for collecting top dross of plating bath

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