JPS6319608A - Optical coupling device - Google Patents
Optical coupling deviceInfo
- Publication number
- JPS6319608A JPS6319608A JP16370986A JP16370986A JPS6319608A JP S6319608 A JPS6319608 A JP S6319608A JP 16370986 A JP16370986 A JP 16370986A JP 16370986 A JP16370986 A JP 16370986A JP S6319608 A JPS6319608 A JP S6319608A
- Authority
- JP
- Japan
- Prior art keywords
- optical
- memory alloy
- shape memory
- optical fiber
- coupling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 51
- 230000008878 coupling Effects 0.000 title claims description 17
- 238000010168 coupling process Methods 0.000 title claims description 17
- 238000005859 coupling reaction Methods 0.000 title claims description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 38
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 32
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 238000012544 monitoring process Methods 0.000 claims 1
- 239000013307 optical fiber Substances 0.000 abstract description 31
- 238000000034 method Methods 0.000 abstract description 8
- 230000009466 transformation Effects 0.000 abstract description 6
- 229910000734 martensite Inorganic materials 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910017401 Au—Ge Inorganic materials 0.000 description 1
- 102000004190 Enzymes Human genes 0.000 description 1
- 108090000790 Enzymes Proteins 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、光フアイバ通信に使用される光学結合装置に
関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to an optical coupling device used in optical fiber communications.
（従来の技術）
光フアイバ通信においては、伝送路である光ファイバと
半導体レーザ、発光ダイオード、フォトダイオード、レ
ンズ等の光学素子とを高効率かっ安定に光学結合させる
必要がある。ところが、通信用光ファイバはコア径が単
一モードファイバで約１０−１多モードフアイバでは約
５０−というように極めて細いため、光学素子を光ファ
イバと結合して設置する場合に、組立時の位置ずれによ
って結合効率が低下するという問題があった。従来、こ
のような問題を解決するため、第８，９図１こ示すよう
な方法がとられている。すなわち半導体レーザ素子（１
１または光ファイバ（４）の４部のいずれか一方を塑性
変形部で支えられた基台の上に保持し、光学素子や光フ
アイバ端末部を半田等で固定した後、塑性変形部を変形
させて光学素子と光フアイバ端末部との位置関係を調整
することにより高い結合効率を得ようとするものである
。(Prior Art) In optical fiber communication, it is necessary to optically couple optical fibers serving as transmission paths with optical elements such as semiconductor lasers, light emitting diodes, photodiodes, and lenses in a highly efficient and stable manner. However, communication optical fibers have a core diameter of approximately 10-1 for single-mode fibers, and approximately 50- for multi-mode fibers. There was a problem in that the coupling efficiency decreased due to the positional shift. Conventionally, in order to solve such problems, methods as shown in FIGS. 8 and 9 have been used. That is, a semiconductor laser element (1
1 or the 4 parts of the optical fiber (4) is held on a base supported by the plastically deformable part, and after fixing the optical element and the optical fiber terminal part with solder etc., the plastically deformable part is deformed. The objective is to obtain high coupling efficiency by adjusting the positional relationship between the optical element and the optical fiber terminal.
（発明が解決しようとする問題点）
この方法によると、塑性変形部を有する基台に接触し、
調整方向に加圧できる礒構が外部に必要であり、また塑
性変形を行うために外力を加える接触子をさし入れる空
間を要し、装置が小型な場合や複雑な構造をもつ場合に
はＤ４整が困難になるという欠点があった。(Problems to be Solved by the Invention) According to this method, contacting a base having a plastically deformed portion,
An external pressure structure that can apply pressure in the adjustment direction is required, and a space is required to insert a contactor that applies external force to perform plastic deformation. There was a drawback that D4 adjustment became difficult.
本発明は上述した問題点を解消したもので、固定時の位
置ずれを固定後の調整によって解消でき調整は非接触で
も行うことのできる機構を内蔵する構成をもつ光学結合
装置を提供することにある。The present invention solves the above-mentioned problems, and aims to provide an optical coupling device having a built-in mechanism that allows positional deviation during fixation to be eliminated by adjustment after fixation, and adjustment can be made without contact. be.
（問題点を解決するための手段）
本発明は、光半導体素子または光学素子のいずれか一方
を形状記憶合金を界して基台に保持し、半田付等の固定
後、形状記憶合金部材にｍ間質化を与え、形状の変化に
よって光半導体素子と光学素子の最適な位置関係を得る
ものである。(Means for Solving the Problems) The present invention holds either an optical semiconductor element or an optical element on a base across a shape memory alloy, and after fixing by soldering etc., the shape memory alloy member is attached to a shape memory alloy member. This provides m-interstitialization and obtains an optimal positional relationship between the optical semiconductor element and the optical element by changing the shape.
（作 用）
本発明によれば、光半導体素子と光学素子の位置関係を
調整機蓉を装置内部に有しているため、外部に位ｆ変位
をおこさせる駆動機得が不必委である。また形状記憶合
金部材の！７！度上昇によって位置調整を行うため、加
熱または光ファイバ等ｉこ導かれた光エネルギの照射等
の非接触な方法で調整を行うことができる。したがって
、複雑な構成をもつ装置も対応ができ、小型化が可能に
なる。(Function) According to the present invention, since the apparatus has a mechanism for adjusting the positional relationship between the optical semiconductor element and the optical element inside the apparatus, there is no need for a driving mechanism to cause a displacement to the outside. Also shape memory alloy parts! 7! Since the position is adjusted by increasing the temperature, the adjustment can be performed by a non-contact method such as heating or irradiation with light energy guided through an optical fiber or the like. Therefore, devices with complicated configurations can also be accommodated, and miniaturization becomes possible.
光半導体素子、光学素子を固定した後に調整を行なうの
で、高精度固定技術は必要ではなく組立が容易になる。Since adjustments are made after the optical semiconductor element and optical element are fixed, high-precision fixing technology is not required and assembly becomes easy.
形状記憶効果は非可逆であるため、−旦調幣した後は長
期にわたって安定な結合状態を保つことができる。Since the shape memory effect is irreversible, a stable bond can be maintained for a long period of time after the coin is minted.
（実施例）
第１図は本発明による光学結合装置の第１の実施例を示
す断面図、第２図は平面図である。半導体レーザ素子（
１１はヒートシンク（２）を介して第１の基台（３）に
Ａｕ−Ｇｅ停の半田によ−て固定されている。(Embodiment) FIG. 1 is a sectional view showing a first embodiment of an optical coupling device according to the present invention, and FIG. 2 is a plan view. Semiconductor laser element (
11 is fixed to the first base (3) via a heat sink (2) with Au-Ge solder.
第１の基台（３）は両側面で形状記憶合金部材！７１
、 ＋８＋に半田１１ｏによって固定され、形状記憶合
金部＃ ［７１は他の面で容器（６）に固定されている
。（４）は発光素子の出力光を入射する光ファイバであ
り、入射端を半導体レーザ素子に近接し、光フアイバ固
定台に半田付されている。棒状の形状記憶合金部材（７
）（８）は高温で熱処理された後に、マルテンサイト変
態温度以下で軸方向に圧縮変形したものを使用する。変
態温度は形状記憶合金と第１の基台で３）、容器（６）
の固定に使用する半田の溶融温度よりも高い材料を使用
する必要がある。The first base (3) is made of shape memory alloy on both sides! 71
, +8+ by solder 11o, and the shape memory alloy part # [71 is fixed to the container (6) on the other side. (4) is an optical fiber through which the output light of the light emitting element is input, the input end of which is placed close to the semiconductor laser element, and is soldered to an optical fiber fixing base. Rod-shaped shape memory alloy member (7
) (8) is heat treated at a high temperature and then compressively deformed in the axial direction below the martensitic transformation temperature. The transformation temperature is 3) for the shape memory alloy and the first base, and the transformation temperature for the container (6)
It is necessary to use a material that has a higher melting temperature than the solder used for fixing.
第３図はＩＡ整方法を説明する図である。各素子の組立
終了後、牛導体し−ザ≠子［１１を駆動し、光ファイバ
に結合した光量を元ファイバの他端に接続したパワーメ
ータαのによってモニターする。−方の形状記憶合金部
材（７）ｌこ外部に設けられたレーザ光源α３から他の
光ファイバＩによ−て４かれたレーザ光を照射し、温度
上昇によってマルテンサイト変態温度に到達すると高温
時で記１．αした形状が復元されるので、第３図矢印の
向きへ半導体レーザ素子は移動する。この過程における
パワーメータの変動を読み、最〕Ａ位１４においてレー
ザ光の照射を止める。逆方向へ＃動するには、もう一方
の形状記憶合金部材（８）ヘレーザ光８照射すればよい
。以上の動作をくり返すことにより非接触で、半導体レ
ーザ素子＋１１ （！：光ファイバ（４）の位Ｉｇ関係
を調節することができる。このように、径が細く自由に
曲げることができる光ファイバを用いているので小さな
空１間があれば形状記憶合金部材＋７１ 、 ＋８）へ
のレーザ光の照射が可能であり、複雑な構成をもつ光学
結合装置にも対応できる。また形状記憶合金部材（７）
、（８）は部分的に昇温されるため、半田固定部分の温
度は箱出の溶融６度をこえることはない。FIG. 3 is a diagram explaining the IA adjustment method. After assembling each element, the conductor 11 is driven, and the amount of light coupled to the optical fiber is monitored by a power meter α connected to the other end of the original fiber. The shape memory alloy member (7) on the other side is irradiated with a laser beam emitted from a laser light source α3 provided externally through another optical fiber I, and when the temperature rises and reaches the martensitic transformation temperature, the temperature rises. Recorded in time 1. Since the α shape is restored, the semiconductor laser element moves in the direction of the arrow in FIG. The fluctuation of the power meter during this process is read, and the laser beam irradiation is stopped at the A position 14. To move in the opposite direction, the other shape memory alloy member (8) may be irradiated with laser light 8. By repeating the above operations, the Ig relationship of the semiconductor laser element +11 (!: optical fiber (4)) can be adjusted without contact. Since it uses a small space, it is possible to irradiate the shape memory alloy members +71, +8) with laser light, and it can also be used in optical coupling devices with complicated configurations. Also shape memory alloy member (7)
, (8) are partially heated, so the temperature of the solder-fixed part does not exceed the boxed melting temperature of 6 degrees.
第４図は本発明による第２実施例を示す側面図、第５図
は同じく平面図である。第１の実施例に、さらに１対の
形状記憶合金部材ａ９ ｔαｅを、形状記憶合金製部材
＋７１ 、 （８）と直交する方向へ半導体レーザ素子
（１）を保持する基台（３ンと容器（６）の間に半田付
したものである。これにより光半導体レーザ素子（１）
と光ファイバ（４）との間の距離を調整することができ
る。またさらに１対の形状記憶合金調整部材を上述の２
対の形状記憶合金部材に直交する方向に設けることで３
軸方向の１４整が可能になる。FIG. 4 is a side view showing a second embodiment of the present invention, and FIG. 5 is a plan view thereof. In addition to the first embodiment, a pair of shape memory alloy members a9tαe are attached to the base (3 and the container) for holding the semiconductor laser element (1) in the direction orthogonal to the shape memory alloy member +71, (8). (6) is soldered.This makes the optical semiconductor laser element (1)
and the optical fiber (4) can be adjusted. Furthermore, a pair of shape memory alloy adjustment members are added to the above-mentioned 2.
3 by providing in the direction perpendicular to the pair of shape memory alloy members.
14 alignments in the axial direction are possible.
第６図は第３の実施例を示す断面図である。＋ＩＩは形
状合金製スリーブで両端において光導体レーザ（１）を
保持する基台（ｌＩと光ファイバを保持容器■に半田付
才たは圧入によって固定されている。形状記憶合金スリ
ーブαｌは高温で熱処理された後、低温で軸方向に圧縮
もしくはひっばり変形されたものを使用する。したがっ
て、外部レーザ光源から導かれたレーザ光をスリーブａ
３に部分的に照射することにより熱弾性型マルテンサイ
ト逆変態温度に到達するとスリーブの一部は高温時に記
憶した形状に復元しようとし、結果的に曲がりを生じる
。これより光ファイバ（４）の光軸からの半導体レーザ
（１）の軸ずれを補正することが可能となる。FIG. 6 is a sectional view showing the third embodiment. +II is a shape-memory alloy sleeve with both ends holding the optical fiber (lI) and the optical fiber fixed to the holding container (■) by soldering or press-fitting.The shape-memory alloy sleeve αl is After being heat-treated, it is compressed or flattened in the axial direction at a low temperature.Therefore, the laser beam guided from the external laser light source is passed through the sleeve a.
When the thermoelastic martensite reverse transformation temperature is reached by partial irradiation of the sleeve, a portion of the sleeve attempts to restore the shape it memorized at high temperature, resulting in bending. This makes it possible to correct the axis deviation of the semiconductor laser (1) from the optical axis of the optical fiber (4).
第７図は、本発明による第４の実施例を示す断面図であ
る。図において■は半導体レーザ索子を保持する基台、
１２υは光ファイバを保持する容器、＠は半導体レーザ
素子からの出力光を光ファイバ（４）端面に収束させる
ための球レンズ（２３）が圧入されている形状記憶合金
製スリーブである。図のような構成にすることにより、
球レンズを中心としてスリーブの半導体レーザ側に外部
レーザ光源から導かれたレーザ光を照射して半導体レー
ザ素子と球レンズ、スリーブの光フアイバ側にレーザ光
を照射して光ファイバと球レンズの光軸ずれを調整する
ことが可能である。FIG. 7 is a sectional view showing a fourth embodiment of the present invention. In the figure, ■ is the base that holds the semiconductor laser probe;
12υ is a container that holds the optical fiber, and @ is a shape memory alloy sleeve into which a ball lens (23) for converging the output light from the semiconductor laser element onto the end face of the optical fiber (4) is press-fitted. By configuring as shown in the figure,
Laser light guided from an external laser light source is irradiated on the semiconductor laser side of the sleeve centering on the ball lens, and the laser light is irradiated on the semiconductor laser element and the ball lens, and the optical fiber side of the sleeve to generate light from the optical fiber and the ball lens. It is possible to adjust the axis misalignment.
第６，７図においては、半導体レーザ（１）に通電する
ためのリード線およびボンディングワイヤーは省略した
。In FIGS. 6 and 7, lead wires and bonding wires for supplying current to the semiconductor laser (1) are omitted.
第８図は本発明によるＭ５の実施例を示した図である。FIG. 8 is a diagram showing an embodiment of M5 according to the present invention.
これは２波双方向波長多重通信用送受信器であり、図に
おいて（２９）は酵電体多層膜（７）を貼り付けたプリ
ズム、（３１）は半導体受光素子を保持する基台、（３
２）は半導体レーザ素子を保持する基台、 （３３）
は球レンズおよび光ファイバ１４を保持する共通ポート
、（３４） 、 （３５）は第４の実施例で示した球レ
ンズが圧入されている形状記憶合金製スリーブである。This is a transmitter/receiver for two-wave bidirectional wavelength multiplexing communication, and in the figure (29) is a prism to which a enzyme multilayer film (7) is pasted, (31) is a base holding a semiconductor photodetector, and (3
2) is a base that holds a semiconductor laser element, (33)
Reference numerals denote a common port for holding the ball lens and the optical fiber 14, and (34) and (35) designate sleeves made of shape memory alloy into which the ball lenses shown in the fourth embodiment are press-fitted.
この構造によれば、光軸合わせはプリズム（２９） 、
共通ボー） （３３） 、 （３ｔ） 、 （３２）を
とりつけた形状記憶合金スリーブ（３４） 、 （３５
）を基台に固定した後、形状記憶合金スリーブへのレー
ザ光照射によって可能であるので、組立の際には高精度
な固定法を必要としない利点がある。According to this structure, optical axis alignment is performed using a prism (29),
Shape memory alloy sleeve (34), (35) attached with common bow) (33), (3t), (32)
) is fixed to the base and then the shape memory alloy sleeve is irradiated with laser light, so there is an advantage that a highly precise fixing method is not required during assembly.
形状記憶合金の温度を上昇させる手段として、光ファイ
バで導かれたレーザ光を例にとったが、レンズ、ミラー
等を使用してレーザ光を照射してもよい。レーザ源は高
出力発振の可能なＣＯ，レーザ、ＹＡＧレーザ、Ａｒレ
ーザ等を用いることが望ましい。また、赤外線ランプを
用いて加熱することも可能である。半田ごて等の熱源を
接触させ温度を上昇させてもよい。Although a laser beam guided through an optical fiber has been taken as an example of a means for increasing the temperature of the shape memory alloy, a lens, a mirror, etc. may be used to irradiate the laser beam. As the laser source, it is desirable to use a CO laser, a YAG laser, an Ar laser, or the like capable of high-output oscillation. It is also possible to heat using an infrared lamp. The temperature may be raised by bringing a heat source such as a soldering iron into contact with it.
なお、実施例では光半導体素子として半導体レーザ素子
（１）、光学素子として光ファイバ、球レンズを用いた
が、これに限らず光半導体素子として発光ダイオード、
フォトダイオード等の光検出器等を、光学素子として集
束性光伝導体、光スイ。In addition, in the example, a semiconductor laser element (1) was used as an optical semiconductor element, an optical fiber, and a ball lens were used as an optical element, but the optical semiconductor element is not limited to this, but a light emitting diode, a light emitting diode,
Photodetectors such as photodiodes are used as optical elements such as focusing photoconductors and optical switches.
チ、光合分波器、平面型尋波路等を使用することができ
る。Optical multiplexer/demultiplexer, planar waveguide, etc. can be used.
また容器（６）内には光半導体素子、光学素子の他に発
導体発光素子を駆動する電子回路や光検出器の出力を増
幅する電子回路、半導体発光素子の光出力をモニターす
るフォトダイオードを組み込んでもよい。In addition to the optical semiconductor element and the optical element, the container (6) also contains an electronic circuit that drives the light emitting diode, an electronic circuit that amplifies the output of the photodetector, and a photodiode that monitors the light output of the semiconductor light emitting element. May be incorporated.
本発明によれば、固定時の位置ずれを固定後の調整によ
って、解消できる光学結合装置を得ることができる。According to the present invention, it is possible to obtain an optical coupling device in which positional deviation during fixation can be eliminated by adjustment after fixation.
第１図は本発明の第１の実施例を示す側面図、第２図は
同じく平面図、第３図は第１の実施例において調節方法
を説明するための図、第４図は第２の実施例を示す側面
図、第５図は同じく平面図、第６図は第３の実施例を示
す断面図、第７図は第４の実施例を示す断面図、第８図
は第５の実施例を示す図、第９図は従来例を示す側面図
、第１０図は同じく平面図である。
１・・・半導体レーザ素子、２・・・ヒートシンク、３
．１８．２１・・・半導体レーザ基台、４・・・光ファ
イバ、５・・・光フアイバ基台、６，９．２０・・・容
器、７゜８．１６，１７．１９，２３，３４．３５・・
・形状記憶合金部材、１０．１１・・・半田、１２・・
・パワーメータ、１３・・・レーザ光源、１４・・・光
ファイバ、１５・・・半導体レーザ駆動用′１Ｎ！源、
２２・・・球レンズ、２４・・・ファイバ保持部、２５
・・・容器固定部、２６・・・塑性変形部、２７・・・
リード線％ ２８・・・基台、２９・・・プリズム、３
０・・・誘電体多層膜、３３・・・共通ボート、第１図
ｆρ
第２図
第４図
第５図
第６図
第７図
第９図
第１０図FIG. 1 is a side view showing the first embodiment of the present invention, FIG. 2 is a plan view, FIG. 3 is a diagram for explaining the adjustment method in the first embodiment, and FIG. 5 is a plan view, FIG. 6 is a sectional view showing the third embodiment, FIG. 7 is a sectional view showing the fourth embodiment, and FIG. 8 is a sectional view showing the fifth embodiment. FIG. 9 is a side view showing a conventional example, and FIG. 10 is a plan view. 1... Semiconductor laser element, 2... Heat sink, 3
．． 18.21... Semiconductor laser base, 4... Optical fiber, 5... Optical fiber base, 6,9.20... Container, 7°8.16, 17.19, 23, 34 .35...
・Shape memory alloy member, 10.11...Solder, 12...
・Power meter, 13... Laser light source, 14... Optical fiber, 15... Semiconductor laser drive '1N! source,
22... Ball lens, 24... Fiber holding part, 25
... Container fixing part, 26... Plastic deformation part, 27...
Lead wire% 28...Base, 29...Prism, 3
0... Dielectric multilayer film, 33... Common boat, Fig. 1 fρ Fig. 2 Fig. 4 Fig. 5 Fig. 6 Fig. 7 Fig. 9 Fig. 10
Claims (6)
１の基台と、前記光半導体素子と光学的結合を行う光学
素子と、この光学素子を保持する第２の基台と、前記第
１の基台もしくは第２の基台の少なくとも一方に、温度
上昇により形状が変化し前記光半導体素子と前記光学素
子との光学的結合を調整する如く固定されている形状記
憶合金部材とを具備することを特徴とする光学結合装置
。(1) an optical semiconductor element, a first base that holds this optical semiconductor element, an optical element that optically couples with the optical semiconductor element, a second base that holds this optical element, and the A shape memory alloy member is fixed to at least one of the first base and the second base so as to change its shape due to temperature rise and adjust the optical coupling between the optical semiconductor element and the optical element. An optical coupling device comprising:
、前記光半導体素子と、前記光学素子との位置関係を段
階的に調整されたものであることを特徴とする特許請求
の範囲第１項記載の光学結合装置。(2) The shape memory alloy member has a positional relationship between the optical semiconductor element and the optical element adjusted in stages by a partial temperature increase. The optical coupling device described in Section 1.
、Ａｒレーザ、赤外線ランプの照射によることを特徴と
する特許請求の範囲第１項記載の光学結合装置。(3) The optical coupling device according to claim 1, wherein the temperature increase is caused by irradiation with a CO_2 laser, a YAG laser, an Ar laser, or an infrared lamp.
させることにより温度することを特徴とする特許請求の
範囲第１項記載の光学結合装置。(4) The optical coupling device according to claim 1, wherein the shape memory alloy member is heated by contacting or bringing a heat source close to it.
前記光半導体素子と前記光学素子のいずれか一方からの
出力をモニターしながら調整されることを特徴とする特
許請求の範囲第１項記載の光学結合装置。(5) The positional relationship between the optical semiconductor element and the optical element is
The optical coupling device according to claim 1, wherein the optical coupling device is adjusted while monitoring the output from either the optical semiconductor element or the optical element.
ｕと２０〜３０％のＡｌとの合金であることを特徴とす
る特許請求の範囲第１項記載の光学結合装置。(6) The shape memory alloy member contains 70 to 80% by weight of C.
The optical coupling device according to claim 1, wherein the optical coupling device is an alloy of U and 20 to 30% Al.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16370986A JPS6319608A (en) | 1986-07-14 | 1986-07-14 | Optical coupling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16370986A JPS6319608A (en) | 1986-07-14 | 1986-07-14 | Optical coupling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6319608A true JPS6319608A (en) | 1988-01-27 |
Family
ID=15779143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16370986A Pending JPS6319608A (en) | 1986-07-14 | 1986-07-14 | Optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6319608A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0717393A1 (en) * | 1994-12-16 | 1996-06-19 | Sharp Kabushiki Kaisha | Method of adjusting position of a member using shape memory materials |
| JP2003005103A (en) * | 2000-09-07 | 2003-01-08 | Teruki Nobuyoshi | Optoelectronic integrated device |
-
1986
- 1986-07-14 JP JP16370986A patent/JPS6319608A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0717393A1 (en) * | 1994-12-16 | 1996-06-19 | Sharp Kabushiki Kaisha | Method of adjusting position of a member using shape memory materials |
| US5728240A (en) * | 1994-12-16 | 1998-03-17 | Sharp Kabushiki Kaisha | Positionally adjustable member and applications therefor |
| JP2003005103A (en) * | 2000-09-07 | 2003-01-08 | Teruki Nobuyoshi | Optoelectronic integrated device |
| JP4620301B2 (en) * | 2000-09-07 | 2011-01-26 | 輝己 信吉 | Optical circuit, optical switch, optical crossbar, optical filter, and optical integrated device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10054748B2 (en) | Micromechanically aligned optical assembly | |
| US6014483A (en) | Method of fabricating a collective optical coupling device and device obtained by such a method | |
| JP2000111816A (en) | Active matching photonics assembly body | |
| US20080025677A1 (en) | Optical device and manufacturing method thereof | |
| MXPA06007898A (en) | Lensed tip optical fiber and method of making the same. | |
| JP3518491B2 (en) | Optical coupling device | |
| JP2008098316A (en) | Semiconductor laser module | |
| JPS61238006A (en) | Positioning of optical coupling member | |
| EP1936414A2 (en) | Small optical package having multiple optically aligned soldered elements therein | |
| JPS60261186A (en) | Manufacture of optical module | |
| JPS6319608A (en) | Optical coupling device | |
| Paquet et al. | Edge coupling integrated optics packaging concept using liquid crystal element | |
| JPH07199002A (en) | Semiconductor laser array module | |
| van Zantvoort et al. | Fiber array-to-photonic-chip fixation and fine tuning using laser support adjustment | |
| JP2954678B2 (en) | Semiconductor laser light source device with optical fiber and method of manufacturing the same | |
| JPH1168243A (en) | Optical module and optical axis adjustment method | |
| Heikkinen et al. | Packaging considerations of fiber-optic laser sources | |
| US20230019700A1 (en) | Optical fibers fusion-splicing to waveguides | |
| JP2005214776A (en) | Optical axis deviation detection method, optical axis adjusting method, manufacturing method of optical module, and optical axis adjusting device | |
| JP4446614B2 (en) | Optical device and optical module | |
| JPH05210025A (en) | Connecting structure and connecting method for optical waveguide element and optical fiber | |
| KR100595888B1 (en) | Method for soldering using softbeam | |
| JPS6059309A (en) | Optical element coupling module | |
| JPH11271575A (en) | Optical semiconductor module | |
| JPH0843690A (en) | Semiconductor optical module |