JPH07199002A - Semiconductor laser array module - Google Patents

Abstract

PURPOSE:To efficiently couple a semiconductor laser(LD) and single-mode optical fibers(SMF) with each other by connecting a bundle type multimode optical fiber array(GMMFA) to the tip of a single-mode optical fiber array(SMFA) and making projection light on the SMFA. CONSTITUTION:The respective SMFs 31A-31D of the SMFA3 projected from the tip part of a ribbon 2 of optical fibers by certain length are arrayed on V grooves formed on a fiber array member 64. The other end of the GMMFA 4 having one end fixedly held between fiber array members 65 and 66 is arrayed while aligned with the beam waist position of the projection light from end surface GMMFA 4 of the SMFs, and covered with a fiber array member 63, which is fixed by a means such as adhesives and solder. Thus, the bundle type multimode optical fibers(GMMF) having a core diameter larger than the core diameter of each SMF is connected, so the projection light of each LD can be photodetected in a wider range than the SMFs and the permissible position precision between the respective LDs and respective GFMMFs can be relaxed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a semiconductor laser array,
The present invention relates to a semiconductor laser array module for integrating a single-mode optical fiber array and an optical connection array and efficiently coupling the light emitted from the semiconductor laser array into the single-mode optical fiber array, a method for manufacturing the same, and components thereof. is there.

[0002]

2. Description of the Related Art As a method for coupling light emitted from one semiconductor laser (hereinafter abbreviated as LD) to a single-core single-mode optical fiber (hereinafter abbreviated as SMF), conventionally, direct coupling on an end face, There are various methods such as lens coupling and fiber relay coupling.

Of these, the end face direct coupling method is one in which the laser light emitting surface of the LD and the incident surface of the SMF are precisely butted and aligned with each other, and the number of parts is small, and the adjustment of the alignment can be done only once. The spread angle of the emitted light of the LD is S
The coupling efficiency is generally low because it is larger than the acceptance angle of the MF.

Further, in the lens coupling method, usually one or more lenses are inserted between the LD and the SMF so that the spot size of the emitted light of the LD and the spot size of the SMF are the same, or the tip of the SMF. Is processed into a hemispherical shape or a conical shape, and the tip has the same effect as a lens, so that it can be coupled with high efficiency.

Further, the fiber repeater coupling system is based on the SMF.
A focused multimode optical fiber (hereinafter abbreviated as GMMF) is placed at the tip of the SMF to integrate the SMF and GMMF.
The light emitted from the LD can be coupled with high efficiency by enlarging the spot size of the above by several times at the tip of the GMMF (for example, the semiconductor laser module of Japanese Patent Laid-Open No. 2-216111). Here, instead of integrating and relaying the GMMF to the SMF, a configuration in which the light emitted from the LD is coupled with high efficiency by using a fiber in which the spot diameter of the SMF is locally enlarged (for example, “lens-free alignment-free”) is used. Integrated Optical Device "Optical Technology Contact Vol.
31. No. 3 (1993) P. 10 to 15).

Based on these coupling methods, light emitted from each LD of the semiconductor laser array (hereinafter abbreviated as LDA) of the semiconductor laser array module is used as each SMF of a single mode optical fiber array (hereinafter abbreviated as SMFA). As a method of connecting to the lens, a direct end face connection method, a lens connection method, etc. have been developed.

The above-mentioned end face direct coupling method is similar to the end face direct coupling method of LD and SMF, in which the emission surface of each laser beam of the LDA and each incidence surface of the SMFA are precisely butted and aligned. In addition, the pitch of the light emitted from the LDA and the pitch between the SMFs of the SMFA are usually as narrow as 250 μm, so it is difficult to insert an individual lens between the LD and the SMF as in the lens coupling method of the LD and the SMF. is there. Therefore, in the lens coupling method, a microlens array in which minute lenses are monolithically integrated on a glass substrate is inserted between the LDA and the SMFA to couple them with high efficiency (for example, "high NA for LD array"). Flat Micro Lens "Technical Report OCS92-42 (1992-1)
(0)), and those in which a lens is formed at the tip of each SMF of the SMFA and coupled to each other are known.

On the other hand, in the case of an optical connector having a structure similar to the combination of LDA and SMFA and connecting the SMFAs to each other in a detachable manner, the SMFs and the SMFs as they are are not connected to each SMF.
Since the variation of the coupling loss for each becomes large, the GMMF of the same outer diameter is previously coupled to the tip of each SMF,
An optical connector (for example, Japanese Patent Laid-Open No. 4-130304) that is connected via the GMMF has also been proposed.

[0009]

However, when the conventional semiconductor laser array module described above is constructed by the direct facet coupling method, the divergence angle of the emitted light of the LD is larger than the light receiving angle of the SMF, so that the coupling efficiency is high. Has a low drawback, and in addition, the SMF spot size is generally 1
Since it is as small as about 0 μm, the amount of positional deviation with respect to the optical axis is small, and each laser light emission surface of the LDA and each S of the SMFA are
It is necessary to make the matching accuracy of the incident surface of the MF highly accurate, and if the pitch accuracy between the SMFs of the SMFA is not assembled with high accuracy, the LDs and the SMFs (hereinafter, a pair of LD and SMF pair will be referred to as a pair). The variation in the coupling efficiency (referred to as channel) is a problem.

Also, unless the coefficient of thermal expansion of the material of the member for fixing each SMF of the SMFA is close to the coefficient of thermal expansion of the LDA, variations in the operating temperature tend to cause variations in the coupling efficiency between the channels. . When the lens coupling method using the microlens array is used, the microlens array is made of a glass plate and the LDA is made of a semiconductor such as Si. There is a difference, and the positional relationship between each LD and the lens corresponding thereto changes in the array direction due to the temperature change of the usage environment of the semiconductor laser array module, which causes variation in coupling efficiency between channels.

Further, when a lens is formed at the tip of each SMF of the SMFA and the lens is coupled, the SMFA is usually manufactured by bundling a plurality of SMFs in a tape shape, and thus the tape-shaped end is formed. When each SMF of each part is polished and melted by electric discharge to form a spherical or conical lens at the tip, variations in the length and tip shape of each SMF occur due to the difference in the melting state of each SMF. Cheap. Therefore, there is a problem in that the coupling efficiency between the channels tends to vary.

In any of the coupling methods, LD
In the case of coupling the arrays of A and SMFA, unlike the case of a single core, there is a drawback that variation in coupling efficiency between channels is likely to occur due to variation in angle between LDA and SMFA.

On the other hand, since the optical connectors used for connecting the SMFAs described above are connected between members made of the same material, they are unlikely to be affected by thermal expansion due to temperature changes in the operating environment. Since it does not include such a circuit, there is no need to perform airtight sealing for preventing oxidation of semiconductor elements, terminals, etc., which is required in the case of a semiconductor laser array module, and it is easier than connecting LDA and SMFA.
There is no big problem.

As described above, when the arrays of LDA and SMFA are coupled to each other, the pitch of the emitted light between the LDs and the SMFs.
Incident light pitch, or the manufacturing error of the incident light pitch of each lens, or the difference in the amount of thermal expansion, or LDA and S
Depending on the positioning error with the MFA, especially the angle error, each L
There is a problem in that the coupling efficiency between D and each SMF is lowered and variation between channels is likely to occur.

The present invention has been made in view of the above problems of the prior art.
An object of the present invention is to provide a semiconductor laser array module, a method for manufacturing the same, and a component for the same, which can achieve a highly efficient coupling between each LD and each SMF and reduce variations between channels.

[0016]

In order to achieve the above object, the present invention is a semiconductor laser array module configured so that light emitted from an LDA is incident on an SMFA, and a GMMFA is connected to the tip of the SMFA, It is characterized in that the emitted light is made incident on the SMFA via this.

The present invention, in one form thereof, is a GM.
It is characterized in that both ends of the MFA are fixed using separate alignment members.

Further, according to one aspect of the present invention, the coefficient of thermal expansion of the pitch of emitted light in the array direction of the LDA in the range of temperature change in the semiconductor laser array module,
The material whose thermal expansion coefficient is selected so that the difference between the thermal expansion amount of the incident light pitch of the optical connection array which makes the outgoing light from the LDA incident does not exceed the allowable value on the optical coupling loss, It is characterized by having an optical connection array.

The present invention, in another form, is an SMF.
An optical fiber array having a partially expanded core diameter is connected to the tip of A.

The present invention, in another form, is an LDA.
It is characterized in that the light emitted from is incident on the SMFA via two or more lenses in each fiber. As another aspect, the present invention provides another laser beam immediately before the surface directly opposite to the emission surface of the LDA so that another laser light can be incident from the surface directly opposite to the emission surface of the LDA. It is characterized in that parts for guidance are provided.

The present invention, in another form, is an LDA.
And an optical connection array for making the light emitted from the LDA incident on it is supported by a member whose intensity is locally changed, and by deforming a weaker portion of the intensity, the position between the LDA and the optical connection array is adjusted. The method is characterized by

The present invention, in another form, is an LDA.
And an optical connection array for making the emitted light from the LDA incident on it by a member whose intensity is locally changed, and by irradiating light or heat to a weaker portion of the optical connection array to deform it by thermal energy, A method of adjusting the position between the optical connection arrays is characterized.

The present invention, in another form, is an LDA.
And an optical connection array on which light emitted from the LDA is incident is supported by a member whose intensity is locally changed.

The present invention, in another form, is an SMF.
The optical connecting parts are characterized by aligning the entire lengths of the GMMFs having the same outer diameter as the respective fibers of A and arranging them at the light emission interval of the LDA to form an array.

The present invention, in another form, is an SMF.
An optical connection component in which one end or both ends of a GMMF having the same outer diameter as each fiber of A are processed into a spherical or conical shape so that their lengths are aligned with each other, and then they are arranged in an emission interval of LDA to form an array. Is characterized by.

The present invention, in another form, is a GMM.
The optical connecting part is characterized by using an optical fiber whose core diameter is partially enlarged instead of F.

The present invention, in another form, is an LDA.
And an optical connection array that allows the light emitted from the LDA to enter, is hermetically sealed.

The present invention, in another form, is an LDA.
Instead of this, it is characterized in that it is configured by a light receiving element array.

The present invention, in another form, is an LDA.
And SMFA and optical connection array from one-dimensional array to 2
It is characterized by being changed into a dimensional matrix.

In another aspect, the present invention is characterized in that the light receiving element array, the SMFA and the optical connection array are changed from a one-dimensional array shape to a two-dimensional matrix shape.

[0031]

According to the present invention, in the semiconductor laser array module configured such that the light emitted from the LDA is made incident on the SMFA, the GMMF having a core diameter larger than the core diameter of each SMF of the SMFA is preset by a predetermined length. S
Since the light emitted from the LDA is connected to the tip of the MF and is made incident on the SMFA via this, the light emitted from each LD can be received in a range larger than that of the SMF. And the allowable position accuracy between each GMMF is relaxed, and each LD of LDA and SMFA and each SM
It is possible to suppress the manufacturing error of the pitch between Fs, the difference in the amount of thermal expansion, the reduction of the coupling efficiency due to the positioning error, and the influence on the variation between the channels.

Further, in the present invention, since both ends of the GMMFA are fixed by using separate aligning members, the LDA
It is possible to select the material so that the coefficient of thermal expansion of the aligning member on the side closer to is closer to the coefficient of thermal expansion of LDA.
Since only the alignment member on the side closer to A needs to be processed so that the fibers can be aligned at a highly accurate pitch, the cost of the alignment member can be reduced. Furthermore, GMMF
A plurality of GMMFs are connected between the alignment members at both ends of A. Since the GMMF can be deformed to some extent, even when the alignment member on the far side is fixed to the LDA,
It is possible to finely move only the position of the aligning member on the side close to the position of the LDA to adjust the position with the LDA, and it is possible to suppress the decrease in coupling efficiency and the influence on variations between channels.

Further, according to the present invention, the difference in the thermal expansion amount of the member for holding each fiber of the optical connection array, which makes the light emitted from the LDA incident, within the range of temperature change in the semiconductor laser array module is caused by the optical coupling. By selecting a material having a value close to the coefficient of thermal expansion of LDA as the above-mentioned holding member so as not to exceed the allowable value on loss, the variation in the coupling efficiency between each channel due to the temperature change is kept within the allowable value. can do.

Further, according to the present invention, an optical fiber in which the core diameter of the SMF is partially enlarged is previously prepared for a certain length.
Since the tip of each SMF is connected so that the enlarged core diameter faces the side of each LD, the light emitted from the LDA is made to enter the SMFA via this, so that The light emitted from the LD can be received in a range larger than that of the SMF, and it is possible to suppress the decrease in coupling efficiency and the influence on the variation between the channels as in the case of the GMMF described above.

Further, in the present invention, the light emitted from each LD of the LDA is made into a collimated light or a substantially parallel light through a first spherical lens or the like, and then is passed through a second spherical lens or the like and then the SMFA. Since it is configured to be incident on each SMF of, it is possible to relax the allowable position accuracy between the first lens and the second lens, and between the LDA and the first lens row, and If only the first lens array and the SMFA are accurately manufactured, each LD will be connected to each SM.
It is possible to suppress the manufacturing error of the optical path up to F, the difference in the amount of thermal expansion, the decrease in the coupling efficiency due to the positioning error, and the influence on the variation between the channels.

Further, in the present invention, another laser beam is collimated or condensed from the surface opposite to the emission surface of the LDA, either as it is or by using a lens or the like.
When entering the active layer of each LD, the active layer serves as a waveguide, and the other laser light leaks from the emitting surface of the LDA during oscillation. This makes it possible to detect the emission position of each LD when the LDA is oscillated, even if the LDA is not wired during positioning or the like and cannot oscillate, and the positioning of the LDA is facilitated.

Further, according to the present invention, the member for holding the space between the optical connection arrays for making the light emitted from the LDA and the SMFA incident on is locally constituted by changing the strength, so that the LDA and the light are held on the holding member. After the connection array is roughly positioned and fixed with solder or the like, the weak-strength part of the member is mechanically deformed with screws or the like, or is irradiated with light or heat to be deformed by heat energy, so that the LDA and the optical connection array are deformed. The position of can be adjusted with high precision.

Further, in the present invention, since the light emitted from the LDA is made incident on the SMFA via the optical connection array, the range in which the LDA element is hermetically sealed with nitrogen or the like for preventing oxidation is referred to as LDA. Only the optical connection array can be used, and the SMFA can be easily attached and replaced.

Further, in the present invention, L is used instead of LDA.
Since a light receiving element array (hereinafter abbreviated as PDA) in which light receiving elements (hereinafter abbreviated as PD) are arranged at a pitch equal to the pitch of emitted light of each LD of the DA can be positioned,
It is possible to easily configure a light receiving element array module in which the light emitted from each SMF of the SMFA is incident on the PDA via the optical connection array.

Further, in the present invention, the LDA can be changed to a surface-emitting type semiconductor laser matrix capable of emitting light in a two-dimensional matrix, and the SMFA and the optical connection array can be easily arranged in a two-dimensional matrix by a structure in which one-dimensional arrays are laminated. Since it can be changed to, the semiconductor laser matrix module can be easily configured.

Further, according to the present invention, since the planar light receiving element matrix can be positioned instead of the surface emitting semiconductor laser matrix, the light receiving element matrix module can be easily constructed.

[0042]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing a configuration example of a main part of a semiconductor laser array module, and FIG. 2 is a plan view showing a partial cross section of FIG. 1 from the top, showing a partial cross section of the optical axis of each fiber. 3, FIG. 3 is a view taken along the line III-III of FIG. 2, and FIG. 4 is a perspective view showing the tip of the optical fiber tape of FIG. 5 is a view showing a state in which the front end portion of the optical fiber tape of FIG. 4 is fixed, and FIG. 6 is an explanatory diagram of an assembled state of the optical connection array of FIG.

1 to 3, 1 is an LDA,
In this case, laser light 1 is emitted at a pitch of 250 μm from LDA1.
It is assumed that 1 can be emitted from 4 places. Reference numeral 2 is an optical fiber tape which is formed by holding four SMFs aligned and held at a pitch of 250 μm. 5 is an optical connection array, and the optical connection array 5 is projected from the tip of the optical fiber tape 2 3
1A, 31B, 31C, 31D SMFs and SMFs
41A, 41B, 41C, and 41D GMMF connected corresponding to 31A, 31B, 31C, and 31D, respectively.
And a pair of upper and lower V-grooved fiber alignment members 63, 64 and 65, 66 for aligning and holding these fibers at a pitch of 250 μm. Here, 30 is SM
F31A, 31B, 31C, 31D core diameter, 40 is G
It is the core diameter of MMF 41A, 41B, 41C, 41D.

In FIG. 1, the emission direction of the LDA 1 and the optical axis direction of each fiber are the Z axis direction, the direction between the channels of each fiber, that is, the horizontal direction is the X axis direction, and the direction of the upper surface of the semiconductor laser array module, that is, , The vertical direction is defined as the Y-axis direction and the coordinate system is defined.

First, as shown in FIG. 4, the coating on the tip of the optical fiber tape 2 is removed, and the SMFs 31A and 31 are removed.
B, 31C, 31D are exposed for a certain length, or
Prepare the one exposed for a certain length. Here, when the exposed SMFs have different lengths, as shown in FIG.
Each SMF is sandwiched and fixed by a fiber alignment member 61 on the upper surface side and a fiber alignment member 62 on the lower surface side with V grooves at equal intervals of 250 μm which is the pitch of each SMF, and the end surface is polished to form each SM.
Align the length of F. When polishing the end face, it is possible to polish the end face of the fiber at a minute angle instead of polishing it perpendicularly to the optical axis to prevent reflection at the end face of the fiber.

Then, as shown in FIG. 6, SMF31A,
GMMF41A, 41B, 41C, 41D of the same outer diameter size as SMF connected to 31B, 31C, 31D,
After polishing to make the length of each fiber uniform,
One end thereof is fixed by being sandwiched by a fiber alignment member 65 on the upper surface side and a fiber alignment member 66 on the lower surface side, in which V-grooves are formed in parallel at an equal pitch of 250 μm which is the emission light pitch of each laser light of the LDA 1. . For these fiber alignment members 65 and 66, for example, V-grooves can be formed with high precision by grinding single crystal silicon using a diamond blade and performing fine V-groove processing. In addition, single crystal silicon is subjected to anisotropic V
Grooving can also be formed.

Next, the SMFs 31A, 31B and 3 of the SMFA 3 which are made to project to the tip of the optical fiber tape 2 by a certain length.
1C and 31D are aligned on the V-groove formed on the other fiber alignment member 64. Then, the other end of the GMMFA 4 fixed with one end sandwiched by the fiber alignment members 65 and 66 is aligned so that the end surface of each of these SMFs coincides with the beam waist position of the light emitted from the GMMFA 4, and the fiber from above is aligned. The alignment member 63 is covered and fixed by means such as an adhesive or soldering. Where SMFA3 and GMM
The fiber alignment members 63 and 64 for aligning the FA 4 are
The fiber alignment members 65 and 66 can be manufactured by the same method as that described above, but since they are used only for connecting each fiber on the basis of the outer diameter of each fiber, the pitch accuracy between each fiber array is The fiber alignment member 6 described above
It may be rougher than 5 and 66, and is not affected by the pitch shift due to thermal expansion, so that the groove-shaped alignment portion can be manufactured by a resin mold, a precision press, or the like.

As described above, the GMMF having the core diameter 40 larger than the core diameter 30 of each SMF is provided at the tip of each SMF of the SMFA 3, respectively, and the fiber alignment members 63 and 64.
Since the light emitted from the LDA 1 is made incident on the SMFA 3 via this connection, the light emitted from each LD can be received in a range larger than that of the SMF.
It is possible to relax the allowable position accuracy between D and each GMMF. As a result, it is possible to suppress the manufacturing error of the pitch between each LD of the LDA1 and SMFA3 and each SMF, the difference in the thermal expansion amount, the reduction of the coupling efficiency due to the positioning error, and the influence on the variation between the channels. .

Further, in this embodiment, since both ends of the GMMFA 4 are fixed by using different fiber aligning members, the coefficient of thermal expansion of the fiber aligning member (65, 66 in this embodiment) on the side closer to the LDA1. The material can be selected so as to be close to the coefficient of thermal expansion of the LDA 1, and it is sufficient to process only the fiber alignment members 65 and 66 so that the fibers can be aligned at a highly accurate pitch. The cost can be reduced as a whole. Furthermore, the two fiber alignment members that align and fix the GMMFA 4 are connected by only a plurality of GMMFs.
Since F41A, 41B, 41C, and 41D can be deformed to some extent, the fiber alignment member 6 on the side far from the LDA1
Even in a state in which 3, 64 are fixed, only the positions of the fiber alignment members 65, 66 close to the LDA 1 are finely moved to make the LD
It becomes possible to adjust the position between A1 and
It is possible to suppress the decrease in the coupling efficiency between 1 and the SMFA 3 and the influence on the variation between the channels.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 7 is a partially cross-sectional plan view showing a configuration example of the main part of the semiconductor laser array module, which is an example having an optical connection array using a fiber whose core diameter size changes.

This embodiment is based on the GMMF of the first embodiment.
In this example, an optical fiber in which the core diameter of each SMF is partially enlarged is used instead of A4. 42A, 42B, 42
C and 42D are core-diameter-size changing fibers in which the optical fibers obtained by partially enlarging the core diameter of each SMF (enlarged in a trumpet shape toward the incident side of the laser light 11 as shown in the figure) are arranged in a certain length. is there. The other structure is the same as that of the first embodiment. These core diameter size changing fibers 42A, 42B, 42C, 42D can be manufactured by a method of diffusing the dopant for controlling the refractive index distribution existing in the fibers by heat treatment with an electric furnace, a method with a micro heater, or the like.

Thus, SMF31A of SMFA3,
At the tips of 31B, 31C, 31D, SMF31A, 31
B, 31C, and 31D, the core diameter of the SMF having the same outer diameter size as the core diameter partly enlarged fiber 42A,
42B, 42C, 42D to the fiber alignment members 63, 6
4 is connected, and the light emitted from the LDA 1 is made incident on the SMFA 3 via this, so that the light emitted from each LD is received in a larger range than a normal SMF having a thin and equal core diameter. It will be possible. Therefore, each LD and each core diameter size change fiber 42A, 42B, 42C, 42
It becomes possible to relax the allowable position accuracy between D and
The same effect as that of the first embodiment can be obtained.

Next, FIG. 8 shows the GMMF 41A, 41B, 41C, 41D of the optical connection array 5 shown in FIG.
FIG. 6 is a plan view showing an optical connection component 5a including a fiber alignment member 65a and 66a.

In FIG. 8, GMMF 41A, 41B,
41C and 41D are SMs of the SMFA 3 shown in FIG.
F31A, 31B, 31C, and 31D have the same outer diameter size and are aligned to a fixed length, and then sandwiched by fiber alignment members 65a and 66a in which V-grooves are formed in parallel at the emission light pitch of each laser light of LDA1. It is fixed in an array.
In this way, by preparing various kinds of optical connection components 5a according to the pitch of emitted light and the number of emitted light of the LDA 1, it becomes possible to construct a semiconductor laser array module by the same method as in the first embodiment. As a result, each L
The emitted light of D can be received in a range larger than that of SMF, and each LD and each GMMF 41A, 41B, 41C, 41 can be received.
It is possible to relax the allowable position accuracy with respect to D.

FIG. 9 is a view showing a modified example of the optical connection part shown in FIG. Each GMMF 43A, 43 shown in FIG.
B, 43C, and 43D have the same configuration as that of each GMMF shown in FIG. 8 except that the end surface on the LDA1 side is processed and formed into a hemispherical shape (hereinafter, this end surface shape is referred to as a front spherical shape).

By making the tip of each GMMF shown in FIG. 9 into a spherical shape, the light emitted from each LD can be received in a large range by the lens effect, and the coupling efficiency between channels can be increased. In that case, the spherical lens is usually formed by melting the tip portion of each GMMF by electric discharge. Therefore, due to the difference in the molten state of each GMMF, the length of each SMF and the variation of the tip shape, for example, the size of the lens diameter, the bending of the core, the axis deviation, etc., are likely to occur. It is necessary to sort out non-defective products. However, the spherical GMMF 43A, 43B, 43
Unlike the case where a lens is formed at the tip of each SMF bundled in a tape shape, C and 43D are LDs after selecting a good product in order to suppress variation in coupling efficiency between channels.
The optical connection component 5b can be fixed in an array by sandwiching the V-grooves in parallel at the emission light pitch of each laser light of A1 by the produced fiber alignment members 65a and 66a, and the same as in the first embodiment. With the method described above, a semiconductor laser array module with good coupling efficiency can be constructed.

FIG. 10 is a diagram showing another modification of the optical connecting component shown in FIG. Each GMMF44 shown in FIG.
A, 44B, 44C, and 44D have the same configuration as that of each GMMF shown in FIG. 8 except that the end surface on the LDA1 side is formed into a conical shape so as to have a lens effect.
However, the tip of the cone is hemispherical without sharpening.

By making the tip of each GMMF shown in FIG. 10 into a conical shape, the light emitted from each LD can be received in a large range due to the lens effect, and the coupling efficiency between channels can be increased. Also in the present example, as in the case of FIG. 9 described above, after the non-defective product is selected, the fiber alignment member 6 in which V-grooves are formed in parallel at the emission light pitch of each laser light of the LDA 1
The optical connection component 5c can be sandwiched by 5a and 66a and fixed in an array, and a semiconductor laser array module with high coupling efficiency can be constructed by the same method as in the first embodiment.

FIG. 11 shows the GMM having the spherical tip shown in FIG.
It is an example of an optical connection component 5d using a core diameter size changing fiber in which the core diameter of each SMF is partially enlarged as shown in FIG. 7 instead of F. Optical fibers 45A, 45
B, 45C, and 45D have the end surface on the LDA1 side processed into a spherical shape, and like the cases of FIG. 9 and FIG. 10, after selecting non-defective products, they are arranged in parallel at the emission light pitch of each laser light of LDA1. A semiconductor laser array module having good coupling efficiency can be constructed by the same method as in the first embodiment, since the optical connection component 5d can be fixed in an array by sandwiching the grooves with the produced fiber alignment members 65a and 66a. It becomes possible to do.

In the embodiments of the optical connecting parts shown in FIGS. 9, 10 and 11, the end surface on the LDA1 side of the optical fiber for optical connection is formed in a spherical or conical shape, but the end surface on the SMF side is also formed. If necessary, it is also possible to give a lens effect by forming a spherical shape or a conical shape, and thereby it is possible to further improve the coupling efficiency.

Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 12 is a plan view showing a configuration example of the main part of the semiconductor laser array module, in which a part of the optical axis plane is sectioned, and is an example having an optical connection array in which each GMMF is replaced with two lenses.

In the above-mentioned embodiments, when the light emitted from the LDA 1 is made incident on the SMFA 3, it is made incident through an optical fiber cut into a constant length having the same outer diameter size as each SMF. An example is a configuration in which two or more lenses are used for each SMF and the light is incident on the SMFA 3 through the plurality of lenses. The other structure is the same as that of the first embodiment.

In FIG. 12, 46A, 46B and 46
C and 46D receive the light emitted from each LD of LDA1,
A condenser lens for making collimated light or substantially parallel light, and a spherical lens, a convex lens, an aspherical convex lens or the like having different focal lengths are selected and used depending on the distance from the LDA 1. Also, condenser lenses 46A, 46B, 46C, 46D
Is fixed by the fiber alignment members 65 and 66 with V-grooves having the same pitch as the emitted light so as to match the pitch of the emitted light from each LD of the LDA1. On the other hand, the SMFs 31A, 31B, 31 of the SMFA 3 which are made to protrude by a certain length from the tip of the optical fiber tape 2.
C and 31D are aligned on the V-grooves formed on the fiber alignment member 64, as in the first embodiment. afterwards,
On the LDA1 side on the same groove, condenser lenses 46A, 46B,
Condensing lenses 47A and 47 corresponding to 46C and 46D
B, 47C and 47D are connected to the condenser lenses 47A and 47D, respectively.
B, 47C, and 47D are fixed by being separated from the end surface of each SMF by about the focal length. By this, each LD of LDA1
The light emitted from the first condensing lens 46A, 46B,
Collimated light or nearly parallel light is passed through 46C and 46D, and then the second condenser lenses 47A and 47
The light is condensed through B, 47C, and 47D and is incident on the end surface of each SMF of the SMFA 3.

As described above, since the optical path between the first condenser lens and the last condenser lens is collimated light or almost parallel light, the allowable positional accuracy between these lenses can be relaxed. . Therefore, between the LDA1 and the first condenser lens 46A, 46B, 46C, 46D,
And the second condenser lenses 47A, 47B, 47C, 4
Between the 7D and the SMFA 3, it is possible to suppress the manufacturing error of the optical path from each LD to each SMF, the difference in thermal expansion, the reduction of the coupling efficiency due to the positioning error, and the influence on the variation between the channels.

Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 13 shows an example of suppressing the influence of the variation in the coupling efficiency between the channels due to the temperature variation in the temperature variation range in the semiconductor laser array module.
FIG. 3 is a plan view corresponding to FIG. 2 with the same configuration as the first embodiment. That is, the GMMF 41A, 41B, 41C, 41D is aligned and fixed by the fiber alignment members 63, 64 and 65, 66 at the tip of each SMF 31A, 31B, 31C, 31D projected at the tip of the optical fiber tape 2.
The configuration is such that the light emitted from the LDA 1 is incident.

Normally, when the LD is connected to a large-diameter GMMF having a core diameter of about several tens of μm, the output light center of the LD and the GMM are connected.
1 dB when the displacement of F from the center of the core is around 3 μm
There is some coupling loss, and when the LD is connected to the SMF having a core diameter of about 10 μm, the LD output light center and the SMF are connected.
There is a coupling loss of about 1 dB when the positional deviation from the core center of is about 1 μm.

On the other hand, the operating environment temperature of the semiconductor laser array module has a wide range of −40 ° C. to + 80 ° C.
Unless the 1 and the fiber alignment members 65 and 66 are made of materials having the same coefficient of thermal expansion, the coupling loss varies between the channels after assembly due to the difference in the thermal expansion amounts of the two. Normally, the pitch between the LDs of the LDA1 is 250 μm, and the coefficient of thermal expansion of the LDA1 made of Si is 0.0000025 / ° C. Therefore, the thermal expansion amount between the channels 1 and 2 due to the temperature change of 100 ° C in the semiconductor laser array module. L ₁₂ is L ₁₂ = 250 × 0.0000025 × 100 = 0.06 (μm) (1) The thermal expansion amounts L ₂₃ and L ₃₄ between the channels 2 and 3 and between the channels 3 and 4 have the same value.

Further, the thermal expansion coefficient of the fiber alignment members 65 and 66 is α / ° C., and the thermal expansion amount F ₁₂ between the channels 1 and 2 due to the temperature change of 100 ° C. is F ₁₂ = 250 × α × 100 (μm ) …… (2). F ₂₃ and F ₃₄ have similar values. Here, when the fiber alignment members 65 and 66 are manufactured by grinding a material other than Si, such as ceramics, the coefficient of thermal expansion α =
Since it is about 0.000007 / ° C., the thermal expansion amount F ₁₂ is F ₁₂ = 250 × 0.000007 × 100 = 0.18 (μm) (3). Ordinary LDA1 and fiber alignment members 65 and 66
Can be assumed to expand bilaterally symmetrically in the Y-axis direction (each channel direction), so in the case of four channels as shown in FIG. 13, the GMMF41A, 4
The positional deviation between 1D and LD becomes maximum. The positional shift amount S is a difference between 1/2 of the total thermal expansion amount L on the LD side and 1/2 of the total thermal expansion amount F on the GMMF side, and can be expressed by the following formula.

L = L ₁₂ + L ₂₃ + L ₃₄ (4) F = F ₁₂ + F ₂₃ + F ₃₄ (5) S = | F / 2−L / 2 | (6) In this example, the channel Since the number of channels is as small as four, the value of the positional deviation amount S is as small as 0.18 μm. However, when the number of channels is 10, the positional deviation amount S is 0.54 μm, and the array becomes larger as the number of channels increases. It can be seen that it affects the difference in coupling loss between the central part and the peripheral part of the array.

Therefore, in the present invention, the LD is set within the range of change of the operating environment temperature of the semiconductor laser array module.
1/2 of the thermal expansion amount L between the LDs at both ends of A1 and LDA1
The difference from the half of the thermal expansion amount F between the fibers at both ends of the fiber alignment member that holds the respective fibers of the optical connection array 5 on which the light emitted from is incident does not exceed the allowable value of the optical coupling loss. Thus, the thermal expansion coefficient α of the fiber alignment member is selected. By selecting the thermal expansion coefficient α, the variation in the coupling efficiency between the channels in the central portion of the array and the peripheral portion of the array due to the temperature change can be kept within the allowable value.

Here, when different fiber alignment members such as 63, 64 and 65, 66 are used at both ends of the optical connection array 5 as in the present embodiment, the coupling efficiency changes with temperature. Since the variation does not reach the fiber alignment members 63 and 64 on the optical fiber tape 2 side, the LDA1
It suffices if only the fiber aligning members 65 and 66 on the side closer to are made of a material having the above thermal expansion coefficient α.

Next, another embodiment of the semiconductor laser array module constructed so that the emitting position of the laser beam during the oscillation of the LDA can be detected will be described. FIG. 14 is a plan view of the semiconductor laser array module of this embodiment, and FIG. 15 is a side view including a partial cross section. Each LD of normal LDA1
The laser light emission position cannot be accurately detected unless the laser light is emitted from the LDA 1 by wiring the power supply to the LDA 1 to oscillate the laser light. For this reason, since the LDA 1 and the optical connection array 5 are positioned after the LDA 1 can oscillate the laser light, there are many restrictions on the assembly procedure and the module structure. LD on submount 12
The relay terminal 1 is provided just before the surface 14 opposite to the emission surface 13 of A1.
A component capable of guiding another laser beam is provided in the space between 5. For example, a reflection mirror 101 having an inclination angle of 45 ° is installed in this space, and laser light 102 is emitted from the upper surface,
The reflection mirror 101 bends the optical axis 90 ° and LD
Each LD on the surface 14 opposite to the emission surface 13 of the laser light of A1
When it is incident on the active layer (not shown), the active layer serves as a waveguide for the laser light 102, and the laser light 11 ′ leaks from the laser light emitting surface 13 when the LDA 1 oscillates. By using the leaked laser light 11 ', the emission position of each LD when the LDA1 oscillates can be detected, and even when the LDA1 cannot oscillate, the positioning of the LDA1 and the optical connection array 5 becomes easy. , LDA1 can be positioned before oscillation.

It is also possible to use a prism or the like instead of the reflection mirror 101. Further, if the laser beam 103 shown in FIG. 15 can be directly incident on the surface 14 of the LDA 1 without installing a component such as a reflection mirror or a prism, the laser beam 103 will be out of the emission surface 13 of the laser beam of the LDA 1. The laser 11 'can be used for positioning as described above.

Further, after power is supplied to the LDA 1 to oscillate, the optical connection array connection surface 79 of the module bottom plate 78 is provided.
LDA while pressing the fiber alignment members 65 and 66 against
It goes without saying that the positioning of 1 and the optical connection array 5 is possible with this configuration.

Next, examples of a method for adjusting the position between the LDA and the optical connection array and an adjusting member will be shown. 16 is a plan view of a semiconductor laser array module using a member for position adjustment, and FIG. 17 is a line AA of FIG.
The cross-sectional arrow view in a plane is shown.

The LDA 1 is connected via the submount 12
The optical connection array 5 is positioned on the module bottom plate 78 and on the optical connection array support member 7 by the method shown in FIG. In addition, LDA1 is connected to L
The DA driving IC 8 is connected to the terminal 81 by wire bonding, and laser light can be emitted by supplying power. On the other hand, the GMMFA 4 includes the fiber alignment members 63, 6
4 and 65, 66 are used to connect to the SMFA 3 protruding at the tip of the optical fiber tape 2, and
4 and 66 are fixed on the optical connection array support member 7. The optical connection array support member 7 has a structure in which the strength is locally changed by notching the member with the hinge 72,
The bottom surface 73 of the optical connection array support member 7 is used to remove the module bottom 7
Joined with 8. The positioning between the LDA1 and the GMMFA4 is mainly caused by the deviation in the X-axis direction (array direction), the deviation in the Y-axis direction, and the rotational deviation of θ _Z around the optical axis (Z direction), which are the main causes of variation in coupling loss between channels. It becomes a factor,
Especially precision is required.

First, laser light is emitted from the LDA 1 in the X-axis direction, and while monitoring the output on the optical fiber tape 2 side, the optical connection array connection surface 79 of the module bottom extraction 78 is performed.
While pressing the fiber alignment members 65 and 66, the bottom surface 73 is displaced to finely adjust the positions of the LDA 1 and the GMMFA 4 in the pitch direction, and the bottom surface 73 is fixed by soldering or the like. Further, in the Y-axis direction and in the θ _Z direction around the optical axis, the hinge 72 is more likely to be deformed than other portions, so the position adjusting screws 77A and 77B at the lower ends of both ends of the fiber alignment member 66 are equal in amount. The hinge 72 can be mechanically bent by only screwing it in, or can be bent while being twisted by unevenly screwing in the position adjusting screws 77A and 77B if necessary. This allows LDA1
It is possible to finely adjust the positions of the GMMFA 4 and the GMMFA 4 in the Y-axis direction and the θ _Z direction. If necessary, position adjustment in the X-axis direction and Y
The position adjustment accuracy can be improved by alternately repeating the position adjustments in the axis and θ _Z directions. Position adjustment screw 77
After adjusting the positions, A and 77B are fixed with an adhesive, soldering, or the like to prevent loosening.

Further, in the above-mentioned embodiment, the position adjusting screw is used to deform the weak portion of the member to adjust the position. However, by irradiating light rays or heat to deform the member by thermal energy, the LDA and the optical connection array are deformed. The Example which adjusts the position between is shown. 16 and 17 show a configuration in which the hinge 72 is deformed by the thermal energy of the laser beam for adjustment in the Y-axis direction and the θ _Z direction, instead of the position adjusting screws 77A and 77B.

Generally, as one of the bending techniques for plate materials,
It is possible to use the bending due to the thermal deformation seen in the welding deformation, and the case of utilizing the irradiation of laser light using light energy is shown as a method of locally heating. In order to deform the hinge 72 and adjust the position of the member 79 at the tip of the hinge and the GMMFA 4 in the upper surface direction 113U in the Y-axis direction, the upper surface laser light irradiation devices 111A and 111B are provided at both ends of the upper surface 72U of the hinge 72 in the X direction. The same amount of laser light is irradiated from the above to deform it by its thermal energy. Similarly, the bottom direction 11
To adjust the position in 3D, use the X on the lower surface 72D of the hinge 72.
The lower surface laser light irradiation devices 112A and 112 are provided at both ends in the direction.
The same amount of laser light is irradiated from B to deform it. At this time, L
DA1 emits a laser beam and, through the GMMFA4, while monitoring the output on the optical fiber tape 2 side, the upper surface direction 1
13U and deformation in the lower surface direction 113D can be combined to adjust to a position where coupling loss is the smallest. Further, in order to deform the hinge 72 and adjust the position of the GMMFA 4 in the θ _Z direction, the upper surface laser light irradiating device 111 is attached to one end portion of the upper surface 72U of the hinge 72 in the X direction.
It is possible to alternately irradiate from A and from 112B for the lower surface, deform with the thermal energy, and rotate in the θ _Z direction.
The rotation of θ _{Z in} the opposite direction is possible only by changing the laser irradiating device on the surface of the hinge 72 up and down to the opposite ends of 111B and 112A in the X direction. From this, θ
It can be adjusted to the position where the coupling loss is the smallest also in the _Z direction. Further, it goes without saying that the mechanical adjustment method using the position adjustment screw and the adjustment method using heat energy can be combined to adjust the position. By preparing an optical connection array supporting member configured by members whose strengths are locally changed as described above, the position between the LDA and the optical connection array can be adjusted with high accuracy.

Next, an example of a semiconductor laser array module for hermetically sealing the LDA and the optical connection array will be described. FIG. 18 is a side sectional view showing a state in which the sealing lid 9 for hermetically sealing is attached to the semiconductor laser array module.

After adjusting the positional relationship between the LDA 1 and the optical connection array 5 by the above-mentioned method and confirming the oscillation state of the LDA 1, a sealing lid 9 which can cover the LDA 1, the driving IC 8 and the like is prepared. . Furthermore, in the operating environment temperature range of the semiconductor laser array, for example, -40 ° C to 80 ° C,
An atmosphere filled with N ₂ gas whose dew point is equal to or lower than the operating environment temperature, in this case, for example, about −50 ° C., so that the hermetically sealed inside does not condense and the elements of the LDA 1 and the driving IC 8 are not oxidized. To prepare. Then, in this, the module bottom plate 78 and the sealing lid 9 are seam welded. Here, since the fiber alignment member 63 covering the fiber alignment member 64 for connecting the GMMFA 4 and the SMFA 3 does not need to be hermetically sealed, even after the hermetic sealing, the SMFA 3 is attached / replaced to the optical fiber tape 2 at the tip. Will be easier.

The detailed description of the embodiment is omitted below,
In place of the LDA, the LDs have a PD with a pitch of emitted light of each LD of the LDA and a positioning allowable range wider than that of the LD.
Since it is obvious that the PDA can be positioned, the light emitted from each SMF of the SMFA is transmitted through the optical connection array to the PDA.
A light receiving element array module which is incident on can be easily configured. Further, it is possible to change the LDA to the surface emitting semiconductor laser matrix and the PDA to the surface light receiving element matrix, and the SMFA and the optical connection array can be easily constructed by laminating the one-dimensional array of the present invention. Since it can be changed to a two-dimensional matrix module, a semiconductor laser matrix module or a light receiving element matrix module can be easily constructed according to the present invention.

[0083]

As described in the above embodiments, according to the present invention, the following effects can be obtained.

(1) A GMMF of a constant length with a core diameter larger than the core diameter of the SMF, or the core diameter of the SMF is partially enlarged, and a core diameter size changing fiber of a constant length is
By connecting to each SMF of MFA, it becomes possible to receive the emitted light from LDA in a larger range than that of SMF through this.
The allowable positional accuracy between each LD and each GMMF or each core diameter size changing fiber is relaxed. As a result, it is possible to suppress the manufacturing error of the pitch between the LDs and the SMFs of the LDA and SMFA, the difference in the amount of thermal expansion, the decrease in the coupling efficiency due to the positioning error, and the influence on the variation between the channels. It is easy to manufacture a semiconductor laser array module with stable coupling efficiency between channels.

(2) Since both ends of the converging-type multimode optical fiber array are fixed by using separate aligning members, the coefficient of thermal expansion of the aligning members on the side closer to the LDA is LDA.
It is possible to select the material so that it is close to the coefficient of thermal expansion of
Further, since only the alignment member on the side closer to the LDA needs to be processed so that the fibers can be aligned at a highly accurate pitch, the cost of the alignment member can be reduced. Furthermore, there are a plurality of GMMFs between the alignment members at both ends of the GMMF.
Since the GMMF is slightly deformable, even when the alignment member on the side farther from the LDA is fixed, only the position of the alignment member on the side closer to the LDA is slightly moved so that the position with the LDA is smaller. Adjustment becomes possible, and it is possible to suppress a decrease in coupling efficiency and an influence on variations between channels.

(3) Since a fixed length GMMF or a fixed length core diameter size changing fiber is arranged at the interval of the emitted light of the LDA to form an optical connection component in an array, the LDA and the SMFA are used. The tolerance of the assembly allowable position is eased, and the semiconductor laser array module is easily manufactured.

(4) One end or both ends of a fixed length GMMF or a fixed length core diameter size changing fiber is processed into a spherical or conical shape, and is arranged at an interval of light emitted from the LDA to form an array. Since it is an optical connection part,
By using this, the yield is improved compared to the case where the tip of the SMFA is directly processed into a spherical or conical shape, and the accuracy of the allowable position for assembling the LDA and the SMFA is relaxed. Therefore, the semiconductor laser array module Is easy to manufacture.

(5) The output light from each LD of the LDA is set to 1
Pass the collimated light or nearly parallel light through the first lens, and then through the second lens, SMF.
Since it is configured to be incident on each SMF of A, it becomes possible to relax the allowable position accuracy between the first lens and the second lens, and between the LDA and the first lens row, If only the second lens array and the SMFA are manufactured with high accuracy, the pitch of the LDs and the SMFs will be different from each other, the difference in thermal expansion, the difference in the thermal expansion, the decrease in the coupling efficiency due to the positioning error, and the variation between the channels. The effect of can be suppressed.

(6) The coefficient of thermal expansion of the member for holding between the arrays of the optical connection array which makes the light emitted from the LDA incident in the range of temperature change in the semiconductor laser array module has an allowable value in terms of optical coupling loss. LDA not to exceed
By selecting a material having a value close to the coefficient of thermal expansion as the holding member, the variation in the coupling efficiency between the channels due to the temperature change can be kept within the allowable value.

(7) Even if the LDA is not wired during positioning or the like and cannot oscillate, another laser beam is made incident from the surface directly opposite to the emission surface of the LDA and leaks from the emission surface of the LDA. When the LDA is oscillated, the emission position of each LD can be detected, the LDA can be easily positioned, and the LDA can be positioned before the oscillation, thereby increasing the efficiency of assembly and adjustment of the semiconductor laser array module. be able to.

(8) The LDA and the optical connection array are provided on the holding member by locally configuring the member for holding the space between the LDA and the optical connection array for making the outgoing light from the SMFA incident. After roughly positioning and fixing with solder, etc., the weak-strength part of the member is mechanically deformed by using screws, etc., or it is deformed by heat energy by irradiating light rays or heat to change the position between the LDA and the optical connection array. It can be adjusted with high precision. As a result, it becomes easy to manufacture a semiconductor laser array module with stable coupling efficiency between channels.

(9) Since the light emitted from the LDA is made incident on the SMFA via the optical connection array, the LDA
The range for airtight sealing with nitrogen etc. to prevent element oxidation can be limited to LDA, and SMFA mounting /
It can be easily replaced. (10) Instead of the LDA, a light receiving element array (hereinafter, referred to as “light receiving element array”) in which light receiving elements (PD) are arranged at a pitch equal to the pitch of emitted light of each LD of the LDA
Since the configuration is such that PDA (abbreviated as PDA) can be positioned, SM
Light emitted from each SMF of FA is passed through an optical connection array,
A light receiving element array module that enters the PDA can be easily configured.

(11) The LDA can be changed to a surface emitting semiconductor laser matrix capable of emitting light in a two-dimensional matrix, and the SMFA and the optical connection array can be easily changed to a two-dimensional matrix by a structure in which one-dimensional arrays are laminated. Therefore, the semiconductor laser matrix module can be easily constructed.

(12) Instead of the surface emitting semiconductor laser matrix, the planar light receiving element matrix can be positioned, so that the light receiving element matrix module can be easily constructed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a main part of a semiconductor laser array module according to the present invention.

FIG. 2 is a plan view showing a configuration of a main part of a semiconductor laser array module according to the present invention.

FIG. 3 is a side view showing a configuration of a main part of a semiconductor laser array module according to the present invention.

FIG. 4 is a perspective view showing a tip portion of the optical fiber tape of FIG.

5 is a perspective view showing a state in which the tip end portion of the optical fiber tape of FIG. 4 is fixed.

6 is a perspective view showing an assembled state of the optical connection array of FIG. 1. FIG.

FIG. 7 is a plan view showing a configuration example having an optical connection array using a core diameter size changing fiber.

FIG. 8 is a plan view showing only the optical connection array of FIG.

9 is a plan view showing an optical connection array in which the end surface of each GMMF shown in FIG. 8 is processed into a spherical shape.

10 is a plan view showing an optical connection array in which an end face of each GMMF shown in FIG. 8 is processed into a conical shape.

11 is a plan view showing an optical connection array in which each GMMF shown in FIG. 9 is replaced with a core diameter size changing fiber.

12 is a plan view showing a configuration of a main part of a semiconductor laser array module in which each GMMF in FIG. 1 is replaced with two lenses.

FIG. 13 is a plan view for explaining an amount of thermal expansion due to a temperature change in the example of the present invention.

FIG. 14 is a plan view showing a semiconductor laser array module according to the present invention.

15 is a side view including a partial cross section of FIG. 14.

FIG. 16 is a plan view showing a method of adjusting the position between the LDA and the optical connection array.

17 is a cross-sectional view taken along the line AA of FIG.

FIG. 18 is a side sectional view of a semiconductor laser array module in which an LDA is hermetically sealed.

[Explanation of symbols]

1 ... LDA, 2 ... Optical fiber tape, 3 ... SMFA, 4
... GMMFA, 5 ... Optical connection array, 6 ... Fiber alignment member, 7 ... Optical connection array support member, 8 ... LDA driving I
C, 9 ... Sealing lid, 11 ... Laser emission light, 30 ... Core diameter,
31A ... SMF, 40 ... Core, 41A ... GMMFA, 42 ... Optical fiber array with partially expanded core diameter, 43 ... Spherical tip G
MMFA, 44 ... Conical GMMFA at the tip, 45 ... Optical fiber array with a spherical tip and a partially enlarged core diameter, 46 ... LD side lens, 47 ... Fiber side lens, 63 ... Fiber alignment member, 72 ... Hinge, 77A ... Bottom position adjusting screw, 78 ... Module bottom plate, 101 ... Reflecting mirror, 102 ... Laser light, 103 ... Laser light, 111A ... Laser irradiation device for upper surface, 112A ... Laser irradiation device for lower surface.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshihiko Sakai, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Inside the Hitachi, Ltd. Institute of Industrial Science (72) Inventor Kunio Matsumoto 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Incorporated company Hitachi, Ltd.

Claims (16)

[Claims] 1. A semiconductor laser array module configured to cause emitted light from a semiconductor laser array to enter a single-mode optical fiber array, wherein a focused multimode optical fiber array is provided at a tip of the single-mode optical fiber array. A semiconductor laser array module in which the emitted light is incident on a single mode optical fiber array through the connection. 2. A focusing type multimode optical fiber array is fixed at both ends using separate aligning members.
The semiconductor laser array module according to claim 1. 3. The amount of thermal expansion of the pitch of the emitted light in the array direction of the semiconductor laser array and the incident light pitch of the optical connection array that makes the emitted light from the semiconductor laser array enter in the range of temperature change in the semiconductor laser array module. The semiconductor laser array module having the optical connection array, which is made of a material whose thermal expansion coefficient is selected so that the difference from the thermal expansion amount of the above does not exceed the allowable value in optical coupling loss. 4. A tip of a single mode optical fiber array,
The semiconductor laser array module according to claim 1, wherein an optical fiber array having a partially expanded core diameter is connected. 5. A semiconductor laser array module configured so that light emitted from a semiconductor laser array is incident on a single-mode optical fiber array through each lens through two or more lenses. 6. For guiding the other laser light immediately before the surface directly opposite to the emission surface of the semiconductor laser array so that the other laser light can be incident from the surface directly opposite to the emission surface of the semiconductor laser array. A semiconductor laser array module, which is provided with the above parts. 7. A semiconductor laser array and an optical connection array on which light emitted from the semiconductor laser array is incident are supported by members whose strength is locally changed, and the weaker portion of the semiconductor laser array is deformed. A method of adjusting a position between an array and the optical connection array. 8. The position adjusting method according to claim 7, wherein a portion having low strength is irradiated with light rays or heat to be deformed by thermal energy. 9. A semiconductor laser array module comprising: a semiconductor laser array; and an optical connection array on which light emitted from the semiconductor laser array is incident, supported by a member whose intensity is locally changed. 10. An optical connection component, which is arranged in the form of an array by aligning the entire lengths of converging type multimode optical fibers having the same outer diameter as each fiber of the single mode optical fiber array and arranging them at intervals of emitted light of the semiconductor laser array. 11. The optical connecting part according to claim 10, wherein one end or both ends of the converging type multimode optical fiber is processed into a spherical or conical shape. 12. The light according to claim 10, wherein an optical fiber having a partially expanded core diameter is used instead of the converging type multimode optical fiber. Connection parts. 13. A semiconductor laser array module, characterized in that a semiconductor laser array and an optical connection array on which light emitted from the semiconductor laser array is incident are hermetically sealed. 14. A light-receiving element array module comprising a light-receiving element array instead of the semiconductor laser array, and having the characteristics according to any one of claims 1 to 6. 15. The semiconductor laser array, the single-mode optical fiber array, and the optical connection array are configured from a one-dimensional array form to a two-dimensional matrix form, according to any one of claims 1 to 6. The semiconductor laser matrix module described. 16. A light-receiving element array, a single-mode optical fiber array, and an optical connection array instead of the semiconductor laser array are constructed from a one-dimensional array form to a two-dimensional matrix form. A light-receiving element matrix module having the described features.