JPS63194311A - Eyelet construction of electronic component and manufacture of the same - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an eyelet structure for electronic components and a method for manufacturing the same.

[Conventional technology]

Generally, an eyelet is formed on an electronic component, and the eyelet is used to fix the electronic component to a fixing portion of the electronic component.

The eyelet structure of a conventional electronic component will be explained using FIGS. 4 to 6.

Here, Fig. 4 is a front view of the variable resistor to show the eyelet structure of the electronic component, Fig. 5 is a longitudinal sectional view showing the eyelet structure, and Fig. 6 is a longitudinal sectional view showing the state of fixing to the fixed part. It is.

As shown in FIG. 4, four body parts 4 are continuously formed at both ends of a resistor 3 formed on a substrate 2 of a variable resistor 1, and a terminal 5 is connected to this conductor part 4. . In this example,
An eyelet 6 is formed at one end of the terminal 5, which is an electronic component, and the caulked portion of the tip of the cylindrical portion of the eyelet 6 is caulked to the board 2, thereby fixing the terminal 5.

In this case, when the eyelet 6 portion formed at one end of the terminal 5 is enlarged and shown in cross section, it becomes as shown in FIG. shape part 7
It is made up of.

Such an eyelet 6 generally allows a hoop-shaped raw material to be transferred along a transfer path, and a plurality of processing positions are provided on this transfer path.
A drawing means consisting of a die and a punch is arranged at each processing position, and the shape is formed by a combination of drawing processing by each processing means and a punching operation at the final processing position.

In this case, the radius of the dies placed at multiple processing positions is made smaller in the direction in which the raw material is transported, and by drawing at each processing position, the bottomed cylindrical part protruding from the raw material is gradually reduced. The eyelet structure 6 whose cross section is shown in FIG. 5 is formed by processing the diameter to a small diameter and punching out the bottom of the bottomed cylindrical portion at the position where the final diameter is obtained.

The cylindrical part 7 of the terminal 5 with the eyelet structure 6 formed in this way is inserted into the mounting hole formed through the conductor part 4 and the board 2 in FIG. The caulked portion 7a is caulked and fixed to the substrate 2 around the attachment hole.

[Problem that the invention seeks to solve]

By the way, in the eyelet structure as described above, since the wall thickness of the cylindrical part 7 is formed uniformly, when crimped against the substrate 2, the crimped part 7a is bent and deformed, and is seated on the other cylindrical part 7b. Flexural deformity may occur. When the other cylindrical diameter portion 7b buckles in this way, after caulking,
This buckled deformed portion stretches, and the terminal 5 and the caulked portion 7a
This may cause looseness between the resistor 2 and the substrate 2, making it impossible to secure them sufficiently or causing poor contact with the resistor 4.

In addition, if the buckled part stretches, the height of the eyelet part becomes irregular, causing a problem that the height cannot be controlled.Furthermore, if buckling occurs, the caulking dimension of the caulked part 7a becomes smaller, causing buckling deformation. Even if the part does not stretch, this leads to the problem that the tightening force due to caulking becomes unstable.

The present invention has been made in view of the current state of the eyelet structure of electronic components as described above, and its purpose is to enable the cylindrical part to be caulked without buckling when caulking to the fixed part,
The objective is to provide an eyelet structure for electronic components that provides strong and stable caulking force. Another object of the present invention is to propose a method for manufacturing a new eyelet structure.

[Means for solving problems]

In order to achieve the above object, the present invention provides an eyelet structure for an electronic component that is inserted into a fixing hole for fixing an electronic component and fixed by caulking the end. It has a structure in which the wall is thinner than that of the cylindrical part.

In addition, in order to realize the eyelet structure of this configuration, the manufacturing method according to the present invention includes a multi-stage drawing process in which the inner diameter of the die and the outer diameter of the punch corresponding to the die are sequentially reduced, and the final stage. In a method for manufacturing an eyelet structure in which a cylindrical eyelet part is formed protruding from a plate material through a punching process, at least in the process before the final punching process, only the part corresponding to the caulking part of the eyelet is cut out from the other parts. Also, the drawing process is performed using a die formed to have a small diameter set in advance.

[Effect]

According to the eyelet structure with the above configuration, the caulking part is formed thinner than the other cylindrical parts, so when inserting the eyelet into the fixing hole and caulking the end, only the caulking part concerned can be easily The other cylindrical portion is bent without causing any buckling deformation.

Further, according to the method for manufacturing the eyelet structure having the above configuration, in at least the final process of drawing, that is, the process immediately before the punching process, the part corresponding to the caulked part is separated from other parts in accordance with the thin-walled shape of the caulked part. By using a die formed to a small diameter, the eyelet structure described above can be extremely easily realized through the same manufacturing process as the conventional method.

〔Example〕

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the eyelet structure of an electronic component and its manufacturing method according to the present invention will be described below with reference to the drawings.

1 to 3 are for explaining the present invention in detail. FIG. 1 is a partial enlarged vertical cross-sectional view of the eyelet structure according to the embodiment, and FIG. 2 is a partial enlarged vertical cross-sectional view showing the fixed state of the eyelet. FIG. 3 is a manufacturing process diagram of the method for manufacturing the eyelet structure.

In addition, in Figures 1 and 2, Figures 4 to 6
The same parts as in the figure are given the same reference numerals.

First, an example of the eyelet structure of the present invention will be described.

As shown in FIG. 1, the eyelet 8 is formed by forming a cylindrical portion 7 on the terminal 5, for example, and a caulking portion 7a at the tip of the cylindrical portion 7.
The wall thickness of the cylindrical portion 7b is thinner than that of the other cylindrical portion 7b.

An eyelet terminal with an eyelet is made by performing drawing and punching as described below on a 5mm thick copper plate to form a cylinder with, for example, an outer diameter of 1.5 m, an inner diameter of about 1.0 fi, and a length of about 4.5 W. At the same time as forming the shaped part 7, the outer diameter of about 1.85 m at the tip is reduced to about 1.3 mm, and the eyelet 6 is formed in the reduced diameter part of the tip as a thin caulked part 7a. There is.

In the eyelet 6 according to the embodiment having such a configuration, as shown in FIG. 2, the cylindrical portion 7 is inserted into the fixing hole 13 formed in the fixing portion 12 to which the terminal 5 is fixed. Next, the caulking portion 7a at the tip of the cylindrical portion 7 is caulked to the peripheral portion of the fixing hole 13 on the upper surface of the fixing portion 12 in the drawing.

At this time, since the caulked portion 7a has a thinner wall thickness than the other cylindrical portion 7b, the caulked portion 7a undergoes bending deformation under a much smaller load than the other cylindrical portion 7b which reaches buckling stress. and is refracted and developed on the upper surface of the fixing part 12,
It is caulked. Therefore, during caulking, the other cylindrical portion 7b does not buckle at all, and the terminal 5 can be attached to the predetermined fixing hole 13 with a stable tightening force.
It is possible to prevent backlash and poor contact. In addition, the caulking dimension, that is, the dimension in which the caulking part 7a and the fixing part 12 are in close contact with each other, is always constant and can be sufficiently large, so that the tightening force due to caulking is stable, and the dimension in the height direction is also constant, and the height Dimensions can also be easily managed.

Next, an example of a method for manufacturing an eyelet structure for an electronic component according to the present invention will be described.

In the embodiment, as shown in FIG. 3, a plurality of processing positions are set for a transfer path with a starting point at 14 and an ending point at 15. At these processing positions, a set of dies and punches formed to a predetermined diameter face each other, and are successively arranged in smaller diameters in order to reduce the drawing diameter and deepen the drawing depth. . Then, in the final stage, the punch 18 punches out the eyelet 6 to form the eyelet 6, but the die 17 in the drawing process one step before the final stage and the second stage before the final stage
From a predetermined depth, the inner diameter is reduced from r2 to r so that a becomes thinner. This reduction amount (r2-rI) is
It is appropriately selected depending on the material and thickness of the material used for the eyelet 6.

In this embodiment, in the process two steps before the final stage, a reduced part is formed from the other cylindrical part 7b to the caulking part 7a, and in the previous process, the caulking is performed using a punch 18 with a smaller diameter. It forms part 7a. However, the steps for forming the caulked portions 7a are also appropriately selected depending on the material and plate thickness.

Next, the manufacturing process of the eyelet structure according to the present invention will be explained.

When a raw material 19, for example, a steel plate with a thickness of 0.5 mm, is set in the transfer path 14 and a control means (not shown) is activated, the die 17 and punch 1 are moved at each processing position.
A transfer space is formed between the moving parts 8 and 8, and the raw material 19 held by a holding means (not shown) moves one section in this moving space.

By this one-section movement, the processing section near the end of the raw material 19 moves downward to the initial processing position, and when both sides of the processing section are placed on the die 17 corresponding to the processing position, The punch 18 is pushed into the die 1 f by a predetermined amount, and the processing portion of the raw material 19 is drawn.

Next, as the punch 18 moves upward, a transfer space is formed between the punch 18 and the die 17 at each processing position, and the raw material 19 moves through this transfer space for the next section. As a result of this movement, the processed portion subjected to the drawing process at the first processing position reaches the next processing position, and the new processed portion of the raw material 19 is located at the first processing position.

In this state, the processed portion near the end of the raw material 19 is drawn at the next processing position, and at the same time, the next processed portion of the raw material 19 is drawn at the first processed position.

Thereafter, in the same manner, a bottomed cylindrical portion 21 having a corresponding radius is formed in the raw material 19 at each processing position until reaching the processing position two positions before the final stage.

The bottomed cylindrical portion 21 formed by drawing at the two processing positions before the final stage has a shape different from that formed at other processing positions, and the bottomed cylindrical portion 21 is Bottom 2
The outer diameter r of the end on the 1a side is larger than the outer diameter r2 of the other part (r
z r,).

Subsequently, at the processing position Y before the final stage, drawing processing is performed using an even smaller diameter punch 18, and a caulked portion 7a with a predetermined diameter r1 is partially formed, and at the processing position Z of the final stage, a further smaller diameter punch is applied. Drawing is performed by the punch 18 and the bottom surface 21a is punched out to obtain an eyelet structure having the cross-sectional shape shown in FIG. By performing these steps continuously, the eyelet 6 according to the invention is continuously formed in the hoop material during the transfer process of the raw material 19.

As described above, according to the embodiment of the present invention, the caulked portion 7a can be formed by a simple manufacturing process for the raw material that becomes the terminal.
It is possible to efficiently manufacture an eyelet structure for an electronic component that can be stably caulked without causing buckling in the other cylindrical portion 7b, and the shape of the caulked portion is constant and dimensions can be controlled.

In the above embodiments of the eyelet structure of an electronic component of the present invention and the method for manufacturing the same, explanations have been given based on the assumption that the eyelet structure is formed on a terminal of a variable resistor, etc. However, the present invention is not limited to the examples. It can be applied to various other electronic components.

〔Effect of the invention〕

As is clear from the previous inventions, according to the present invention in which the caulked portion is formed thinner than other eyelet portions, only the caulked portion is plastically deformed during caulking, and the other cylindrical portions are prevented from buckling. Since there are no holes, it is possible to caulk stably and strongly, and since the shape of the caulked portion is constant during caulking, the height dimension can be easily controlled.

In addition, according to the manufacturing method with the above configuration, the diameter of the die can be made smaller only at the caulking part in at least one drawing process before the final stage, so manufacturing can be carried out simply and at the same cost as before. be able to.

[Brief explanation of the drawing]

1 to 3 are for explaining the present invention in detail. FIG. 1 is a partially enlarged vertical sectional view of the eyelet structure according to the embodiment, and FIG. 2 is a fixation of the eyelet structure with the fixing part. FIG. 3 is an explanatory diagram showing a part of the manufacturing process of the eyelet structure manufacturing method according to the embodiment, and FIGS. 4 to 6 are for explaining the conventional example. , Fig. 4 is a plan view of the variable resistor showing the eyelet structure, Fig. 5 is a longitudinal cross-sectional view showing the conventional eyelet structure, and Fig. 6 is a longitudinal cross-section showing the state of fixing the eyelet to the fixed part. It is a diagram. l... Variable resistor, 2... Board, 5.
...Terminal, 6.8...Eyelet, 7...
... Cylindrical part, 7a... Caulked part, 7b...
...Other cylindrical part, 12...Fixed part, 1
3...Fixing hole, 17...Dice, 18
... Punch, 19 ... Raw materials, 21 ...
...Cylindrical part with a bottom. Figure 1 Figure 2 Figure 4

Claims (2)

[Claims] (1) In the eyelet structure of an electronic component that is inserted into a fixing hole for fixing the electronic component and fixed by caulking the end,
An eyelet structure for an electronic component, characterized in that the caulked part of the cylindrical eyelet is formed thinner than other cylindrical parts. (2) A cylindrical eyelet is formed protruding from the plate material through a multi-stage drawing process in which the same diameter of the die and the outer diameter of the punch corresponding to the die are sequentially reduced, and the final punching process. In a method for manufacturing eyelet structures for electronic components, at least in the process immediately before the final punching process, only the part corresponding to the caulking part of the eyelet is drawn using a die formed to a preset size smaller in diameter than other parts. A method for manufacturing an eyelet structure for an electronic component, characterized by performing the following steps.