JPS63193865U - - Google Patents
Info
- Publication number
- JPS63193865U JPS63193865U JP8443787U JP8443787U JPS63193865U JP S63193865 U JPS63193865 U JP S63193865U JP 8443787 U JP8443787 U JP 8443787U JP 8443787 U JP8443787 U JP 8443787U JP S63193865 U JPS63193865 U JP S63193865U
- Authority
- JP
- Japan
- Prior art keywords
- photocoupler
- light emitting
- built
- limiting resistor
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008054 signal transmission Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案のフオトカプラの透視図、第２
図は本考案のフオトカプラの回路図、第３図は従
来のフオトカプラの透視図、第４図は従来のフオ
トカプラの回路図、第５図は参考回路図、第６図
は従来のフオトカプラによる実体配線図、第７図
は本考案のフオトカプラによる実体配線図、であ
る。
１……パツケージ、２……ベース端子、３……
コレクタ端子、４……エミツタ端子、５……電源
端子、６……アノード端子、７……カソード端子
、８……発光ダイオード、９……フオトトランジ
スタ、１０……電流制限抵抗、１１……外付け抵
抗１、１２……外付け抵抗２。
Figure 1 is a perspective view of the photocoupler of the present invention, Figure 2
The figure is a circuit diagram of the photocoupler of the present invention, Figure 3 is a perspective view of a conventional photocoupler, Figure 4 is a circuit diagram of a conventional photocoupler, Figure 5 is a reference circuit diagram, and Figure 6 is actual wiring using a conventional photocoupler. 7 are actual wiring diagrams using the photocoupler of the present invention. 1...Package cage, 2...Base terminal, 3...
Collector terminal, 4...Emitter terminal, 5...Power supply terminal, 6...Anode terminal, 7...Cathode terminal, 8...Light emitting diode, 9...Phototransistor, 10...Current limiting resistor, 11...Outside Attached resistor 1, 12...external resistor 2.
Claims (1)
た光結合形信号伝達用素子（以下、フオトカプラ
という）において、前記発光素子に流れる電流を
制限する電流制限抵抗を前記パツケージ内に内蔵
したことを特徴とする電流制限抵抗内蔵型フオト
カプラ。 An optically coupled signal transmission element (hereinafter referred to as a photocoupler) in which a light emitting element and a light receiving element are housed in the same package, characterized in that a current limiting resistor for limiting the current flowing through the light emitting element is built into the package. Photocoupler with built-in current limiting resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8443787U JPS63193865U (en) | 1987-05-29 | 1987-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8443787U JPS63193865U (en) | 1987-05-29 | 1987-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193865U true JPS63193865U (en) | 1988-12-14 |
Family
ID=30938938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8443787U Pending JPS63193865U (en) | 1987-05-29 | 1987-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193865U (en) |
-
1987
- 1987-05-29 JP JP8443787U patent/JPS63193865U/ja active Pending