JPS63193852U - - Google Patents
Info
- Publication number
- JPS63193852U JPS63193852U JP8223987U JP8223987U JPS63193852U JP S63193852 U JPS63193852 U JP S63193852U JP 8223987 U JP8223987 U JP 8223987U JP 8223987 U JP8223987 U JP 8223987U JP S63193852 U JPS63193852 U JP S63193852U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor element
- integrated circuit
- lead frame
- linear expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8223987U JPS63193852U (en:Method) | 1987-05-30 | 1987-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8223987U JPS63193852U (en:Method) | 1987-05-30 | 1987-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193852U true JPS63193852U (en:Method) | 1988-12-14 |
Family
ID=30934711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8223987U Pending JPS63193852U (en:Method) | 1987-05-30 | 1987-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193852U (en:Method) |
-
1987
- 1987-05-30 JP JP8223987U patent/JPS63193852U/ja active Pending