JPS63193802U - - Google Patents
Info
- Publication number
- JPS63193802U JPS63193802U JP8318887U JP8318887U JPS63193802U JP S63193802 U JPS63193802 U JP S63193802U JP 8318887 U JP8318887 U JP 8318887U JP 8318887 U JP8318887 U JP 8318887U JP S63193802 U JPS63193802 U JP S63193802U
- Authority
- JP
- Japan
- Prior art keywords
- terminal portion
- main body
- concave
- solder filling
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8318887U JPS63193802U (en, 2012) | 1987-06-01 | 1987-06-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8318887U JPS63193802U (en, 2012) | 1987-06-01 | 1987-06-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193802U true JPS63193802U (en, 2012) | 1988-12-14 |
Family
ID=30936545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8318887U Pending JPS63193802U (en, 2012) | 1987-06-01 | 1987-06-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193802U (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127895A (ja) * | 1989-10-13 | 1991-05-30 | Hakugen:Kk | フラットパッケージ型ｉｃの実装方法 |
-
1987
- 1987-06-01 JP JP8318887U patent/JPS63193802U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127895A (ja) * | 1989-10-13 | 1991-05-30 | Hakugen:Kk | フラットパッケージ型ｉｃの実装方法 |