JPS6319244A - Surface protective structure of resin board - Google Patents
Surface protective structure of resin boardInfo
- Publication number
- JPS6319244A JPS6319244A JP61164940A JP16494086A JPS6319244A JP S6319244 A JPS6319244 A JP S6319244A JP 61164940 A JP61164940 A JP 61164940A JP 16494086 A JP16494086 A JP 16494086A JP S6319244 A JPS6319244 A JP S6319244A
- Authority
- JP
- Japan
- Prior art keywords
- surface protection
- resin plate
- protection film
- layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims description 50
- 239000011347 resin Substances 0.000 title claims description 50
- 230000001681 protective effect Effects 0.000 title description 7
- 239000010410 layer Substances 0.000 description 35
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 101100108446 Mus musculus Aifm3 gene Proteins 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ［産業上の利用分野］ 未発ＩＩは、樹脂板の表面保護構造に関する。[Detailed description of the invention] [Industrial application field] Undeveloped II relates to a surface protection structure of a resin plate.
［従来の技術］
樹脂板は、加工時、運搬時、積み玉ね保存時等に傷入を
生じやすい、そこで、樹脂板の両面に表面保護フィルム
もしくはシートを貼り合わせることによって、上記傷入
を防止している。[Prior art] Resin plates are prone to damage during processing, transportation, stacked balls storage, etc. Therefore, by pasting surface protection films or sheets on both sides of the resin plate, these scratches can be avoided. It is prevented.
［発明が解決しようとする問題点］
しかしながら、樹脂板の表面に印刷等の処理を施す際に
は、処理を施す面の表面保護フィルムもしくはシートを
剥離する心安がある。その際、樹脂板の表面は帯電しや
すく、主として以下に迅へるような不都合を生ずる。[Problems to be Solved by the Invention] However, when performing a treatment such as printing on the surface of a resin plate, there is a need to remove the surface protection film or sheet on the surface to be treated. At this time, the surface of the resin plate is likely to be charged with electricity, causing the following problems.
（０表面保護フィルムもしくはシートを剥離した樹脂板
の表面に、第５図に示すように、塵埃、樹脂板の切粉等
が吸いつき、その状態で印刷等の処理が施されるため、
印刷不良等による不良品が発−生する。なお、第５図に
おいて、ｌは樹脂板、２は表面保護フィルムもしくはシ
ートである。(As shown in Figure 5, the surface of the resin plate from which the surface protection film or sheet has been removed attracts dust, chips from the resin plate, etc., and is then subjected to printing or other processing.
Defective products occur due to printing defects, etc. In FIG. 5, 1 is a resin plate, and 2 is a surface protection film or sheet.
虫）樹脂板の取扱い時に、帯電に伴う静電気が人体に電
撃を与え、その取扱い作業の俺率を低下させる。(Insects) When handling resin plates, the static electricity that accompanies charging gives electric shock to the human body, reducing the efficiency of handling work.
未発１１は、樹脂板の両面に貼り合わされた表面保１；
♂フィルムもしくはシートの一方を２１ ｆｉする時、
該表面保護フィルムもしくはシートの剥離された樹脂板
の表面における帯電を防ＩＦすることを［］的とする。Unexploded 11 is surface protection 1 bonded to both sides of the resin plate;
♂When applying 21 fi to either film or sheet,
The purpose is to prevent IF from charging on the surface of the resin plate from which the surface protection film or sheet has been peeled off.
［問題点を解決するためのｆ段］
べ発明は、樹脂板のρイ面に表面保護フィルムもしくは
シートを貼り合わせてなる樹脂板の表面保護構造におい
て、少なくとも最初に′Ａ敲されない側の表面保護フィ
ルムもしくはシートに、帯電病１１層な形成するように
したものである。[Step F for solving the problem] The present invention provides a surface protection structure for a resin board in which a surface protection film or sheet is bonded to the surface of the resin board, at least the surface of the side that is not sanded first. A protective film or sheet is formed with 11 layers to prevent electrostatic charge.
［作用］
以下、；（発明の作用を本発明者の実験結果を根拠とし
て説明する。[Operation] Hereinafter, the operation of the invention will be explained based on the experimental results of the present inventor.
第４図（Ａ）〜（Ｄ）は厚み１ｍｍの樹脂板ｌの両面に
表面保護フィルムを貼り合わせてなる樹脂板１の表面保
護構造を示す模式図である０図において、２は帯電防ｌ
Ｆ層を形成されない表面保護フィルムを示し、３は帯電
防止層を形成された表面保護フィルムを示す。Figures 4 (A) to (D) are schematic diagrams showing the surface protection structure of a resin plate 1 made by laminating surface protection films on both sides of a resin plate 1 with a thickness of 1 mm.
3 shows a surface protection film on which no F layer is formed, and 3 shows a surface protection film on which an antistatic layer is formed.
第４図（Ａ）に示すように、樹脂板ｌの両面に、帯電防
止層を形成されない表面保護フィルム２を貼り合わせた
状態下で、一方の表面保護フィルム２を剥離すると、該
表面保護フィルム２が剥離された樹脂板ｌの表面Ｐにお
ける帯電圧が一＋ｏｏｏｏ ｖであった。As shown in FIG. 4(A), when the surface protection film 2 on which no antistatic layer is formed is attached to both surfaces of the resin plate 1, when one surface protection film 2 is peeled off, the surface protection film 2 is removed. The charged voltage on the surface P of the resin plate 1 from which 2 was peeled was 1+oooo v.
第４図（Ｂ）に示すように、樹脂板１の一方の表面に帯
電病１ヒ層を形成された表面保護フィルム３を貼り合わ
せ、他方の表面に帯′電防ＩＬ層を形成されない表面保
護フィルム２を貼り合わせた状態下で、帯電病１ヒ層を
形成された表面保護フィルム３を剥）すると、該表面保
護フィルム３が２４ｆｉされた樹脂板ｌの表面Ｐにおけ
る帯電圧が÷８５００ ｖであった。As shown in FIG. 4(B), the surface protection film 3 on which the electrostatic protection IL layer is formed is pasted on one surface of the resin plate 1, and the surface on which the electrostatic protection IL layer is not formed on the other surface. When the surface protection film 3 on which the electrostatic protection film 1 layer is formed is peeled off with the protective film 2 attached, the electrostatic voltage on the surface P of the resin plate 1 on which the surface protection film 3 is 24fi is divided by 8500. It was v.
第４図（Ｃ）に示すように、樹脂板１の一方の表面に帯
′電防止層を形成されない表面保護フィルム２を貼り合
わせ、他方の表面に帯電病１ヒ層を形成された表面保護
フィルム３を貼り合わせた状態下で、帯電防止層を形成
されない表面保護フィルム２を剥離すると、該表面保護
フィルム２が剥離された樹脂板１の表面Ｐにおける帯電
圧が−５０ｖであった。As shown in FIG. 4(C), a surface protection film 2 on which no antistatic layer is formed is pasted on one surface of the resin plate 1, and a surface protection film 2 on which an antistatic layer is formed on the other surface. When the surface protection film 2 on which the antistatic layer was not formed was peeled off while the film 3 was attached, the charged voltage on the surface P of the resin plate 1 from which the surface protection film 2 was peeled off was -50V.
第４図（Ｄ）に示すように、樹脂板ｌの両面に、帯電防
止層を形成された表面保護フィルム３を貼り合わせた状
態下で、一方の表面保護フィルム３を２１敲すると、該
表面保護フィルム３が剥離された樹脂板ｌの表面Ｐにお
ける帯電圧が−１３０ｖであった。As shown in FIG. 4(D), with the surface protection films 3 on which antistatic layers are pasted on both sides of the resin plate 1, when one surface protection film 3 is rubbed 21 times, the surface The charged voltage on the surface P of the resin plate 1 from which the protective film 3 was peeled off was -130V.
すなわち、第４図（Ｃ）、（Ｄ）に示した表面保護構造
におけるように、樹脂板の一方の表面保護フィルムを剥
離する時、他方の表面保護フィルムとして、帯電防止層
が形成されている表面保護フィルムを用いるものとすれ
ば、上記帯電防止層の存在が、表面保護フィルムの剥離
された樹脂板の表面における帯電を防止することとなる
。That is, as in the surface protection structure shown in FIGS. 4(C) and 4(D), when one surface protection film of the resin plate is peeled off, an antistatic layer is formed as the other surface protection film. If a surface protection film is used, the presence of the antistatic layer prevents charging on the surface of the resin plate from which the surface protection film has been peeled off.
［実施例］
第１図は本発明の一実施例に係る樹脂板１０の表面保護
構造を示す断面図である。[Example] FIG. 1 is a sectional view showing a surface protection structure of a resin plate 10 according to an example of the present invention.
樹脂板１０の両面において、表面保護フィルムが最初に
剥離される面１０Ａには、帯電防止層が形成されない従
来どおりの表面保護フィルム１１が貼り合わされ、他方
の面１０Ｂには、帯電防ｌＬ層が形成された表面保護フ
ィルム１２が貼り合わされている。On both sides of the resin plate 10, a conventional surface protection film 11 on which no antistatic layer is formed is bonded to the surface 10A from which the surface protection film is first peeled off, and an antistatic 1L layer is bonded to the other surface 10B. The formed surface protection film 12 is pasted together.
？ｉ′ｆ’ｉｔ防１Ｆ層が形成されない表面保護フィル
ム１１は、支持体１１Ａとして、ポリエチレンフィルム
（以下ＰＥフィル１１と略す）を用い、該支持体１１Ａ
の一力の面に粘着剤層１１Ｂを押出し方式により貼り合
わせている。粘着剤層１１Ｂとしては、粘着性プラスチ
ックフィルムであり、弱粘着性のあるエチレン酢酸ビニ
ル共重合体（以下ＥＶＡと略す）を用いている。? The surface protection film 11 on which the i'f'it prevention 1F layer is not formed uses a polyethylene film (hereinafter abbreviated as PE film 11) as the support 11A.
An adhesive layer 11B is bonded to the single-strength surface by an extrusion method. The adhesive layer 11B is an adhesive plastic film, and uses a weakly adhesive ethylene vinyl acetate copolymer (hereinafter abbreviated as EVA).
帯電防止層が形成された表面保護フィルム１２は、支持
体１２ＡとしてＰＥフィルムを用い、該支持体１２Ａの
表面に帯電防止層１２Ｃが形成されている。帯゛電防止
層１２ｃとしては、イオン導゛屯性ポリマー（例えば、
三菱油化ファイン社商品名５ＴＨ−５５）を用イル、次
に、？１？電防ｌヒ層１２Ｃｔ７）表面に、粘着剤層１
２Ｂとして、ＥＶＡを押出し方式により貼り合わせてい
る。The surface protection film 12 on which the antistatic layer is formed uses a PE film as the support 12A, and the antistatic layer 12C is formed on the surface of the support 12A. The antistatic layer 12c is made of an ion-conductive polymer (for example,
Mitsubishi Yuka Fine Co., Ltd. (product name: 5TH-55) was used, then ? 1? Electric protection layer 12Ct7) Adhesive layer 1 on the surface
As 2B, EVA is pasted together using an extrusion method.
次に、上記実施例に係る樹脂板１０の表面保護構造にお
ける？ｉ？電防１ヒ妨果について行なった実験結果につ
いて説明する。Next, what about the surface protection structure of the resin plate 10 according to the above embodiment? i? The results of an experiment conducted on electric protection 1 fire interference will be explained.
実験は、Ｉｊｔ記第１図に示す樹脂板１０の表面保護構
造において、４ｉ′を電防１ヒ層を形成されない表面保
１；刈フィルム１１を剥離し、さらに該表面保護フィル
ム１１を剥離した樹脂板１０の表面１０Ａをガーゼで３
０往復）ｌ？ｌ擦し、この時、樹脂板１０の表面１０Ａ
に発生する帯゛１ニ圧を測定した。この実験は、樹脂板
１０の厚さが０．５ ｍｍ、 ｌ ｍｍ、 ２ ｍ
ｍ。In the experiment, in the surface protection structure of the resin plate 10 shown in FIG. Cover the surface 10A of the resin plate 10 with gauze 3
0 round trips) l? At this time, the surface 10A of the resin plate 10
The pressure generated in the band 1 was measured. In this experiment, the thickness of the resin plate 10 was 0.5 mm, 1 mm, and 2 m.
m.
５■のそれぞれについて行なわれ、樹脂板１０の１！１
さが変化しても帯電防止効果が維持できるかについて調
査した。1!1 of the resin plate 10
We investigated whether the antistatic effect can be maintained even when the temperature changes.
その結果、樹脂板１０の表面１０Ａの帯電圧は、第２図
における線図においてΦ印で示したように、樹脂板１０
の厚さが０．５〜５■■の間で変化しても、＋５０〜５
００ｖの範囲内という比較的低い測定値を示した。As a result, the charged voltage on the surface 10A of the resin plate 10 is as indicated by the Φ mark in the diagram in FIG.
Even if the thickness of the
The measured value was relatively low, within the range of 00v.
旧聞実験の比較例として、樹脂板１０の両面に、帯電防
止層が形成されていない表面保護フィルム１１を接着し
、該表面保護フィルム１１の一方を′Ａ離し、以下−上
記における場合と同様に帯電圧を測定した。As a comparative example of the old experiment, the surface protection film 11 on which the antistatic layer is not formed is adhered to both sides of the resin plate 10, one side of the surface protection film 11 is separated by 'A, and the following - the same as in the above case is carried out. The charging voltage was measured.
その結果、樹脂板１０の表面１０Ａの帯電圧は、第２図
における線図においてＯ印で示したように、樹脂板ｌＯ
の厚さが０．５〜５＋ｓｍの間で変化すると、＋２８０
０〜３２００ Ｖの範囲内という非常に高いＡｉｆｌ定
値を示した。As a result, the charged voltage on the surface 10A of the resin plate 10 is as indicated by the O mark in the diagram in FIG.
When the thickness of changes from 0.5 to 5+sm, +280
It showed a very high Aifl constant value within the range of 0 to 3200 V.
すなわち、ｈ記実験によれば、樹脂板１０の一方の表面
保護フィルム１１を剥離する峙、他力の表面保１；偉フ
ィルムとして、帯電防１Ｆ層１２Ｃが形成されている表
面保護フィルム１２を用いるものとすれば、樹脂板１０
の厚さが相当の範囲にわたって変化しても、上記帯電防
止効果１２Ｃの存在が、表面保護フィルム１１の剥離さ
れた樹脂板ｌＯの表面における帯電を防１卜することが
確認された。That is, according to the experiment described in section h, when one surface protection film 11 of the resin plate 10 is peeled off, the surface protection film 12 on which the antistatic 1F layer 12C is formed is used as a strong film. If used, resin plate 10
It was confirmed that the presence of the antistatic effect 12C prevents charging on the surface of the resin plate 10 from which the surface protection film 11 has been peeled off, even if the thickness of the resin plate 10 changes over a considerable range.
なお１本発明における帯電防止効果が形成された表面保
護フィルムとしては、第３図（Ａ）に示す表面保護フィ
ルム２２におけるように、粘着剤層１２Ｂと帯電防止層
１２ｃの間にプライマー層１２Ｄを形成させてもよい。Note that the surface protection film with an antistatic effect in the present invention includes a primer layer 12D between the adhesive layer 12B and the antistatic layer 12c, as in the surface protection film 22 shown in FIG. 3(A). It may be formed.
また、第３図（Ｂ）に示す表面保護フィルム３２におけ
るように、粘着剤層１２Ｂと帯を防ｌト層１２Ｃの間に
中間支持体１２Ｅを介在させたものでもよい。Alternatively, as in the surface protection film 32 shown in FIG. 3(B), an intermediate support 12E may be interposed between the pressure-sensitive adhesive layer 12B and the belt-proofing layer 12C.
また、第３図（りに示す表面保護フィルム４２における
ように、支持体１２Ａにおける一方の面に粘着剤層１２
Ｂを形成し、他方の面に帯電防止層１２Ｃを形成させた
ものであってもよい。In addition, as in the surface protection film 42 shown in FIG.
B and an antistatic layer 12C may be formed on the other surface.
なお、上記表面保護フィルム４２にあっては、帯電防止
層１２Ｃの剥離を防止するために、帯電防止層１２Ｃに
おける支持体１２Ａに対する反対側の表面に、塗装等の
保護層１２Ｆを形成させてもよい。In addition, in the surface protection film 42, in order to prevent the antistatic layer 12C from peeling off, a protective layer 12F such as coating may be formed on the surface of the antistatic layer 12C opposite to the support 12A. good.
また５本発明の実施において、表面保護フィルム１２．
２２．３２．４２に設けられる帯電防止層１２Ｃの代わ
りに、支持体１２Ａおよびまたは粘着剤層１２Ｂの製造
段階において、それら支持体１２Ａおよびまたは粘着剤
層１２Ｂ＋、、帯電防止剤が練り込まれるものであって
もよい。Furthermore, in carrying out the present invention, the surface protection film 12.
22.32.42 Instead of the antistatic layer 12C provided in the support 12A and/or the adhesive layer 12B, an antistatic agent is kneaded into the support 12A and/or the adhesive layer 12B+ during the manufacturing stage of the support 12A and/or the adhesive layer 12B. It may be.
［発明の効果］
以上のように、本発明は、樹脂板の両面に表面保護フィ
ルムもしくはシートを貼り合わせてなる樹脂板の表面保
護構造において、少なくとも最初に剥離されない側の表
面保護フィルムもしくはシートに、帯電防１Ｆ層を形成
するようにしたちのである。したがって、樹１旧機の一
力の表ｊ６ｉ保護フィルムを剥謬する時、他方の表面保
護フィルムとして、帯電防止層が形成されている表面保
護フィルムを用いるものとすれば、ヒ記セ；？電防ＩＬ
層の存在が、表面保護フィルムの２１１＃された樹脂板
の表面における帯電を防１１：することが回旋となる。[Effects of the Invention] As described above, the present invention provides a surface protection structure for a resin board in which surface protection films or sheets are bonded to both surfaces of a resin board, at least to the surface protection film or sheet on the side that is not peeled off first. , to form an antistatic 1F layer. Therefore, when peeling off the protective film of the old model, if a surface protective film on which an antistatic layer is formed is used as the other surface protective film, please note:? Electric protection IL
The presence of the layer prevents electrification on the surface of the 211# resin plate of the surface protection film.
第１図は本発明の一実施例に係る樹脂板の表面保護構造
を示す断面図、第２ Ｉｎは帯′市防［ト層の存在と板
厚とイ；）電圧の関係を示す締図、第３図（Ａ）〜（Ｃ
）はｍ′心電防ト層が形成された表面保護フィルムの他
の例を示す断面図、第４図（Ａ）〜（Ｄ）は樹脂板の両
面に表面保護フィルムを貼り合わせてなる樹脂板の表面
保１；惇構造を示す模式ド、第５図は樹脂板の表面への
塵埃、樹脂板の切粉等の付着状態を示す模式図である。
１０・・・樹脂板、１１・・・帯電防１Ｆ層が形成され
ない表面保護フィルム、１２・・・帯電防止効果が形成
された表面保護フィルム。
第 １ 図
第２図
板 厚（爪ｍ）→
第３図
第 ５ 図
第４図
（Ａ）（Ｂ）
（Ｃ）（Ｄ）FIG. 1 is a sectional view showing the surface protection structure of a resin plate according to an embodiment of the present invention, and FIG. , Fig. 3(A)-(C
) is a cross-sectional view showing another example of a surface protection film on which an m′ electrocardiographic protection layer is formed, and FIGS. Figure 5 is a schematic diagram showing the surface maintenance of the plate 1; Fig. 5 is a schematic diagram showing the state of adhesion of dust, chips, etc. on the surface of the resin plate. 10...Resin plate, 11...Surface protection film on which no antistatic 1F layer is formed, 12...Surface protection film on which antistatic effect is formed. Figure 1 Figure 2 Board thickness (claw m) → Figure 3 Figure 5 Figure 4 (A) (B) (C) (D)
Claims (1)
を貼り合わせてなる樹脂板の表面保護構造において、少
なくとも最初に剥離されない側の表面保護フィルムもし
くはシートに、帯電防止層を形成したことを特徴とする
樹脂板の表面保護構造。(1) In the surface protection structure of a resin plate in which surface protection films or sheets are bonded to both sides of the resin plate, an antistatic layer is formed on at least the surface protection film or sheet on the side that is not peeled off first. Surface protection structure of resin plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61164940A JPS6319244A (en) | 1986-07-14 | 1986-07-14 | Surface protective structure of resin board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61164940A JPS6319244A (en) | 1986-07-14 | 1986-07-14 | Surface protective structure of resin board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6319244A true JPS6319244A (en) | 1988-01-27 |
| JPH0431507B2 JPH0431507B2 (en) | 1992-05-26 |
Family
ID=15802736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61164940A Granted JPS6319244A (en) | 1986-07-14 | 1986-07-14 | Surface protective structure of resin board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6319244A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52109579A (en) * | 1976-03-12 | 1977-09-13 | Mitsubishi Plastics Ind Ltd | Destaticization of plastic sheet |
| JPS5321239A (en) * | 1976-08-10 | 1978-02-27 | Mitsui Petrochem Ind Ltd | Exfoliation-preventive film |
| JPS5559962A (en) * | 1978-10-28 | 1980-05-06 | Daio Kako Shikogyo | Acryl board that finely dressed surface is protected |
| JPS5559963A (en) * | 1978-10-28 | 1980-05-06 | Daio Kako Shikogyo | Acryl board that finely dressed surface is protected |
| JPS5582645A (en) * | 1978-12-18 | 1980-06-21 | Asahi Chemical Ind | Shaped piece such as antistatic sheet and method of making said piece |
| JPS56113828U (en) * | 1979-12-28 | 1981-09-02 | ||
| JPS58191777A (en) * | 1982-05-06 | 1983-11-09 | Daio Kakoshi Kogyo Kk | Surface protecting material for antistatic treatment of synthetic resin board |
| JPS59169857A (en) * | 1983-03-15 | 1984-09-25 | 大王加工紙工業株式会社 | Antistatic and surface protection material for synthetic resin board |
-
1986
- 1986-07-14 JP JP61164940A patent/JPS6319244A/en active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52109579A (en) * | 1976-03-12 | 1977-09-13 | Mitsubishi Plastics Ind Ltd | Destaticization of plastic sheet |
| JPS5321239A (en) * | 1976-08-10 | 1978-02-27 | Mitsui Petrochem Ind Ltd | Exfoliation-preventive film |
| JPS5559962A (en) * | 1978-10-28 | 1980-05-06 | Daio Kako Shikogyo | Acryl board that finely dressed surface is protected |
| JPS5559963A (en) * | 1978-10-28 | 1980-05-06 | Daio Kako Shikogyo | Acryl board that finely dressed surface is protected |
| JPS5582645A (en) * | 1978-12-18 | 1980-06-21 | Asahi Chemical Ind | Shaped piece such as antistatic sheet and method of making said piece |
| JPS56113828U (en) * | 1979-12-28 | 1981-09-02 | ||
| JPS58191777A (en) * | 1982-05-06 | 1983-11-09 | Daio Kakoshi Kogyo Kk | Surface protecting material for antistatic treatment of synthetic resin board |
| JPS59169857A (en) * | 1983-03-15 | 1984-09-25 | 大王加工紙工業株式会社 | Antistatic and surface protection material for synthetic resin board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0431507B2 (en) | 1992-05-26 |
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