JPS6319244A - Surface protective structure of resin board - Google Patents
Surface protective structure of resin boardInfo
- Publication number
- JPS6319244A JPS6319244A JP61164940A JP16494086A JPS6319244A JP S6319244 A JPS6319244 A JP S6319244A JP 61164940 A JP61164940 A JP 61164940A JP 16494086 A JP16494086 A JP 16494086A JP S6319244 A JPS6319244 A JP S6319244A
- Authority
- JP
- Japan
- Prior art keywords
- surface protection
- resin plate
- protection film
- layer
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims description 50
- 239000011347 resin Substances 0.000 title claims description 50
- 230000001681 protective effect Effects 0.000 title description 7
- 239000010410 layer Substances 0.000 description 35
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000005038 ethylene vinyl acetate Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 101100108446 Mus musculus Aifm3 gene Proteins 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 [産業上の利用分野] 未発IIは、樹脂板の表面保護構造に関する。[Detailed description of the invention] [Industrial application field] Undeveloped II relates to a surface protection structure of a resin plate.
[従来の技術]
樹脂板は、加工時、運搬時、積み玉ね保存時等に傷入を
生じやすい、そこで、樹脂板の両面に表面保護フィルム
もしくはシートを貼り合わせることによって、上記傷入
を防止している。[Prior art] Resin plates are prone to damage during processing, transportation, stacked balls storage, etc. Therefore, by pasting surface protection films or sheets on both sides of the resin plate, these scratches can be avoided. It is prevented.
[発明が解決しようとする問題点]
しかしながら、樹脂板の表面に印刷等の処理を施す際に
は、処理を施す面の表面保護フィルムもしくはシートを
剥離する心安がある。その際、樹脂板の表面は帯電しや
すく、主として以下に迅へるような不都合を生ずる。[Problems to be Solved by the Invention] However, when performing a treatment such as printing on the surface of a resin plate, there is a need to remove the surface protection film or sheet on the surface to be treated. At this time, the surface of the resin plate is likely to be charged with electricity, causing the following problems.
(0表面保護フィルムもしくはシートを剥離した樹脂板
の表面に、第5図に示すように、塵埃、樹脂板の切粉等
が吸いつき、その状態で印刷等の処理が施されるため、
印刷不良等による不良品が発−生する。なお、第5図に
おいて、lは樹脂板、2は表面保護フィルムもしくはシ
ートである。(As shown in Figure 5, the surface of the resin plate from which the surface protection film or sheet has been removed attracts dust, chips from the resin plate, etc., and is then subjected to printing or other processing.
Defective products occur due to printing defects, etc. In FIG. 5, 1 is a resin plate, and 2 is a surface protection film or sheet.
虫)樹脂板の取扱い時に、帯電に伴う静電気が人体に電
撃を与え、その取扱い作業の俺率を低下させる。(Insects) When handling resin plates, the static electricity that accompanies charging gives electric shock to the human body, reducing the efficiency of handling work.
未発11は、樹脂板の両面に貼り合わされた表面保1;
♂フィルムもしくはシートの一方を21 fiする時、
該表面保護フィルムもしくはシートの剥離された樹脂板
の表面における帯電を防IFすることを[]的とする。Unexploded 11 is surface protection 1 bonded to both sides of the resin plate;
♂When applying 21 fi to either film or sheet,
The purpose is to prevent IF from charging on the surface of the resin plate from which the surface protection film or sheet has been peeled off.
[問題点を解決するためのf段]
べ発明は、樹脂板のρイ面に表面保護フィルムもしくは
シートを貼り合わせてなる樹脂板の表面保護構造におい
て、少なくとも最初に′A敲されない側の表面保護フィ
ルムもしくはシートに、帯電病11層な形成するように
したものである。[Step F for solving the problem] The present invention provides a surface protection structure for a resin board in which a surface protection film or sheet is bonded to the surface of the resin board, at least the surface of the side that is not sanded first. A protective film or sheet is formed with 11 layers to prevent electrostatic charge.
[作用]
以下、;(発明の作用を本発明者の実験結果を根拠とし
て説明する。[Operation] Hereinafter, the operation of the invention will be explained based on the experimental results of the present inventor.
第4図(A)〜(D)は厚み1mmの樹脂板lの両面に
表面保護フィルムを貼り合わせてなる樹脂板1の表面保
護構造を示す模式図である0図において、2は帯電防l
F層を形成されない表面保護フィルムを示し、3は帯電
防止層を形成された表面保護フィルムを示す。Figures 4 (A) to (D) are schematic diagrams showing the surface protection structure of a resin plate 1 made by laminating surface protection films on both sides of a resin plate 1 with a thickness of 1 mm.
3 shows a surface protection film on which no F layer is formed, and 3 shows a surface protection film on which an antistatic layer is formed.
第4図(A)に示すように、樹脂板lの両面に、帯電防
止層を形成されない表面保護フィルム2を貼り合わせた
状態下で、一方の表面保護フィルム2を剥離すると、該
表面保護フィルム2が剥離された樹脂板lの表面Pにお
ける帯電圧が一+oooo vであった。As shown in FIG. 4(A), when the surface protection film 2 on which no antistatic layer is formed is attached to both surfaces of the resin plate 1, when one surface protection film 2 is peeled off, the surface protection film 2 is removed. The charged voltage on the surface P of the resin plate 1 from which 2 was peeled was 1+oooo v.
第4図(B)に示すように、樹脂板1の一方の表面に帯
電病1ヒ層を形成された表面保護フィルム3を貼り合わ
せ、他方の表面に帯′電防IL層を形成されない表面保
護フィルム2を貼り合わせた状態下で、帯電病1ヒ層を
形成された表面保護フィルム3を剥)すると、該表面保
護フィルム3が24fiされた樹脂板lの表面Pにおけ
る帯電圧が÷8500 vであった。As shown in FIG. 4(B), the surface protection film 3 on which the electrostatic protection IL layer is formed is pasted on one surface of the resin plate 1, and the surface on which the electrostatic protection IL layer is not formed on the other surface. When the surface protection film 3 on which the electrostatic protection film 1 layer is formed is peeled off with the protective film 2 attached, the electrostatic voltage on the surface P of the resin plate 1 on which the surface protection film 3 is 24fi is divided by 8500. It was v.
第4図(C)に示すように、樹脂板1の一方の表面に帯
′電防止層を形成されない表面保護フィルム2を貼り合
わせ、他方の表面に帯電病1ヒ層を形成された表面保護
フィルム3を貼り合わせた状態下で、帯電防止層を形成
されない表面保護フィルム2を剥離すると、該表面保護
フィルム2が剥離された樹脂板1の表面Pにおける帯電
圧が−50vであった。As shown in FIG. 4(C), a surface protection film 2 on which no antistatic layer is formed is pasted on one surface of the resin plate 1, and a surface protection film 2 on which an antistatic layer is formed on the other surface. When the surface protection film 2 on which the antistatic layer was not formed was peeled off while the film 3 was attached, the charged voltage on the surface P of the resin plate 1 from which the surface protection film 2 was peeled off was -50V.
第4図(D)に示すように、樹脂板lの両面に、帯電防
止層を形成された表面保護フィルム3を貼り合わせた状
態下で、一方の表面保護フィルム3を21敲すると、該
表面保護フィルム3が剥離された樹脂板lの表面Pにお
ける帯電圧が−130vであった。As shown in FIG. 4(D), with the surface protection films 3 on which antistatic layers are pasted on both sides of the resin plate 1, when one surface protection film 3 is rubbed 21 times, the surface The charged voltage on the surface P of the resin plate 1 from which the protective film 3 was peeled off was -130V.
すなわち、第4図(C)、(D)に示した表面保護構造
におけるように、樹脂板の一方の表面保護フィルムを剥
離する時、他方の表面保護フィルムとして、帯電防止層
が形成されている表面保護フィルムを用いるものとすれ
ば、上記帯電防止層の存在が、表面保護フィルムの剥離
された樹脂板の表面における帯電を防止することとなる
。That is, as in the surface protection structure shown in FIGS. 4(C) and 4(D), when one surface protection film of the resin plate is peeled off, an antistatic layer is formed as the other surface protection film. If a surface protection film is used, the presence of the antistatic layer prevents charging on the surface of the resin plate from which the surface protection film has been peeled off.
[実施例]
第1図は本発明の一実施例に係る樹脂板10の表面保護
構造を示す断面図である。[Example] FIG. 1 is a sectional view showing a surface protection structure of a resin plate 10 according to an example of the present invention.
樹脂板10の両面において、表面保護フィルムが最初に
剥離される面10Aには、帯電防止層が形成されない従
来どおりの表面保護フィルム11が貼り合わされ、他方
の面10Bには、帯電防lL層が形成された表面保護フ
ィルム12が貼り合わされている。On both sides of the resin plate 10, a conventional surface protection film 11 on which no antistatic layer is formed is bonded to the surface 10A from which the surface protection film is first peeled off, and an antistatic 1L layer is bonded to the other surface 10B. The formed surface protection film 12 is pasted together.
?i′f’it防1F層が形成されない表面保護フィル
ム11は、支持体11Aとして、ポリエチレンフィルム
(以下PEフィル11と略す)を用い、該支持体11A
の一力の面に粘着剤層11Bを押出し方式により貼り合
わせている。粘着剤層11Bとしては、粘着性プラスチ
ックフィルムであり、弱粘着性のあるエチレン酢酸ビニ
ル共重合体(以下EVAと略す)を用いている。? The surface protection film 11 on which the i'f'it prevention 1F layer is not formed uses a polyethylene film (hereinafter abbreviated as PE film 11) as the support 11A.
An adhesive layer 11B is bonded to the single-strength surface by an extrusion method. The adhesive layer 11B is an adhesive plastic film, and uses a weakly adhesive ethylene vinyl acetate copolymer (hereinafter abbreviated as EVA).
帯電防止層が形成された表面保護フィルム12は、支持
体12AとしてPEフィルムを用い、該支持体12Aの
表面に帯電防止層12Cが形成されている。帯゛電防止
層12cとしては、イオン導゛屯性ポリマー(例えば、
三菱油化ファイン社商品名5TH−55)を用イル、次
に、?1?電防lヒ層12Ct7)表面に、粘着剤層1
2Bとして、EVAを押出し方式により貼り合わせてい
る。The surface protection film 12 on which the antistatic layer is formed uses a PE film as the support 12A, and the antistatic layer 12C is formed on the surface of the support 12A. The antistatic layer 12c is made of an ion-conductive polymer (for example,
Mitsubishi Yuka Fine Co., Ltd. (product name: 5TH-55) was used, then ? 1? Electric protection layer 12Ct7) Adhesive layer 1 on the surface
As 2B, EVA is pasted together using an extrusion method.
次に、上記実施例に係る樹脂板10の表面保護構造にお
ける?i?電防1ヒ妨果について行なった実験結果につ
いて説明する。Next, what about the surface protection structure of the resin plate 10 according to the above embodiment? i? The results of an experiment conducted on electric protection 1 fire interference will be explained.
実験は、Ijt記第1図に示す樹脂板10の表面保護構
造において、4i′を電防1ヒ層を形成されない表面保
1;刈フィルム11を剥離し、さらに該表面保護フィル
ム11を剥離した樹脂板10の表面10Aをガーゼで3
0往復)l?l擦し、この時、樹脂板10の表面10A
に発生する帯゛1ニ圧を測定した。この実験は、樹脂板
10の厚さが0.5 mm、 l mm、 2 m
m。In the experiment, in the surface protection structure of the resin plate 10 shown in FIG. Cover the surface 10A of the resin plate 10 with gauze 3
0 round trips) l? At this time, the surface 10A of the resin plate 10
The pressure generated in the band 1 was measured. In this experiment, the thickness of the resin plate 10 was 0.5 mm, 1 mm, and 2 m.
m.
5■のそれぞれについて行なわれ、樹脂板10の1!1
さが変化しても帯電防止効果が維持できるかについて調
査した。1!1 of the resin plate 10
We investigated whether the antistatic effect can be maintained even when the temperature changes.
その結果、樹脂板10の表面10Aの帯電圧は、第2図
における線図においてΦ印で示したように、樹脂板10
の厚さが0.5〜5■■の間で変化しても、+50〜5
00vの範囲内という比較的低い測定値を示した。As a result, the charged voltage on the surface 10A of the resin plate 10 is as indicated by the Φ mark in the diagram in FIG.
Even if the thickness of the
The measured value was relatively low, within the range of 00v.
旧聞実験の比較例として、樹脂板10の両面に、帯電防
止層が形成されていない表面保護フィルム11を接着し
、該表面保護フィルム11の一方を′A離し、以下−上
記における場合と同様に帯電圧を測定した。As a comparative example of the old experiment, the surface protection film 11 on which the antistatic layer is not formed is adhered to both sides of the resin plate 10, one side of the surface protection film 11 is separated by 'A, and the following - the same as in the above case is carried out. The charging voltage was measured.
その結果、樹脂板10の表面10Aの帯電圧は、第2図
における線図においてO印で示したように、樹脂板lO
の厚さが0.5〜5+smの間で変化すると、+280
0〜3200 Vの範囲内という非常に高いAifl定
値を示した。As a result, the charged voltage on the surface 10A of the resin plate 10 is as indicated by the O mark in the diagram in FIG.
When the thickness of changes from 0.5 to 5+sm, +280
It showed a very high Aifl constant value within the range of 0 to 3200 V.
すなわち、h記実験によれば、樹脂板10の一方の表面
保護フィルム11を剥離する峙、他力の表面保1;偉フ
ィルムとして、帯電防1F層12Cが形成されている表
面保護フィルム12を用いるものとすれば、樹脂板10
の厚さが相当の範囲にわたって変化しても、上記帯電防
止効果12Cの存在が、表面保護フィルム11の剥離さ
れた樹脂板lOの表面における帯電を防1卜することが
確認された。That is, according to the experiment described in section h, when one surface protection film 11 of the resin plate 10 is peeled off, the surface protection film 12 on which the antistatic 1F layer 12C is formed is used as a strong film. If used, resin plate 10
It was confirmed that the presence of the antistatic effect 12C prevents charging on the surface of the resin plate 10 from which the surface protection film 11 has been peeled off, even if the thickness of the resin plate 10 changes over a considerable range.
なお1本発明における帯電防止効果が形成された表面保
護フィルムとしては、第3図(A)に示す表面保護フィ
ルム22におけるように、粘着剤層12Bと帯電防止層
12cの間にプライマー層12Dを形成させてもよい。Note that the surface protection film with an antistatic effect in the present invention includes a primer layer 12D between the adhesive layer 12B and the antistatic layer 12c, as in the surface protection film 22 shown in FIG. 3(A). It may be formed.
また、第3図(B)に示す表面保護フィルム32におけ
るように、粘着剤層12Bと帯を防lト層12Cの間に
中間支持体12Eを介在させたものでもよい。Alternatively, as in the surface protection film 32 shown in FIG. 3(B), an intermediate support 12E may be interposed between the pressure-sensitive adhesive layer 12B and the belt-proofing layer 12C.
また、第3図(りに示す表面保護フィルム42における
ように、支持体12Aにおける一方の面に粘着剤層12
Bを形成し、他方の面に帯電防止層12Cを形成させた
ものであってもよい。In addition, as in the surface protection film 42 shown in FIG.
B and an antistatic layer 12C may be formed on the other surface.
なお、上記表面保護フィルム42にあっては、帯電防止
層12Cの剥離を防止するために、帯電防止層12Cに
おける支持体12Aに対する反対側の表面に、塗装等の
保護層12Fを形成させてもよい。In addition, in the surface protection film 42, in order to prevent the antistatic layer 12C from peeling off, a protective layer 12F such as coating may be formed on the surface of the antistatic layer 12C opposite to the support 12A. good.
また5本発明の実施において、表面保護フィルム12.
22.32.42に設けられる帯電防止層12Cの代わ
りに、支持体12Aおよびまたは粘着剤層12Bの製造
段階において、それら支持体12Aおよびまたは粘着剤
層12B+、、帯電防止剤が練り込まれるものであって
もよい。Furthermore, in carrying out the present invention, the surface protection film 12.
22.32.42 Instead of the antistatic layer 12C provided in the support 12A and/or the adhesive layer 12B, an antistatic agent is kneaded into the support 12A and/or the adhesive layer 12B+ during the manufacturing stage of the support 12A and/or the adhesive layer 12B. It may be.
[発明の効果]
以上のように、本発明は、樹脂板の両面に表面保護フィ
ルムもしくはシートを貼り合わせてなる樹脂板の表面保
護構造において、少なくとも最初に剥離されない側の表
面保護フィルムもしくはシートに、帯電防1F層を形成
するようにしたちのである。したがって、樹1旧機の一
力の表j6i保護フィルムを剥謬する時、他方の表面保
護フィルムとして、帯電防止層が形成されている表面保
護フィルムを用いるものとすれば、ヒ記セ;?電防IL
層の存在が、表面保護フィルムの211#された樹脂板
の表面における帯電を防11:することが回旋となる。[Effects of the Invention] As described above, the present invention provides a surface protection structure for a resin board in which surface protection films or sheets are bonded to both surfaces of a resin board, at least to the surface protection film or sheet on the side that is not peeled off first. , to form an antistatic 1F layer. Therefore, when peeling off the protective film of the old model, if a surface protective film on which an antistatic layer is formed is used as the other surface protective film, please note:? Electric protection IL
The presence of the layer prevents electrification on the surface of the 211# resin plate of the surface protection film.
第1図は本発明の一実施例に係る樹脂板の表面保護構造
を示す断面図、第2 Inは帯′市防[ト層の存在と板
厚とイ;)電圧の関係を示す締図、第3図(A)〜(C
)はm′心電防ト層が形成された表面保護フィルムの他
の例を示す断面図、第4図(A)〜(D)は樹脂板の両
面に表面保護フィルムを貼り合わせてなる樹脂板の表面
保1;惇構造を示す模式ド、第5図は樹脂板の表面への
塵埃、樹脂板の切粉等の付着状態を示す模式図である。
10・・・樹脂板、11・・・帯電防1F層が形成され
ない表面保護フィルム、12・・・帯電防止効果が形成
された表面保護フィルム。
第 1 図
第2図
板 厚(爪m)→
第3図
第 5 図
第4図
(A)(B)
(C)(D)FIG. 1 is a sectional view showing the surface protection structure of a resin plate according to an embodiment of the present invention, and FIG. , Fig. 3(A)-(C
) is a cross-sectional view showing another example of a surface protection film on which an m′ electrocardiographic protection layer is formed, and FIGS. Figure 5 is a schematic diagram showing the surface maintenance of the plate 1; Fig. 5 is a schematic diagram showing the state of adhesion of dust, chips, etc. on the surface of the resin plate. 10...Resin plate, 11...Surface protection film on which no antistatic 1F layer is formed, 12...Surface protection film on which antistatic effect is formed. Figure 1 Figure 2 Board thickness (claw m) → Figure 3 Figure 5 Figure 4 (A) (B) (C) (D)
Claims (1)
を貼り合わせてなる樹脂板の表面保護構造において、少
なくとも最初に剥離されない側の表面保護フィルムもし
くはシートに、帯電防止層を形成したことを特徴とする
樹脂板の表面保護構造。(1) In the surface protection structure of a resin plate in which surface protection films or sheets are bonded to both sides of the resin plate, an antistatic layer is formed on at least the surface protection film or sheet on the side that is not peeled off first. Surface protection structure of resin plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61164940A JPS6319244A (en) | 1986-07-14 | 1986-07-14 | Surface protective structure of resin board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61164940A JPS6319244A (en) | 1986-07-14 | 1986-07-14 | Surface protective structure of resin board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6319244A true JPS6319244A (en) | 1988-01-27 |
JPH0431507B2 JPH0431507B2 (en) | 1992-05-26 |
Family
ID=15802736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61164940A Granted JPS6319244A (en) | 1986-07-14 | 1986-07-14 | Surface protective structure of resin board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6319244A (en) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52109579A (en) * | 1976-03-12 | 1977-09-13 | Mitsubishi Plastics Ind Ltd | Destaticization of plastic sheet |
JPS5321239A (en) * | 1976-08-10 | 1978-02-27 | Mitsui Petrochem Ind Ltd | Exfoliation-preventive film |
JPS5559962A (en) * | 1978-10-28 | 1980-05-06 | Daio Kako Shikogyo | Acryl board that finely dressed surface is protected |
JPS5559963A (en) * | 1978-10-28 | 1980-05-06 | Daio Kako Shikogyo | Acryl board that finely dressed surface is protected |
JPS5582645A (en) * | 1978-12-18 | 1980-06-21 | Asahi Chemical Ind | Shaped piece such as antistatic sheet and method of making said piece |
JPS56113828U (en) * | 1979-12-28 | 1981-09-02 | ||
JPS58191777A (en) * | 1982-05-06 | 1983-11-09 | Daio Kakoshi Kogyo Kk | Surface protecting material for antistatic treatment of synthetic resin board |
JPS59169857A (en) * | 1983-03-15 | 1984-09-25 | 大王加工紙工業株式会社 | Antistatic and surface protection material for synthetic resin board |
-
1986
- 1986-07-14 JP JP61164940A patent/JPS6319244A/en active Granted
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52109579A (en) * | 1976-03-12 | 1977-09-13 | Mitsubishi Plastics Ind Ltd | Destaticization of plastic sheet |
JPS5321239A (en) * | 1976-08-10 | 1978-02-27 | Mitsui Petrochem Ind Ltd | Exfoliation-preventive film |
JPS5559962A (en) * | 1978-10-28 | 1980-05-06 | Daio Kako Shikogyo | Acryl board that finely dressed surface is protected |
JPS5559963A (en) * | 1978-10-28 | 1980-05-06 | Daio Kako Shikogyo | Acryl board that finely dressed surface is protected |
JPS5582645A (en) * | 1978-12-18 | 1980-06-21 | Asahi Chemical Ind | Shaped piece such as antistatic sheet and method of making said piece |
JPS56113828U (en) * | 1979-12-28 | 1981-09-02 | ||
JPS58191777A (en) * | 1982-05-06 | 1983-11-09 | Daio Kakoshi Kogyo Kk | Surface protecting material for antistatic treatment of synthetic resin board |
JPS59169857A (en) * | 1983-03-15 | 1984-09-25 | 大王加工紙工業株式会社 | Antistatic and surface protection material for synthetic resin board |
Also Published As
Publication number | Publication date |
---|---|
JPH0431507B2 (en) | 1992-05-26 |
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