JPS63189473U - - Google Patents

Info

Publication number
JPS63189473U
JPS63189473U JP8274787U JP8274787U JPS63189473U JP S63189473 U JPS63189473 U JP S63189473U JP 8274787 U JP8274787 U JP 8274787U JP 8274787 U JP8274787 U JP 8274787U JP S63189473 U JPS63189473 U JP S63189473U
Authority
JP
Japan
Prior art keywords
light beam
electronic components
wiring board
soldering
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8274787U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8274787U priority Critical patent/JPS63189473U/ja
Publication of JPS63189473U publication Critical patent/JPS63189473U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図はそれぞれはんだ付け状態を示
す本考案実施例、および従来の光ビームはんだ付
け装置の構成図である。各図において、 １：配線基板、２：はんだ付けされる電子部品
、３：他の電子部品、５：凹面反射鏡、６：光源
ランプ、７：光源ユニツト、９：二次焦点拡張用
レンズ。 FIGS. 1 and 2 are configuration diagrams of an embodiment of the present invention and a conventional light beam soldering apparatus, respectively, showing the soldering state. In each figure, 1: wiring board, 2: electronic components to be soldered, 3: other electronic components, 5: concave reflector, 6: light source lamp, 7: light source unit, 9: lens for secondary focus expansion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 配線基板上に実装されるフラツトパツク形ＩＣ
等の電子部品のはんだ付けを行う光ビームはんだ
付け装置であり、凹面反射鏡の一次焦点位置に光
源ランプを置いて構成した光源ユニツトを備え、
かつ配線基板上に載置した電子部品に向けて基板
の上方斜め方向から光ビームスポツトを照射する
ようにしたものにおいて、前記光源ユニツトの光
ビーム出射側に二次焦点拡張用レンズを装備して
構成したことを特徴とする電子部品の光ビームは
んだ付け装置。 Flatpack IC mounted on a wiring board
This is a light beam soldering device for soldering electronic components such as
and a light beam spot is irradiated onto the electronic components mounted on the wiring board from an oblique direction above the board, and a secondary focus expansion lens is equipped on the light beam output side of the light source unit. A light beam soldering device for electronic components, characterized in that the device comprises:
JP8274787U 1987-05-29 1987-05-29 Pending JPS63189473U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8274787U JPS63189473U (en) 1987-05-29 1987-05-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8274787U JPS63189473U (en) 1987-05-29 1987-05-29

Publications (1)

Publication Number Publication Date
JPS63189473U true JPS63189473U (en) 1988-12-06

Family

ID=30935681

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8274787U Pending JPS63189473U (en) 1987-05-29 1987-05-29

Country Status (1)

Country Link
JP (1) JPS63189473U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0426666U (en) * 1990-06-27 1992-03-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0426666U (en) * 1990-06-27 1992-03-03

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