JPS6318917Y2 - - Google Patents
Info
- Publication number
- JPS6318917Y2 JPS6318917Y2 JP1980183716U JP18371680U JPS6318917Y2 JP S6318917 Y2 JPS6318917 Y2 JP S6318917Y2 JP 1980183716 U JP1980183716 U JP 1980183716U JP 18371680 U JP18371680 U JP 18371680U JP S6318917 Y2 JPS6318917 Y2 JP S6318917Y2
- Authority
- JP
- Japan
- Prior art keywords
- dew condensation
- condensation sensor
- moisture
- sensitive resin
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000005494 condensation Effects 0.000 claims description 29
- 238000009833 condensation Methods 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Description
【考案の詳細な説明】
本考案は、結露時の応答が早く、結露解除に遅
く応答する結露センサを提供するものである。[Detailed Description of the Invention] The present invention provides a dew condensation sensor that responds quickly when condensing and responds slowly when the condensation is removed.
第１図は従来の結露センサを示している。１は
絶縁基板、２，２′はこの絶縁基板１上に形成さ
れた電極であり、この電極２，２′の端部にはそ
れぞれリード線３，３′が半田４，４′で接続され
ている。５は上記絶縁基板１の電極が形成された
面に設けられた感湿性樹脂であり、この感湿性樹
脂５内にはカーボン粒子が混入されている。 FIG. 1 shows a conventional dew condensation sensor. 1 is an insulating substrate, 2 and 2' are electrodes formed on this insulating substrate 1, and lead wires 3 and 3' are connected to the ends of the electrodes 2 and 2' with solders 4 and 4', respectively. ing. 5 is a moisture-sensitive resin provided on the surface of the insulating substrate 1 on which the electrodes are formed, and this moisture-sensitive resin 5 has carbon particles mixed therein.
第１図において湿度が上昇すると、水分が感湿
性樹脂５に吸収され、この感湿性樹脂５が膨潤
し、電極２，２′間の抵抗値が変化するものであ
る。第２図は上記従来の結露センサの相対湿度に
対する抵抗値変化を示している。 In FIG. 1, when the humidity increases, moisture is absorbed into the moisture sensitive resin 5, which swells and the resistance value between the electrodes 2 and 2' changes. FIG. 2 shows the change in resistance value of the conventional dew condensation sensor with respect to relative humidity.
このように従来の結露センサによれば、その抵
抗値によつて湿度を検出できるものである。 As described above, the conventional dew condensation sensor can detect humidity based on its resistance value.
しかしながら、上記従来の結露センサは、結露
解除時に早く応答する欠点があつた。 However, the conventional dew condensation sensor described above has the drawback of responding quickly when dew condensation is removed.
本考案は上記従来の欠点を除去し、結露時の応
答が早く、結露解除時に遅く応答する結露センサ
を提供するものであり、以下に本考案の一実施例
について第３図，第４図とともに説明する。 The present invention eliminates the above-mentioned conventional drawbacks and provides a dew condensation sensor that responds quickly when condensing and responds slowly when the condensation is released. An embodiment of the present invention will be described below with reference to FIGS. 3 and 4. explain.
第３図，第４図において、１は絶縁基板であ
り、この絶縁基板１上には電極２ａ，２ｂ，２
ｃ，２ｄが形成されている。なお電極２ｂ，２ｃ
は一体に形成されている。３，３′はリード線で
あり、このリード線３，３′はそれぞれ半田４，
４′により電極２ａ，２ｄに接続されている。５
は上記絶縁基板１の電極側の面に設けられた感湿
性樹脂であり、この感湿性樹脂５内にはカーボン
粒子が混入されている。この結露センサは、電極
２ａ，２ｄからなる第１の結露センサ素子Ａと電
極２ｃ，２ｄからなる第２の結露センサ素子Ｂと
が１枚の絶縁基板１上に構成されるとともに、電
気的に直列に接続されたものである。６は感湿性
樹脂５の上面の内の結露センサ素子Ｂ側に設けら
れた親水性又は吸湿性材料であり、ナイロン樹
脂、アクリル樹脂等の絶縁性の親水性樹脂、又は
セラミツク材料等のポーラスな絶縁材料が用いら
れる。 3 and 4, 1 is an insulating substrate, and electrodes 2a, 2b, 2
c, 2d are formed. Note that the electrodes 2b, 2c
is formed in one piece. 3, 3' are lead wires, and these lead wires 3, 3' are connected to solder 4, respectively.
4' is connected to the electrodes 2a and 2d. 5
is a moisture-sensitive resin provided on the electrode side surface of the insulating substrate 1, and this moisture-sensitive resin 5 has carbon particles mixed therein. In this dew condensation sensor, a first dew condensation sensor element A consisting of electrodes 2a and 2d and a second dew condensation sensor element B consisting of electrodes 2c and 2d are constructed on a single insulating substrate 1, and electrically They are connected in series. Reference numeral 6 denotes a hydrophilic or hygroscopic material provided on the upper surface of the moisture sensitive resin 5 on the dew condensation sensor element B side, and is made of an insulating hydrophilic resin such as nylon resin or acrylic resin, or a porous material such as ceramic material. An insulating material is used.
第５図は上記結露センサ素子Ａ，Ｂ単独の特性
を示している。 FIG. 5 shows the characteristics of the dew condensation sensor elements A and B alone.
第６図は結露センサ素子Ａ，Ｂを直列に接続し
た本実施例の特性を示している。 FIG. 6 shows the characteristics of this embodiment in which dew condensation sensor elements A and B are connected in series.
第６図からも明らかなように、本考案の結露セ
ンサは、結露時の応答が早く、結露解除の応答が
遅くなるものである。 As is clear from FIG. 6, the dew condensation sensor of the present invention has a quick response when condensing, and a slow response when removing condensation.
第７図は本考案の他の実施例を示している。本
実施例は、異なる絶縁基板１，１′上に、電極２
ａ，２ｂ，２ｃ，２ｄおよび感湿性樹脂５，５′
を設けた結露センサ素子Ａ，Ｂを直列に接続する
ものであり、一方の結露センサ素子Ｂのみに、親
水性または吸湿性材料６を設けている。本実施例
の特性も前記実施例と同様である。 FIG. 7 shows another embodiment of the invention. In this embodiment, electrodes 2 are placed on different insulating substrates 1 and 1'.
a, 2b, 2c, 2d and moisture sensitive resin 5, 5'
The dew condensation sensor elements A and B are connected in series, and only one dew condensation sensor element B is provided with a hydrophilic or hygroscopic material 6. The characteristics of this embodiment are also similar to those of the previous embodiment.
本考案は上記のような構造であり、本考案によ
れば簡単な構造で、結露時の応答が早く、結露解
除時に遅く応答する特性が得られる利点を有する
ものである。 The present invention has the above-described structure, and has the advantage of having a simple structure, a quick response when condensation occurs, and a slow response when dew condensation is removed.
第１図は従来の結露センサの一部を切欠にて示
す上面図、第２図は同結露センサの相対湿度に対
する抵抗値変化を示す図、第３図は本考案の一実
施例における結露センサの一部を切欠にて示す上
面図、第４図は同結露センサの断面図、第５図は
同センサを構成する各素子の抵抗値の変化を示す
特性図、第６図は同結露センサの抵抗値の変化を
示す特性図、第７図は本考案の他の実施例の断面
図である。
１，１′……絶縁基板、２ａ，２ｂ，２ｃ，２
ｄ……電極、３，３′……リード線、４，４′……
半田、５……感湿性樹脂、６……親水性又は吸湿
性材料。
Fig. 1 is a cutaway top view of a part of a conventional dew condensation sensor, Fig. 2 is a diagram showing the change in resistance value of the dew condensation sensor with respect to relative humidity, and Fig. 3 is a dew condensation sensor according to an embodiment of the present invention. Fig. 4 is a cross-sectional view of the condensation sensor, Fig. 5 is a characteristic diagram showing changes in resistance of each element that makes up the sensor, and Fig. 6 is the condensation sensor. FIG. 7 is a cross-sectional view of another embodiment of the present invention. 1, 1'...Insulating substrate, 2a, 2b, 2c, 2
d...electrode, 3,3'...lead wire, 4,4'...
Solder, 5... Moisture-sensitive resin, 6... Hydrophilic or hygroscopic material.
Claims (1)
粒子等の導電性粒子が混入された感湿性樹脂で上
記電極を被覆してなる複数個の結露センサ素子を
直列に接続し、上記複数個の結露センサ素子の内
の少なくとも１個の結露センサ素子の感湿性樹脂
上に親水性又は吸湿性材料を設けてなる結露セン
サ。 A plurality of dew condensation sensor elements are connected in series, each comprising an electrode provided on an insulating substrate and the electrode covered with a moisture-sensitive resin mixed with conductive particles such as carbon particles. A dew condensation sensor comprising a hydrophilic or hygroscopic material provided on a moisture sensitive resin of at least one dew condensation sensor element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980183716U JPS6318917Y2 (en) | 1980-12-19 | 1980-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980183716U JPS6318917Y2 (en) | 1980-12-19 | 1980-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57105957U JPS57105957U (en) | 1982-06-30 |
| JPS6318917Y2 true JPS6318917Y2 (en) | 1988-05-27 |
Family
ID=29983231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980183716U Expired JPS6318917Y2 (en) | 1980-12-19 | 1980-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6318917Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57105956U (en) * | 1980-12-19 | 1982-06-30 |
-
1980
- 1980-12-19 JP JP1980183716U patent/JPS6318917Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57105957U (en) | 1982-06-30 |
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