JPS63182574U - - Google Patents
Info
- Publication number
- JPS63182574U JPS63182574U JP7295687U JP7295687U JPS63182574U JP S63182574 U JPS63182574 U JP S63182574U JP 7295687 U JP7295687 U JP 7295687U JP 7295687 U JP7295687 U JP 7295687U JP S63182574 U JPS63182574 U JP S63182574U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- connection structure
- female connector
- guide protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7295687U JPS63182574U (bs) | 1987-05-18 | 1987-05-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7295687U JPS63182574U (bs) | 1987-05-18 | 1987-05-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63182574U true JPS63182574U (bs) | 1988-11-24 |
Family
ID=30916863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7295687U Pending JPS63182574U (bs) | 1987-05-18 | 1987-05-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63182574U (bs) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0562066U (ja) * | 1992-01-23 | 1993-08-13 | ホーチキ株式会社 | Ｉｃユニットを備えた回路装置 |
| JP2009135194A (ja) * | 2007-11-29 | 2009-06-18 | Toshiba Corp | プリント基板システム及びプリント基板の接続方法 |
| JP2016046402A (ja) * | 2014-08-25 | 2016-04-04 | アズビル株式会社 | プリント基板の接続構造 |
| JP2016103648A (ja) * | 2015-12-15 | 2016-06-02 | 日本電気株式会社 | 電子機器、サーバー |
| US9781831B2 (en) | 2014-03-27 | 2017-10-03 | Nec Corporation | Electronic device including module accommodating components disposed on substrate |
| DE102022205358A1 (de) | 2022-05-30 | 2023-11-30 | Robert Bosch Gesellschaft mit beschränkter Haftung | Elektronische Baugruppe, insbesondere eine elektronische Leistungsbaugruppe für Hybridfahrzeuge oder Elektrofahrzeuge |
-
1987
- 1987-05-18 JP JP7295687U patent/JPS63182574U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0562066U (ja) * | 1992-01-23 | 1993-08-13 | ホーチキ株式会社 | Ｉｃユニットを備えた回路装置 |
| JP2009135194A (ja) * | 2007-11-29 | 2009-06-18 | Toshiba Corp | プリント基板システム及びプリント基板の接続方法 |
| US9781831B2 (en) | 2014-03-27 | 2017-10-03 | Nec Corporation | Electronic device including module accommodating components disposed on substrate |
| JP2016046402A (ja) * | 2014-08-25 | 2016-04-04 | アズビル株式会社 | プリント基板の接続構造 |
| JP2016103648A (ja) * | 2015-12-15 | 2016-06-02 | 日本電気株式会社 | 電子機器、サーバー |
| DE102022205358A1 (de) | 2022-05-30 | 2023-11-30 | Robert Bosch Gesellschaft mit beschränkter Haftung | Elektronische Baugruppe, insbesondere eine elektronische Leistungsbaugruppe für Hybridfahrzeuge oder Elektrofahrzeuge |