JPS63182110A - Forming method for metallic film on surface of plastics - Google Patents
Forming method for metallic film on surface of plasticsInfo
- Publication number
- JPS63182110A JPS63182110A JP1367687A JP1367687A JPS63182110A JP S63182110 A JPS63182110 A JP S63182110A JP 1367687 A JP1367687 A JP 1367687A JP 1367687 A JP1367687 A JP 1367687A JP S63182110 A JPS63182110 A JP S63182110A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- pattern
- masking
- plastics
- metallic film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004033 plastic Substances 0.000 title claims abstract description 29
- 229920003023 plastic Polymers 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 238000007747 plating Methods 0.000 claims abstract description 17
- 239000000919 ceramic Substances 0.000 claims abstract description 14
- 230000000873 masking effect Effects 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims description 6
- 229920005989 resin Polymers 0.000 abstract description 5
- 239000011347 resin Substances 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000365 copper sulfate Inorganic materials 0.000 description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Decoration By Transfer Pictures (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、絶縁性プラスチック表面に金属膜を選択的に
形成できるプラスチック表面への金属膜形成法に関する
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for forming a metal film on a plastic surface, which allows a metal film to be selectively formed on an insulating plastic surface.
（従来の技術）
プラスチック表面に金属膜を選択的に形成する方法の例
として、次の方法が知られている。(Prior Art) The following method is known as an example of a method for selectively forming a metal film on a plastic surface.
（ａ ）絶縁性プラスチック表面のメツキネ要部分にマ
スキング用レジスト膜を形成し、ついで無電解メッキ法
で所定の金属メッキパターンを形成する方法。(a) A method in which a masking resist film is formed on the essential parts of the surface of an insulating plastic, and then a predetermined metal plating pattern is formed by electroless plating.
（ｂ ）絶縁性プラスチックと導電性プラスチックを用
いて２色成形法により導電性プラスチックを所定のパタ
ーンに形成させた後、パターン上に電気メッキを施して
金属メッキパターンを形成する方法。(b) A method in which the conductive plastic is formed into a predetermined pattern by a two-color molding method using an insulating plastic and a conductive plastic, and then electroplated on the pattern to form a metal plating pattern.
（発明が解決しようとする問題点）
しかしたがら、上記（ａ ＞の方法では、表面が平滑で
はない、例えば凹凸面を有する成形品上にレジスト膜を
形成することは極めて困難であり、また（ｂ）の方法で
は、成形法が複雑なためコスト的に不利という問題があ
る。(Problems to be Solved by the Invention) However, in the method (a) above, it is extremely difficult to form a resist film on a molded product whose surface is not smooth, for example, has an uneven surface. Method b) has a problem in that it is disadvantageous in terms of cost because the molding method is complicated.
（問題点を解決するための手段〉
本発明は、絶縁性プラスチック表面上に金属膜を選択的
、かつ容易に形成できる方法を見出したものであり、そ
の要旨とするところは、非メッキ部分にマスキング用セ
ラミック層を固着した金型表面に電気メッキを施して、
所定の金属メッキパターンを形成した後、金型表面に溶
融した絶縁性プラスチックを押圧して上記金属メッキパ
ターンをプラスチック成形品表面へ転写することを特徴
とするプラスチック表面への金属膜形成に存する。(Means for Solving the Problems) The present invention has discovered a method for selectively and easily forming a metal film on the surface of an insulating plastic. Electroplating is applied to the surface of the mold to which the masking ceramic layer is fixed.
The method consists in forming a metal film on a plastic surface, which is characterized by forming a predetermined metal plating pattern and then pressing molten insulating plastic onto the surface of a mold to transfer the metal plating pattern to the surface of a plastic molded product.
である。It is.
本発明における金型１は、キャビティーを有する射出成
形用の金型や熱プレス成形用の金型であって、材質は良
好な導電性とメッキ液に対する耐腐食性を有する金属、
例えばステンレス鋼や硬質クロムメッキ鋼等が好適に使
用できる。The mold 1 in the present invention is an injection molding mold or a hot press molding mold having a cavity, and is made of a metal having good conductivity and corrosion resistance against plating liquid.
For example, stainless steel, hard chrome plated steel, etc. can be suitably used.
本発明においては、第１図の（Ａ）に示すように、まず
金型１表面の非ずメッキ部分にマスキング用セラミック
層２を固着し、マスキング用パターンを形成する必要が
ある。In the present invention, as shown in FIG. 1A, it is first necessary to adhere the masking ceramic layer 2 to the non-tin plated portion of the surface of the mold 1 and form a masking pattern.
使用するセラミックとしては、体ＷＩ固有抵抗値が１ｏ
１４Ω・ｃｍ以上の特性を有するもので、ＡＩ、、０３
、ＡｌＮＳｉ３Ｎ４、Ｓｉ Ｏ，Ｓｉ Ｏ２、Ｚｎ Ｓ
、ＢＮ等が使用できる。The ceramic used has a body WI specific resistance value of 1o.
Those with characteristics of 14Ω・cm or more, AI, 03
, AlNSi3N4, SiO, SiO2, ZnS
, BN, etc. can be used.
セラミックの金型表面への固着法は、スパッタリング、
イオンブレーティング等のＰＶＤ法やプラズマＣＶＤ法
等の蒸着法やスプレー法が適用できる。セラミックの層
厚みは５００Ａ〜３０μ程度が好ましく、５００Ａ未満
では幅が狭い部分で金属メッキ部分が相互にブリッジを
生じ易いという問題があり、３０μを越えるものではコ
スト的に問題があるや 上記セラミック層は耐熱性が良
好であり、また繰返しによる耐衝撃性に優れているとい
う利点がある。The methods of fixing ceramic to the mold surface are sputtering,
A PVD method such as ion blasting, a vapor deposition method such as a plasma CVD method, or a spray method can be applied. The thickness of the ceramic layer is preferably about 500A to 30μ; if it is less than 500A, there is a problem that the metal plated parts tend to form bridges with each other in narrow areas, and if it exceeds 30μ, there is a cost problem. has the advantage of having good heat resistance and excellent impact resistance due to repeated use.
ついで、工程（Ｂ）において、マスキング用セラミック
以外のパターン上に金属を電気メッキし、所定の金属メ
ッキパターンを形成する。金属としては、メッキの目的
等により異なるが、電気メッキが可能な銅、ニッケル、
亜鉛等適宜使用でき、メッキ膜の厚みは数μ乃至５０μ
程度が金型表面からの剥離性等が良く好ましい。Next, in step (B), metal is electroplated onto the pattern other than the masking ceramic to form a predetermined metal plating pattern. Metals that can be electroplated include copper, nickel, and
Zinc etc. can be used as appropriate, and the thickness of the plating film is from several microns to 50 microns.
It is preferable that the degree of peeling from the mold surface is good.
電気メツキ法としては、種々の方法があるか、金型を電
極とし、電気メツキ液、例えば硫酸銅液を金型面上に循
環させ、電気メツキ液中の金属イオンを電極の金型表面
に析出付着させメッキパターンを形成する方法がメッキ
効率等が良好で好ましい。There are various methods for electroplating. A mold is used as an electrode, and an electroplating liquid, such as a copper sulfate solution, is circulated over the mold surface, and metal ions in the electroplating liquid are applied to the electrode mold surface. The method of depositing and forming a plating pattern is preferable because it has good plating efficiency.
さらに工程＜Ｃ＞において、上記金型表面に溶融した絶
縁性プラスチックを押圧し、上記金属メッキパターン３
をプラスチック成形品４の表面へ転写し、金属膜５を形
成する。Furthermore, in step <C>, molten insulating plastic is pressed onto the surface of the mold to form the metal plating pattern 3.
is transferred onto the surface of the plastic molded product 4 to form a metal film 5.
絶縁性プラスチックとしては、種々の樹脂が使用できる
。例えばポリ塩化ビニル樹脂、ＡＢＳ樹脂、ＰＥ、ＰＰ
等の通常の熱可塑性樹脂やポリカーボネート（ＰＣ）、
ポリエーテルサルフォン（ＰＥＳ）、ポリエーテルイミ
ド（ＰＥＩ）、ポリフェニレンサルファイド（ＰＰＳ）
、ポリエーテルエーテルケトン（ＰＥＥＫ）等の耐熱性
熱可塑性樹脂、及びエポキシ系、フェノール系等の熱硬
化性樹脂でもよく、使用目的や成形加工方法等によって
適宜選択することができる。金属メッキパターンが転写
され金属膜を形成したプラスチック成形品は冷却後取り
出され、各種用途に供給される。Various resins can be used as the insulating plastic. For example, polyvinyl chloride resin, ABS resin, PE, PP
Ordinary thermoplastic resins such as polycarbonate (PC),
Polyether sulfone (PES), polyetherimide (PEI), polyphenylene sulfide (PPS)
, heat-resistant thermoplastic resins such as polyetheretherketone (PEEK), and thermosetting resins such as epoxy and phenolic resins, which can be appropriately selected depending on the purpose of use, molding method, etc. The plastic molded product, onto which the metal plating pattern has been transferred and the metal film has been formed, is taken out after cooling and supplied for various uses.
本発明では熱プレス法や射出成形法等により金型表面に
溶融したプラスチックが押圧されるために樹脂と金属膜
とのａＣ着がより強固となる。In the present invention, since the molten plastic is pressed onto the mold surface by a hot press method, an injection molding method, etc., the aC adhesion between the resin and the metal film becomes stronger.
以下、本発明を実施例にて説明する。The present invention will be explained below with reference to Examples.
（実施例）
第１図に示した各工程に従い下記条件にて、熱プレス成
形法により導電回路を有するプリント配線板（５０Ｘ１
００Ｘ３ｍｍ）を得た。(Example) A printed wiring board (50x1
00x3mm) was obtained.
工程（Ａ）；金型の材質・・・クロムメッキ鋼。Process (A): Mold material: chrome-plated steel.
セラミック層・・・導電回路に対応する金型表面を被覆
材料で被覆後、Ｓｉ
Ｏをスパッタリング方法により層厚
み約０．５μとした。Ceramic layer: The surface of the mold corresponding to the conductive circuit was coated with a coating material, and then Si 2 O was applied to a layer thickness of approximately 0.5 μm by sputtering.
工程（Ｂ）；電気メツキ法 メッキ液・・・硫酸銅。Process (B): Electroplating method Plating solution: Copper sulfate.
銅メッキの厚み・・・１０μ、線、福・・・・・・０．
５Ｉｆｉｍ。Thickness of copper plating...10μ, wire, thickness...0.
5Ifim.
工程（Ｃ）；絶縁性プラスチック・・・ＡＢＳ樹脂熱プ
レス条件・・・金型温度＝２３０℃、プレス圧＝４０ｋ
ｇ／ｃＪ
上述した方法により導電性回路が良好に形成されたプリ
ント配線板が得られた。Step (C); Insulating plastic...ABS resin heat press conditions...Mold temperature = 230°C, press pressure = 40k
g/cJ A printed wiring board in which a conductive circuit was well formed was obtained by the method described above.
（発 明 の 効 果 ）
上述したように本発明によれば、セラミックを金型内に
マスキング用として使用するので耐熱性、耐衝撃性にほ
れており、連続的かつ容易に絶縁性プラスチック表面に
金属膜を選択的に容易に形成することができる。得られ
た成形品はプリント配線板、平面アンテナ、ハードディ
スク等の電子部品、機材やプラスチック装飾品等各種分
野での利用性か大である。(Effects of the Invention) As described above, according to the present invention, ceramic is used for masking in the mold, so it has excellent heat resistance and impact resistance, and can be applied continuously and easily to the insulating plastic surface. A metal film can be selectively and easily formed. The obtained molded products can be used in various fields such as printed wiring boards, flat antennas, electronic parts such as hard disks, equipment, and plastic decorations.
である。It is.
１・・・・・・金型
２・・・・・・マスキング用セラミック層３・・・・・
・金属メッキパターン
４・・・・・・プラスチック成形品
５・・・・・・金属膜1... Mold 2... Ceramic layer for masking 3...
・Metal plating pattern 4...Plastic molded product 5...Metal film
Claims (1)
型表面に電気メッキを施して、所定の金属メッキパター
ンを形成した後、金型表面に溶融した絶縁性プラスチッ
クを押圧して上記金属メッキパターンをプラスチック成
形品表面へ転写することを特徴とするプラスチック表面
への金属膜形成法。After applying electroplating to the mold surface with a masking ceramic layer fixed to the non-plated parts to form a predetermined metal plating pattern, molten insulating plastic is pressed onto the mold surface to form the metal plating pattern into plastic. A method for forming a metal film on a plastic surface, which is characterized by transfer to the surface of a molded product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1367687A JPH0763975B2 (en) | 1987-01-23 | 1987-01-23 | Method of forming metal film on plastic surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1367687A JPH0763975B2 (en) | 1987-01-23 | 1987-01-23 | Method of forming metal film on plastic surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63182110A true JPS63182110A (en) | 1988-07-27 |
| JPH0763975B2 JPH0763975B2 (en) | 1995-07-12 |
Family
ID=11839790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1367687A Expired - Fee Related JPH0763975B2 (en) | 1987-01-23 | 1987-01-23 | Method of forming metal film on plastic surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0763975B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012102365A (en) * | 2010-11-10 | 2012-05-31 | Koichi Kugimiya | Method for forming functional pattern, and functional device |
| WO2020112224A1 (en) | 2018-11-27 | 2020-06-04 | Macdermid Enthone Inc. | Selective plating of three dimensional surfaces to produce decorative and functional effects |
-
1987
- 1987-01-23 JP JP1367687A patent/JPH0763975B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012102365A (en) * | 2010-11-10 | 2012-05-31 | Koichi Kugimiya | Method for forming functional pattern, and functional device |
| WO2020112224A1 (en) | 2018-11-27 | 2020-06-04 | Macdermid Enthone Inc. | Selective plating of three dimensional surfaces to produce decorative and functional effects |
| US11015255B2 (en) | 2018-11-27 | 2021-05-25 | Macdermid Enthone Inc. | Selective plating of three dimensional surfaces to produce decorative and functional effects |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0763975B2 (en) | 1995-07-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |