JPS63181385A - Cooler for cryogenic computer - Google Patents

Abstract

PURPOSE:To simplify the structure of a cryostat and to dispense with the handling of liquefied gas by a method wherein a cooling plate having gas flow paths is arranged in the midst of a piping between before and behind an expander, and at the same time, a substrate with a semiconductor element buried therein is installed on the cooling plate in an adhered state. CONSTITUTION:Operating gas discharged from a compressor 6 is fed in a heat exchanger 7 via a high-pressure line 12, is heat-exchanged for return gas to be cooled and is fed to an expansion turbine 8. The gas is adiabatically expanded by the turbine 8 to be turned into low-pressure and low temperature gas, is fed to a header 10 of a cooling plate 9, is made to pass through flow paths 16, is gathered in a header 11 on the exit side and is returned to the compressor 6 via the heat exchanger 7 and a low-pressure line 13. By causing the low-temperature operating gas to flow through the flow paths 16, the cooling plate 9 is brought into low temperature, a CPU 1 and a substrate 14 of a memory 2, which are installed on the cooling plate 9 in an adhered state, are cooled and moreover, a semiconductor element 15 is cooled. Thereby, there is no need to provide a liquefied gas tank in the interior of a cryostat, the structure of the cryostat is simplified and furthermore, the complexity for handling liquefied gas is eliminated.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a combination cooling system, and more particularly to a cooling system for a cryogenic computer that uses a cryogenic refrigerator as a cooling source. be.

[Conventional technology]

A combination that operates by cooling a CPU and memory mounted with semiconductor elements to an extremely low temperature.
Bee, Varnish, Special Publication Code 607 (19
1981) pages 93 to 102 (NBS, 8pec)
ial Pub canon 607 (1981) P
93-102), cooling systems for superconducting computers are discussed.

[Problem that the invention seeks to solve]

The above-mentioned conventional technology shows the concept of a cooling system for a computer that applies the superelectric phenomenon.
Moreover, since the memory is directly immersed in the liquefied gas, the structure of the cryostat is complicated, and the handling of the liquefied gas is complicated.

An object of the present invention is to provide a cooling device for a cryogenic computer that has a simple structure and does not require the handling of liquefied gas.

[Means for solving problems]

The above purpose is to have a built-in gas flow path through which operating gas that has become cold due to adiabatic expansion, a cooling plate that also becomes cold when the gas flows through it, and a semiconductor element that functions as a CPU, memory, and memory. This is achieved by mounting the buried substrate in close contact to enable heat exchange.

[For production]

The CPU and memory can be cooled by bringing them into thermal contact with the cooling plate that has been cooled by down cooling generated using a compressor, heat exchanger, and expansion turbine. The structure of the cryostat becomes simpler, and the work of handling liquefied gas becomes unnecessary.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

1 is a CPU mounted with a semiconductor element such as 0M08.

2 is a similar memory, 3 is an input/output interface, a chair, 4 is a lead wire connecting between the CPU 1 and memory 2, and the input/output interface 3, 5 is a cryostat that houses low temperature parts, and 6 is an operating gas (for example, helium). , 7 is a heat exchanger, 8 is an expansion turbine, 9 is a cooling plate, 10.11 is a header, % is a high pressure line %z3 is a low pressure line % 14 is a substrate, Go is a semiconductor element, ! Reference numeral 6 denotes a working gas flow path provided in the cooling plate 9, and 17 denotes coupling fittings (bolts, nuts, etc.) for bringing the cooling plate 9 into close contact with the substrate 14 of the CPUI (or memory 2).

Next, the operation of this embodiment will be explained. The high pressure working gas discharged from the compressor 6 enters the heat exchanger 7 through the high pressure line. In the process of passing through the heat exchanger 7, the gas is cooled by exchanging heat with the low-pressure, low-temperature return gas, and becomes a high-pressure, low-temperature gas, which is then supplied to the expansion turbine 8. The high-pressure, low-temperature working gas that enters the expansion turbine 8 undergoes adiabatic expansion here, becomes a low-pressure, even lower-temperature gas, and is sent to the header 10 of the cooling plate 9. The operating gas fed into the header 10 is transferred to the cooling plate 9.
It passes through channels 16 (generally more than one) in the header 11 on the outlet side and returns to the compressor 6 via the low pressure side of the heat exchanger 7 and the low pressure line 13. As the low-temperature operating gas flows through the flow path 16, the cooling plate 9 becomes low temperature, and the CPU (and memory 2) mounted in close contact with the cooling plate 9
) is cooled, and the semiconductor element is further cooled.

The material for the cooling plate 9 is preferably copper, aluminum, etc., which have good thermal conductivity, and the material for the substrate 14 is preferably ceramic, which has good electrical insulation properties and good thermal conductivity.

According to this embodiment, since the CPUI and memory 2 can be cooled without being immersed in liquefied gas, there is no need to provide a liquefied gas tank inside the cryostat 5, and the structure of the cryostat 5 is simplified. This has the effect of eliminating the complexity of handling liquefied gas.

3 and 4 show other embodiments of the present invention, and the difference from the embodiment of FIG. 1 is that the working gas enters the expansion turbine 8 after passing through the cooling plate 9. cage, cooling plate 9
The gas flowing through the flow path 16 is at high pressure.

Therefore, the density of the gas flowing through the channel 16 of the cooling plate 9 increases, and if the cross-sectional area of the channel 16 and the gas flow rate are the same, the gas flow becomes low. As the gas flow rate decreases, the transfer characteristics also decrease, and the cooling performance of the substrate 14 as well as the CPU 1 and the memory 2 also decreases.

As a means to prevent this, the cross-sectional area of the flow path 16 is reduced to increase the gas flow velocity, and the cooling plate 9 and the substrate 14 are
In order to improve the degree of adhesion, the number of coupling fittings 17 is increased by adding coupling fittings 18 not only around one periphery but also between the channels 16.

〔Effect of the invention〕

According to the present invention, since the CPU and memory can be cooled without immersing them in liquefied gas, there is no need to provide a liquefied gas tank inside the cryostat, and the structure of the cryostat is simplified.

This has the effect of eliminating the complexity of handling liquefied gas.

[Brief explanation of the drawing]

Figure 1 is a system system diagram that is an embodiment of the present invention;
The figures are a cross-sectional view taken along line 1-1 in FIG. 1, FIG. 3 is a system system diagram showing another embodiment of the present invention, and FIG. 4 is a cross-sectional view taken along line nn in FIG. 1...CPU, 2...Memory, 3...
...Interface, 5...Cold tank, 6
...Compressor, 8...Expansion turbine, 9
・・・・・・Cooling plate 41 figure-'212 figure

Claims (1)

[Claims] 1. In a cooling system for a computer that uses semiconductor elements for the CPU and memory and operates at extremely low temperatures, it consists of a compressor, heat exchanger, expander, and piping that connects these devices, and the piping before and after the expander 1. A cooling device for a cryogenic computer, characterized in that a cooling plate having a gas flow path is disposed therebetween, and a substrate in which the semiconductor element is embedded is tightly attached to the cooling plate.