JPS63181309A - Manufacture of solid electrolytic capacitor - Google Patents
Manufacture of solid electrolytic capacitorInfo
- Publication number
- JPS63181309A JPS63181309A JP62012208A JP1220887A JPS63181309A JP S63181309 A JPS63181309 A JP S63181309A JP 62012208 A JP62012208 A JP 62012208A JP 1220887 A JP1220887 A JP 1220887A JP S63181309 A JPS63181309 A JP S63181309A
- Authority
- JP
- Japan
- Prior art keywords
- heat treatment
- resin
- solid electrolytic
- electrolytic capacitor
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims description 16
- 239000007787 solid Substances 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 28
- 229920005989 resin Polymers 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000010409 thin film Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 8
- 239000011261 inert gas Substances 0.000 claims description 5
- 150000002391 heterocyclic compounds Chemical class 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 239000007784 solid electrolyte Substances 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 2
- 239000005062 Polybutadiene Substances 0.000 claims description 2
- 229920002857 polybutadiene Polymers 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000010408 film Substances 0.000 description 11
- 229910052709 silver Inorganic materials 0.000 description 9
- 239000004332 silver Substances 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000011888 foil Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 229920000128 polypyrrole Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 4
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical class CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000010407 anodic oxide Substances 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- 230000002427 irreversible effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- -1 dried Substances 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、固体電解コンデンサの製造方法、特に半導体
層形成後の熱処理方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a solid electrolytic capacitor, and particularly to a method for heat treatment after forming a semiconductor layer.
固体電解コンデンサは、弁作用を有する金属を陽極酸化
し、その陽極酸化膜上に固体電解質の半導体層を形成す
るものであるが、固体電解質としては無機半導体の２酸
化マンガンおよび有機半導体のＴＣＮＱ塩を用いたもの
が周知である。しかし、２酸化マンガン、ＴＣＮＱ塩よ
り優れた高専電度を有するピロール、フラン、チオフェ
ンなどの複素環式化合物のポリマー薄膜を用いることに
より、固体電解コンデンサの特性、製造上に幾多のメリ
ットを得ることができる（たとえば特願昭６０−００３
３２４号）。Solid electrolytic capacitors are made by anodizing a metal that has a valve action and forming a solid electrolyte semiconductor layer on the anodized film.The solid electrolyte is made of manganese dioxide, an inorganic semiconductor, and TCNQ salt, an organic semiconductor. It is well known that the method uses However, by using a polymer thin film of a heterocyclic compound such as pyrrole, furan, or thiophene, which has a higher electrical strength than manganese dioxide or TCNQ salt, numerous advantages can be obtained in terms of the properties and manufacturing of solid electrolytic capacitors. (For example, Japanese Patent Application No. 60-003)
No. 324).
本発明は、上記複素環式化合物のポリマー薄膜を半導体
層とする固体電解コンデンサの製造方法に関するもので
ある。The present invention relates to a method for manufacturing a solid electrolytic capacitor using a polymer thin film of the above-mentioned heterocyclic compound as a semiconductor layer.
上記固体電解コンデンサは、弁作用のある金属を陽極酸
化して、陽極酸化膜上にポリマー薄膜を半導体層として
形成後、再化成した後、たとえば、グラファイト層・銀
ペースト層の形成、リード付け、樹脂外装、検査の順に
工程を経て製品化する。The above-mentioned solid electrolytic capacitor is manufactured by anodizing a metal with a valve action, forming a thin polymer film as a semiconductor layer on the anodic oxide film, and then re-chemically forming it, for example, forming a graphite layer or silver paste layer, attaching leads, The product is made into a product after going through the steps of resin exterior and inspection.
上記工程中には、熱処理が含まれるが、熱処理の条件に
より製品としてｔａｎδが劣化することが観察された。Although heat treatment is included in the above process, it was observed that the tan δ of the product deteriorates depending on the conditions of the heat treatment.
本発明の目的は、上記劣化の原因を探究した結果に基づ
き、特性劣化のない熱処理条件を確定した製造方法を提
供することにある。An object of the present invention is to provide a manufacturing method in which heat treatment conditions that do not cause property deterioration are determined based on the results of investigating the causes of the deterioration.
本発明においては、弁作用を有する金属の陽極体に、ポ
リマー薄膜を形成後、樹脂外装製品にいたる工程におけ
る熱処理が、前記ポリマー薄膜が酸素ふんい気にふれな
い環境においてなされるようにしている。特に樹脂外装
をしない前の工程における熱処理は、不活性ガス中で行
なう。樹脂外装後は、特定の樹脂をのぞき、大気中で熱
処理を行なっても、酸素ふんい気を遮断した環境になる
ので、ｔａｎδの劣化はない。In the present invention, after forming a polymer thin film on a metal anode body having a valve action, the heat treatment in the process leading to the resin exterior product is performed in an environment where the polymer thin film is not exposed to oxygen atmosphere. . In particular, the heat treatment in the step before applying the resin exterior is performed in an inert gas. After being coated with resin, even if heat treatment is performed in the atmosphere, except for certain resins, there will be no deterioration in tan δ because the environment is cut off from oxygen.
なお、熱処理は、グラファイト、銀ペースト、樹脂など
の硬化のためになされるが、熱処理は一工程でまとめて
実施しても、あるいは数工程に分けて行なうようにして
もよい。Note that the heat treatment is performed to harden graphite, silver paste, resin, etc., but the heat treatment may be performed all at once in one step, or may be performed in several steps.
固体電解コンデンサのｔａｎδの劣化は、半導体層であ
るポリマー薄膜の抵抗増大によるものである。そして、
この抵抗増大はポリマー薄膜の酸素吸収による不可逆的
な変化によるものであることを実験的に確かめた。The deterioration of tan δ of a solid electrolytic capacitor is due to an increase in the resistance of the polymer thin film, which is a semiconductor layer. and,
It was experimentally confirmed that this increase in resistance was due to an irreversible change due to oxygen absorption in the polymer thin film.
第３図は、実験的にポリピロール膜自体について高温放
置による比抵抗の変化をタンタル箔上に１０１０ｍｍＸ
５０膜厚１００μに形成した試料につき実測した結果を
示す。第３図（ａｌに示すように、両端に銀ペーストに
よりリード付けをなし、リード間の抵抗変化を測定する
。第３図（ｂ）は高温１８０℃、１２５℃に放置した各
場合につき抵抗変化の傾向を比抵抗〔Ω・口〕で示した
ものである。Figure 3 shows experimentally the change in resistivity of the polypyrrole film itself due to exposure to high temperatures at 1010mmX on tantalum foil.
The results are shown below, which were actually measured on a sample formed with a film thickness of 100 μm. As shown in Figure 3 (al), connect leads with silver paste at both ends and measure the resistance change between the leads. Figure 3 (b) shows the resistance change when left at high temperatures of 180°C and 125°C. The tendency is shown in resistivity [Ω・mouth].
図示していないが、Ｎ２ガス中で、１８０℃放置した場
合は全く変化なく、抵抗変化は大気中の酸素によること
がわかった。Although not shown, when left at 180° C. in N2 gas, there was no change at all, indicating that the change in resistance was due to oxygen in the atmosphere.
したがって、不活性ガス中、あるいは大気中でも樹脂外
装により酸素遮断した状態で、熱処理を行なうようにし
て、ｔａｎδの劣化を防止できる。Therefore, deterioration of tan δ can be prevented by performing heat treatment in an inert gas or in the atmosphere with oxygen blocked by the resin sheath.
以下の実施例では、定格６．３Ｖ、４．７μＦのコンデ
ンサを対象とし、陽極体としてアルミニウムを用い、表
面を粗面化したアルミニウムエツチド箔を５１×３０鶴
に切断し、先ずアジピン酸系化成液中で２０Ｖで定電圧
化成を行ない、箔表面に陽極酸化膜を形成する。In the following example, a capacitor with a rating of 6.3 V and 4.7 μF is targeted, aluminum is used as the anode body, aluminum etched foil with a roughened surface is cut into 51 x 30 squares, and adipic acid Constant voltage chemical conversion is performed in a chemical solution at 20 V to form an anodic oxide film on the foil surface.
次に、アルミニウムエツチド箔の陽極リードになる部分
をレジスト部材で保護し、その他の部分にポリピロール
膜の電解酸化重合による形成を行なう。この形成はアセ
トニトリル１１を溶媒として、ピロール０．０５ｍｏｌ
（３，０ｇ）と支持塩のアンモニウムボロジサリチ
レート約０．０２ｍｏｌ （６，０ｇ）とを熔解した
電解液中で、−４３℃、１０ｍＡ／ｃｎｉの電流を１０
分間流して行なった。Next, the portion of the aluminum etched foil that will become the anode lead is protected with a resist member, and a polypyrrole film is formed on the other portions by electrolytic oxidation polymerization. This formation was performed using acetonitrile 11 as a solvent and 0.05 mol of pyrrole.
(3.0 g) and about 0.02 mol (6.0 g) of ammonium borodisalicylate as a supporting salt were dissolved in an electrolytic solution at -43°C and a current of 10 mA/cni was applied for 10 min.
I did it for a minute.
電解酸化重合処理後、再化成処理をなし、再化成を終え
た箔を純水で洗浄、乾燥し、グラファイト層・銀ペース
ト層を順にディップ法で形成した後、銀ペーストで陰極
リードを引出し、シリコーン系樹脂で外装しコンデンサ
とする。第５図がコンデンサの断面図で、１がアルミニ
ウムエツチド箔で先端が陽極リードになっている。コン
デンサ構成要素部は、アルミニウム酸化膜２．ポリピロ
ール膜３．グラファイト層４．銀ペースト層５からなり
、銀ペースト６によって、陰極リード７が接続されてい
る。８はレジスト層である。リード部をのぞき、全体が
シリコーン系の樹脂９で外装されている。After electrolytic oxidation polymerization treatment, reconversion treatment is performed, and the reconversion foil is washed with pure water, dried, and a graphite layer and a silver paste layer are sequentially formed by the dipping method.The cathode lead is drawn out using silver paste. Cover it with silicone resin and use it as a capacitor. Figure 5 is a cross-sectional view of the capacitor, in which 1 is an aluminum etched foil whose tip is an anode lead. The capacitor component part has an aluminum oxide film 2. Polypyrrole film 3. Graphite layer 4. It consists of a silver paste layer 5, and a cathode lead 7 is connected to it by silver paste 6. 8 is a resist layer. Except for the lead portion, the entire body is coated with silicone resin 9.
熱処理工程を種々変化した結果を第１図（ａ）に、熱処
理をなした工程をＡ、Ｂ、Ｃで示し、第１図（ｂ）に、
前記Ａ、Ｂ、Ｃの条件を変化し、製品のｔａｎδに及ぼ
す影響を求めた。各サンプルは５０ケずつ行ない、特性
値はその平均値を示す。この結果から、Ｎ２ガス中で、
熱処理を行なえば、特性値に全く影響を与えないことが
わかる。さらに、外装が酸素を遮断する効果を与えるこ
とを検討するため、１２５℃の長期のシェルテストを行
なった結果を第２図に示す。この図は各６ケのサンプル
につき、無外装のものと、外装したものとについて、１
０ ＫＨｚ、 １２０Ｈｚのｔａｎδの時間変化を実
測したものである。上記サンプルは外装前は熱処理を行
なっていないので、シェルテスト期間が熱処理期間にな
っている。The results of various heat treatment steps are shown in Figure 1 (a), the heat treatment steps are indicated by A, B, and C, and Figure 1 (b) shows the results of various changes in the heat treatment process.
The conditions of A, B, and C were varied to determine their effects on the tan δ of the product. Fifty samples were conducted for each sample, and the characteristic values indicate the average values. From this result, in N2 gas,
It can be seen that heat treatment does not affect the characteristic values at all. Furthermore, in order to examine the effectiveness of the outer packaging in blocking oxygen, we conducted a long-term shell test at 125°C, and the results are shown in Figure 2. This figure shows 1 for each of the 6 samples, one without packaging and one with packaging.
This is an actual measurement of the time change of tan δ at 0 KHz and 120 Hz. The above sample was not heat treated before being packaged, so the shell test period was the heat treatment period.
このように、本発明の提示するように、外装前において
はＮＺガス中で熱処理を行なうか、あるいは外装後に熱
処理を行なうことによって、ポリマー薄膜の抵抗増加に
よるｔａｎδの劣化を防ぐことができる。As described above, as proposed by the present invention, deterioration of tan δ due to increased resistance of the polymer thin film can be prevented by performing heat treatment in NZ gas before packaging or by performing heat treatment after packaging.
なお、熱処理効果は、熱処理工程がどの段階においてな
されても、その時間和が効果として表われる。したがっ
て、大気中における処理として熱ストレスの和が小さい
ならば、ある程度ｔａｎδの増大を低くおさえる。Note that the heat treatment effect is expressed as the sum of the times, no matter at which stage the heat treatment step is performed. Therefore, if the sum of heat stress is small when processing in the atmosphere, the increase in tan δ can be suppressed to some extent.
第４図は、経験的に一応ｔａｎδを１０％以下におさめ
ることのできる熱ストレスを図示したものである。しか
し熱処理工程の短縮化、信頼性の向上のためには、外装
前の熱処理は、不活性ガス中で行ない、大気中であれば
外装後に行なうようにした方が確実である。FIG. 4 is a diagram illustrating the thermal stress that allows tan δ to be kept below 10% based on experience. However, in order to shorten the heat treatment process and improve reliability, it is more reliable to perform the heat treatment before packaging in an inert gas, and if it is in the atmosphere, to perform it after packaging.
なお、外装樹脂としては、エポキシ樹脂以外の樹脂、た
とえば、シリコーン系、ポリブタジェン系もしくはウレ
タン系などであれば、同様な効果を与える。Note that the same effect can be obtained as the exterior resin if it is a resin other than epoxy resin, such as a silicone type, a polybutadiene type, or a urethane type.
また、実施例として、ポリマー薄膜はビロールの複素環
式化合物について説明したが、他のフラン、チオフェン
などについても同様である。Further, as an example, the polymer thin film was explained using a heterocyclic compound of virol, but the same applies to other furan, thiophene, etc.
以上説明したように、固体電解コンデンサの半導体層で
あるポリマー薄膜が、製造工程中の熱処理により酸素と
反応し不可逆的な変化をなすことで抵抗が増大し、製品
の特性としてｔａｎδの劣化をおこすことを確かめ、そ
の対策方法を確立した。As explained above, the polymer thin film, which is the semiconductor layer of solid electrolytic capacitors, reacts with oxygen due to heat treatment during the manufacturing process, causing an irreversible change that increases resistance and causes a deterioration of tanδ as a product characteristic. We confirmed this and established a countermeasure.
すなわち樹脂外装以前における熱処理をＮ２ガスなどの
不活性ガス中で行なうか、あるいは樹脂外装によりポリ
マー薄膜が酸素から遮断され保護された状態で熱処理を
行なうようにする。That is, the heat treatment before the resin sheathing is performed in an inert gas such as N2 gas, or the heat treatment is performed while the polymer thin film is shielded from oxygen and protected by the resin sheath.
第１図は、本発明の一実施例として、熱処理条件を変え
た場合を、第２図は樹脂外装の効果を示す図、第３図は
ポリピロール膜の高温放置による抵抗変化を示す図、第
４図は大気中の熱処理として経験的に求めた許容熱スト
レス、第５図は上記各データを求めた試料の断面図であ
る。
１−アルミニウムエツチド箔、
２−アルミニウム酸化膜、
３・−ポリピロール膜、 ４−グラファイト層、５・−
銀ペースト層、 ６−銀ペースト、７・−陰極リード、
８− レジスト層、９−樹脂。Fig. 1 shows an example of the present invention in which the heat treatment conditions are changed, Fig. 2 shows the effect of the resin coating, Fig. 3 shows the change in resistance of a polypyrrole film when left at high temperatures, and Fig. Figure 4 shows the allowable thermal stress empirically determined as heat treatment in the atmosphere, and Figure 5 is a cross-sectional view of the sample from which the above data were determined. 1-aluminum etched foil, 2-aluminum oxide film, 3-polypyrrole film, 4-graphite layer, 5-
silver paste layer, 6-silver paste, 7-cathode lead,
8- resist layer, 9- resin.
Claims (3)
膜を半導体層とする固体電解コンデンサにおいて、 弁作用を有する金属の陽極体に、前記半導体層を形成後
、樹脂外装製品にいたる工程における熱処理が、前記ポ
リマー薄膜が酸素ふんい気にふれない環境においてなさ
れることを特徴とする固体電解コンデンサの製造方法。(1) In a solid electrolytic capacitor whose semiconductor layer is a polymer thin film produced by electrolytic oxidative polymerization of a heterocyclic compound, after the semiconductor layer is formed on the valve-acting metal anode body, heat treatment is performed in the process leading to the resin-clad product. . A method for producing a solid electrolytic capacitor, characterized in that the polymer thin film is produced in an environment where it is not exposed to oxygen.
外装工程以前の工程においては、不活性ガス中で行なわ
れることを特徴とする特許請求の範囲第１項記載の固体
電解コンデンサの製造方法。(2) Manufacturing a solid electrolytic capacitor according to claim 1, wherein the heat treatment in claim 1 is performed in an inert gas in each step, particularly in the steps before the resin packaging step. Method.
ブタジエン系もしくはウレタン系の樹脂であって、大気
中で熱処理がなされることを特徴とする特許請求の範囲
第１項記載の固体電解コンデンサの製造方法。(3) The solid electrolyte according to claim 1, wherein the exterior resin according to claim 1 is a silicone-based, polybutadiene-based, or urethane-based resin, and is heat-treated in the atmosphere. Method of manufacturing capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62012208A JPH0770437B2 (en) | 1987-01-23 | 1987-01-23 | Method for manufacturing solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62012208A JPH0770437B2 (en) | 1987-01-23 | 1987-01-23 | Method for manufacturing solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63181309A true JPS63181309A (en) | 1988-07-26 |
| JPH0770437B2 JPH0770437B2 (en) | 1995-07-31 |
Family
ID=11798966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62012208A Expired - Lifetime JPH0770437B2 (en) | 1987-01-23 | 1987-01-23 | Method for manufacturing solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0770437B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5586000A (en) * | 1993-12-28 | 1996-12-17 | Nec Corporation | Solid electrolytic capacitor and process for production thereof |
| FR2826315A1 (en) | 2001-06-22 | 2002-12-27 | Giesecke & Devrient Gmbh | DATA SUPPORT WITH DISPLAY ELEMENT |
| WO2022118785A1 (en) * | 2020-12-01 | 2022-06-09 | 日本ケミコン株式会社 | Electrolytic capacitor and method for manufacturing electrolytic capacitor |
-
1987
- 1987-01-23 JP JP62012208A patent/JPH0770437B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5586000A (en) * | 1993-12-28 | 1996-12-17 | Nec Corporation | Solid electrolytic capacitor and process for production thereof |
| FR2826315A1 (en) | 2001-06-22 | 2002-12-27 | Giesecke & Devrient Gmbh | DATA SUPPORT WITH DISPLAY ELEMENT |
| WO2022118785A1 (en) * | 2020-12-01 | 2022-06-09 | 日本ケミコン株式会社 | Electrolytic capacitor and method for manufacturing electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0770437B2 (en) | 1995-07-31 |
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