JPS63179763A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS63179763A JPS63179763A JP1193587A JP1193587A JPS63179763A JP S63179763 A JPS63179763 A JP S63179763A JP 1193587 A JP1193587 A JP 1193587A JP 1193587 A JP1193587 A JP 1193587A JP S63179763 A JPS63179763 A JP S63179763A
- Authority
- JP
- Japan
- Prior art keywords
- heat generating
- printing
- recording surface
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims description 41
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 238000007639 printing Methods 0.000 abstract description 36
- 239000010410 layer Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ファクシミリや各種プリンタ等に搭載される
サーマルヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head installed in facsimile machines, various printers, and the like.
本発明は、耐摩耗性基板上に複数の発熱抵抗部及び駆動
回路部が形成され、この発熱抵抗部を選択的に発熱させ
て感熱記録を行うサーマルヘッドにおいて、
基板の発熱抵抗部側に支持放熱板を接合し、この基板の
裏面側の発熱抵抗部と対応する部面を一端縁方向に低く
傾斜する傾斜面に形成して感熱記録を行う記録面と成し
、この記録面に対応して発熱抵抗部と別に予熱用発熱抵
抗部を形成することにより、感熱記録に先だって記録面
部の肉厚部側を予め加熱し、記録面における温度むらを
改善して印字品質の向上を図ろうとするものである。The present invention provides a thermal head in which a plurality of heat-generating resistors and drive circuit parts are formed on a wear-resistant substrate, and which performs thermal recording by selectively generating heat in the heat-generating resistors, which is supported on the heat-generating resistor side of the substrate. A heat dissipation plate is bonded, and the surface corresponding to the heat generating resistor on the back side of this substrate is formed into a slope that slopes low toward one edge to form a recording surface on which thermal recording is performed. By forming a heat generating resistor for preheating separately from the heat generating resistor, the thick side of the recording surface is preheated prior to thermal recording, improving temperature unevenness on the recording surface and improving printing quality. It is something.
従来、ライン型あるいはシリアル型等のサーマルヘッド
では、発熱搗抗体の駆動方式としてダイレクトドライブ
方式やダイオードマトリックス方式の何れかが主に珠用
されている。そして、このような方式のサーマルヘッド
においては、駆動回踏部等を構成するIC,ダイオード
等の半導体素−fベレットをサーマルヘッド基板に直接
実装して小型化を図っている。Conventionally, in line type or serial type thermal heads, either a direct drive type or a diode matrix type has been mainly used as a driving method for a heating element. In this type of thermal head, semiconductor elements such as ICs and diodes constituting the drive circuit are directly mounted on the thermal head substrate to achieve miniaturization.
しかしながら、この種のサーマルヘッドにおいては、小
型化、信頼性、製品価格等の点で制約が多く、その改善
が望まれている。However, this type of thermal head has many limitations in terms of miniaturization, reliability, product price, etc., and improvements are desired.
すなわち、従来のサーマルヘッドは、第3図に示すよう
に、基板(101)上に実装された駆動用半導体素子(
102)を保護するために、この素子(102)を封止
剤(103)でモールドし史に封止部カバー(104)
にて被覆した構造になっている。That is, as shown in FIG. 3, the conventional thermal head includes a driving semiconductor element (101) mounted on a substrate (101).
102), this element (102) is molded with a sealant (103) and a sealing part cover (104) is attached.
It has a structure covered with.
そして、この種のサーマルヘッドでは良好な印字を得る
ため、プラテン(105)の当たり特性を確保すること
が必要不可欠となっている。すなわち、このサーマルヘ
ッドにおいては、封止部カバー(104)がプラテン(
105)からのペーパーバスPより逃れる必要があった
。言い換えれば、発熱抵抗体から駆動用半導体素子(1
02)までの距離W1は封止部カバー(104)の厚み
tとプラテン(105)の外形寸法によって制約される
ので、ヘッドの小型化には限界があった。また、この制
約は基板(101)の小型化の妨げとなり、従来より基
板材として多用されているグレーズセラミック(^h0
3)が高価であることより、材料コストの点からもこの
改善が望まれている。In order to obtain good printing with this type of thermal head, it is essential to ensure the contact characteristics of the platen (105). That is, in this thermal head, the sealing part cover (104) is attached to the platen (
It was necessary to escape from the paper bus P from 105). In other words, from the heating resistor to the driving semiconductor element (1
Since the distance W1 to 02) is limited by the thickness t of the sealing part cover (104) and the external dimensions of the platen (105), there is a limit to miniaturization of the head. In addition, this restriction hinders the miniaturization of the substrate (101), and glaze ceramic (^h0
Since 3) is expensive, this improvement is desired also from the viewpoint of material cost.
一方、従来のサーマルヘッドでは、発熱抵抗体に耐酸化
層を介して耐摩耗層が形成され、プラテン(105)か
ら発熱抵抗体を保護する構造となっている。On the other hand, in a conventional thermal head, a wear-resistant layer is formed on the heating resistor via an oxidation-resistant layer to protect the heating resistor from the platen (105).
しかしながら、これら耐酸化層や耐摩耗層はスパッタリ
ング等の薄膜形成技術で積層しているので、耐摩耗層を
厚膜構造とし摩耗寿命を確保するには限界があった0例
えば、耐摩耗層を10μm以上股付けしようとすると、
この膜付けに長時間を要するとともに、成膜時の膜応力
によりクラック等が発生し、ヘッドの信頼性が低下して
しまう。However, since these oxidation-resistant layers and wear-resistant layers are laminated using thin film formation techniques such as sputtering, there are limits to making the wear-resistant layer a thick film structure and ensuring a long wear life. If you try to crotch more than 10μm,
It takes a long time to form this film, and cracks and the like occur due to film stress during film formation, reducing the reliability of the head.
さらに、上記当たり特性を確保するには、発熱抵抗体に
給電する電極の膜厚も0.5〜1.5μm程度に制限さ
れるので、ワイヤボンディング作業が煩雑となるととも
に、この接続の信頼性の点で問題が残されていた。Furthermore, in order to ensure the above-mentioned contact characteristics, the thickness of the electrode that feeds power to the heating resistor is limited to about 0.5 to 1.5 μm, which makes wire bonding work complicated and reduces the reliability of this connection. Problems remained in this regard.
ところで近年、感熱記録の分野では、サーマルヘッドの
小型化、高信頼性化の傾向にあり、上述の如〈従来のサ
ーマルヘッドでは、これら要望を十分に満足することが
できず、この改善が望まれている。In recent years, however, in the field of thermal recording, there has been a trend toward smaller thermal heads and higher reliability. It is rare.
そこで一方の面に発熱抵抗部及び半導体素子を有する駆
動回路部を形成した基板の他方の面、即ち裏面側をプラ
テンが当接される記録面とし、この記録面の発熱抵抗部
に対応する部分の板厚を薄くするために傾斜面に形成し
たサーマルヘッドが提案されている。Therefore, the other surface, that is, the back side, of the substrate on which the heat generating resistor and the driving circuit section having the semiconductor element are formed is the recording surface that the platen comes into contact with, and the portion of this recording surface that corresponds to the heat generating resistor. A thermal head formed on an inclined surface has been proposed in order to reduce the thickness of the plate.
この構成においては発熱抵抗部から記録面上の感熱記録
紙までの距離が一定でなく、即ち、発熱抵抗部とこれと
対応する記録傾斜面までの距離は内側部位と外側部位で
は異なるため、記録面における温度は発熱抵抗部と直上
に対応する部面と薙も一定ではなくなる。従ってこの記
録面の温度むらにより感熱紙上の印字ドツトに発色濃度
むらが生じ易く印字品質が低下する等の不具合がある。In this configuration, the distance from the heat-generating resistor to the thermal recording paper on the recording surface is not constant, that is, the distance between the heat-generating resistor and the corresponding recording slope is different between the inner and outer regions. The temperature on the surface is also not constant between the heat generating resistor and the surface directly above it. Therefore, due to the temperature unevenness of the recording surface, color density unevenness tends to occur in printed dots on the thermal paper, resulting in problems such as deterioration of printing quality.
かかる点に鑑み本発明は提案されたものであり、発熱抵
抗部により加熱される傾斜記録面の温度むらを低減させ
て印字ドツトに一定発色濃度が得られて優れた印字品質
が期待できるサーマルヘッドを提供することを目的とす
る。In view of the above, the present invention has been proposed, and provides a thermal head that can reduce the temperature unevenness of the inclined recording surface heated by the heating resistor, obtain a constant color density in the printed dots, and can be expected to provide excellent printing quality. The purpose is to provide
前述した問題を解決するために本発明のサーマルヘッド
は、耐摩耗性基板上に複数の発熱抵抗部及び駆動回路部
が形成され、該発熱抵抗部を選択的に発熱させて感熱記
録を行うサーマルヘッドにおいて、基板の発!!)抵抗
部側に支持放熱板が接合されると共に基板の裏面側は発
熱抵抗部と対応する部面が、一端縁方向に低く側斜する
傾斜面に形成され、この傾斜面を感熱記録を行う記録面
と成し、基板の記録面に対応して発熱抵抗部と別に予熱
用発?!低抗部を形成したことを特徴とするものである
。In order to solve the above-mentioned problems, the thermal head of the present invention includes a plurality of heat-generating resistors and drive circuit parts formed on a wear-resistant substrate, and selectively generates heat in the heat-generating resistors to perform thermal recording. At the head, the board is emitted! ! ) A support heat sink is bonded to the resistor side, and on the back side of the substrate, a part corresponding to the heat generating resistor part is formed into an inclined surface that slopes low toward one edge, and thermal recording is performed on this inclined surface. Is there a preheating generator separate from the heating resistor part corresponding to the recording surface of the board? ! It is characterized by forming a low resistance part.
本発明のサーマルヘッドは基板の発熱抵抗部や駆動回路
部が形成される形成面の裏面側で感熱記録を行う構造と
している。The thermal head of the present invention has a structure in which thermal recording is performed on the back side of the surface on which the heating resistor section and drive circuit section of the substrate are formed.
このように発熱抵抗部や半導体素子等の駆動回路部は感
熱記録面と異なる面に形成することにより、その配置が
自由で発熱抵抗部を基板の一端側に形成することができ
る。また基板裏面側の一端縁方向に低く傾斜する傾斜面
により発熱抵抗部に対応する部分の板厚は比較的薄くな
り、発熱抵抗部からの熱がN4斜面により形成される記
録面側に伝わり易く、この記録面部に対応して発熱抵抗
部とは別に予熱用発熱部を形成したことにより記録に先
だって記録面部の肉厚部を予め加熱できて、記録面部は
温度むらが低減されて感熱紙上の印字ドツトは一定の発
色濃度となり印字品質の向上が図れる。In this way, by forming the heat generating resistor section and the drive circuit section such as the semiconductor element on a surface different from the thermosensitive recording surface, the heat generating resistor section can be freely arranged and formed on one end side of the substrate. In addition, due to the inclined surface that slopes low toward one edge on the back side of the substrate, the thickness of the portion corresponding to the heat generating resistor part becomes relatively thin, and the heat from the heat generating resistor part is easily transmitted to the recording surface side formed by the N4 slope. By forming a heating part for preheating separately from the heating resistor corresponding to this recording surface part, the thick part of the recording surface part can be preheated before recording, and the temperature unevenness of the recording surface part is reduced, so that it can be heated evenly on the thermal paper. The printed dots have a constant color density, and printing quality can be improved.
以下、本発明を通用した具体的な実施例について説明す
る。Hereinafter, specific examples that make use of the present invention will be described.
本例のサーマルヘッドは第1図及び第2図に示すように
、耐摩耗性基板+1)の一平面(1a)上の前端縁寄り
に印字用発熱抵抗パターン(2)が形成され、この印字
用発熱部抗パターン(2)の内側に位置し°ζ予熱用発
熱抵抗パターン(3)を形成すると共にこの両発熱搗抗
パターン(2)と(3)の夫々の分割電極パターン(4
a) 、 (4b)と(5a) 、 (5b)をそ
の間に絶縁1% (61を介在して形成し、また基板(
11の一平面(1a)の後端部には端子t!1tWAパ
ターン(7)が形成され、中間部には共通電極パターン
(8)が形成されている。この基板(1)の一平面(l
a)に駆動回路部、本実施例ではIC等の半導体素子(
以下ドライブICと云う)(9)が実装されて、これら
発熱抵抗パターン(21、(3)及びドライブI(j9
)側に耐酸化層(10)及び接着層(11)を介して支
持放熱板(12)が接合一体化された構造を有している
。耐摩耗性基板(1)としては石英、アルカリ成分をし
有しないガラス等を用い、本実施例においてはボウケイ
酸ガラスを用いる。また、耐酸化層(1o)としてはS
i3N+ + 5i(h等が用いられ、接着層(11
)は絶縁性接着剤が用いられる。As shown in FIGS. 1 and 2, the thermal head of this example has a heating resistor pattern (2) for printing formed near the front edge on one plane (1a) of the wear-resistant substrate +1. A heating resistor pattern (3) for preheating is formed inside the heating resistor pattern (2) for heating, and a divided electrode pattern (4) for each of the heating resistor patterns (2) and (3) is formed.
a), (4b) and (5a), (5b) are formed with 1% insulation (61) interposed between them, and the substrate (
At the rear end of one plane (1a) of 11 is a terminal t! A 1tWA pattern (7) is formed, and a common electrode pattern (8) is formed in the middle part. One plane (l) of this substrate (1)
a) is a drive circuit section, and in this example, a semiconductor element such as an IC (
(hereinafter referred to as drive IC) (9) is mounted, and these heating resistor patterns (21, (3) and drive I (j9) are mounted.
) side has a structure in which a support heat dissipation plate (12) is integrally bonded via an oxidation-resistant layer (10) and an adhesive layer (11). As the wear-resistant substrate (1), quartz, glass having no alkali component, or the like is used, and in this embodiment, borosilicate glass is used. In addition, as the oxidation-resistant layer (1o), S
i3N+ + 5i (h etc. is used, adhesive layer (11
), an insulating adhesive is used.
そして、基板(1)の他面(裏面側) (lb)が感
熱記録面となっており、この裏面側(1b)は印字用発
熱部抗パターン(2)の発熱抵抗部(以下印字用発熱部
と云う) (2A)に対応する部面が肉薄となるよう
に前端線方向に低く傾斜して研F11シ、傾斜面(lb
x)に形成されてこの傾斜面(lbt)に感熱記録紙p
を摺接させてプラテンPにより押圧保持することにより
感熱記録紙pに対し感熱記録を行うように成されている
。The other side (back side) (lb) of the substrate (1) is a heat-sensitive recording surface, and this back side (1b) is the heating resistor part (hereinafter referred to as the heating heating part for printing) of the printing heating part resistance pattern (2). The inclined surface (lb
x) and a thermal recording paper p is formed on this inclined surface (lbt).
Thermal recording is carried out on the thermal recording paper p by slidingly contacting the recording paper p and holding it under pressure with the platen P.
基板(11に実装されたドライブIC+9)の出方側は
印字用発熱抵抗パターン(2)の一方の電極パターン(
4a)に、入力側は端子電極パターン(7)に夫々Au
等の導線(13a ) 、 (13b )をワイヤボ
ンディング等の手段にて接続して印字用発熱抵抗パター
ン(2)とドライブIC(9)とを導通させており、端
子電極パターン(7)にはその後半部に外部駆動回路と
の導通を図るフレキシブルプリントサーキットプレート
(14)が異方導電膜(15)を介して接続されている
。そして第2図に示すように、印字用発熱抵抗パターン
(2)上に分断して積層形成された電極パターン(4a
) 、 (4b)及び共通電極パターン(8)の間が
前述した印字用発熱部(2A)となって発熱して印字に
寄与する構成となっている。The output side of the board (drive IC+9 mounted on 11) is one electrode pattern (
4a), on the input side, Au is applied to the terminal electrode pattern (7).
Conductive wires (13a) and (13b) are connected by means such as wire bonding to establish electrical continuity between the heating resistor pattern for printing (2) and the drive IC (9), and the terminal electrode pattern (7) A flexible printed circuit plate (14) for electrical connection with an external drive circuit is connected to the rear half thereof via an anisotropic conductive film (15). As shown in FIG. 2, an electrode pattern (4a
), (4b) and the common electrode pattern (8) serves as the above-mentioned printing heating section (2A), which generates heat and contributes to printing.
従って、サーキットプレート(14)を介して供給され
る駆動電流によりドライブIC(9)が駆動し、印字用
発熱部(2A)を選択的に発熱させ、基板(1)の裏面
側、即ち傾斜面(lbx )の端部近傍において感熱記
録が行われる。以下この傾斜面(ibr)を記録面と云
う。Therefore, the drive IC (9) is driven by the drive current supplied via the circuit plate (14), selectively generates heat in the printing heat generating part (2A), and Thermal recording is performed near the end of (lbx). Hereinafter, this inclined surface (ibr) will be referred to as a recording surface.
また、予熱用発熱部抗パターン(3)は印字用発熱抵抗
パターン(2)の内側部面、即ち基板(1)の傾斜記録
面(lbx)の高位部に対応した部面に横方向に帯状に
連続して形成してあり、この予熱用発熱抵抗パターン(
3)の一方のm極パターン(5a)は、基板(1)の後
端部側に導出されて外部?a源導体に接続され、他方の
電極パターン(5a)は共11fl電極パターン(8)
に接続されて予熱用発熱部抗パターン(3)のの予熱用
発熱部(3A)は印字用発熱部(2^)とは別個に発熱
するように成されている。Furthermore, the preheating heat generating resistor pattern (3) is formed in the form of a horizontal band on the inner surface of the printing heat generating resistor pattern (2), that is, on the surface corresponding to the high part of the inclined recording surface (lbx) of the substrate (1). This heating resistor pattern for preheating (
One of the m-pole patterns (5a) in 3) is led out to the rear end side of the substrate (1) and externally? The other electrode pattern (5a) is connected to the a source conductor, and the other electrode pattern (5a) is also connected to the 11fl electrode pattern (8).
The preheating heat generating part (3A) of the preheating heat generating part anti-pattern (3) is configured to generate heat separately from the printing heat generating part (2^).
このように本実施例のサーマルヘッドにおいては、基板
(1)の裏面側(lb)を記録面としているので、プラ
テンPの当たり特性は良好なものとなる。In this way, in the thermal head of this embodiment, since the back side (lb) of the substrate (1) is used as the recording surface, the contact characteristics of the platen P are good.
また、発熱抵抗パターン(21、’ (3)や駆動回路
(ドライブIC(9))の形成面は表面側(1a)で裏
面側(1b)の記録面とは異なることによりプラテンP
からのペーパーバスを考慮することなく、ドライブIC
+91等の配置スペースを自由に設定できる。Also, since the surface on which the heating resistor pattern (21,' (3) and the drive circuit (drive IC (9)) are formed is on the front side (1a) and is different from the recording surface on the back side (1b), the platen
Drive IC without considering the paper bus from
You can freely set the placement space such as +91.
従って基板(1)の寸法制約が大幅に緩和されるので、
基板(1)の小型化を図ることができる。Therefore, the dimensional constraints on the substrate (1) are significantly relaxed, so
The substrate (1) can be made smaller.
また、基板+1)の厚みは後述する裏面側(1b)の記
録面(lbl)の研削量を調整することにより自由に設
定でき、耐摩耗性が向上すると共にその表面側(la)
に形成される駆動回路のドライブIC(3)を保護でき
てヘッドの長寿命化を図ることができる。In addition, the thickness of the substrate +1) can be freely set by adjusting the amount of grinding of the recording surface (lbl) on the back side (1b), which will be described later.
The drive IC (3) of the drive circuit formed in the head can be protected and the life of the head can be extended.
この基板(11の材料としては従来のようにグレースト
セラミック等の高価な材料に比しガラスや石英等を使用
するので、前述した小型化と相って材料コストの大幅な
低減化が可能となる。さらに基板(1)はウェハ等の薄
板で形成され、従来のようなスパッタリング等の作業能
率の低い工程を経ることなく厚膜化できて、生産性が大
幅に向上すると共に、スパッタリング装置等の高価な設
備が不要となる。As the material for this substrate (11) is glass, quartz, etc., compared to conventionally expensive materials such as graze ceramic, it is possible to significantly reduce material costs in conjunction with the aforementioned miniaturization. Furthermore, since the substrate (1) is formed of a thin plate such as a wafer, it is possible to thicken the film without going through the conventional process with low work efficiency such as sputtering, which greatly improves productivity. This eliminates the need for expensive equipment.
そして、ドライブfc(9)と電極パターン(4a)
。Then, drive fc (9) and electrode pattern (4a)
.
(7)とのワイヤボンディング部はシリコーン樹脂等の
封止材(16)にてモールドされている。このドライブ
IC(9)や電極パターン(4a) 、 (4b)
、 (7)上に耐酸化層(10) 、接着層(11)を
介して固着一体化される支持放熱板(12)にはドライ
ブIC(9)と対向する部分に略凹字状の切欠き部(1
2a)が形成されて前述した封止材(16)によるモー
ルド部が収納されてドライブIC(91等は支持放熱板
(12)にて保護される。即ち支持放熱板(12)は放
熱作用とドライブIC(91を保護する収納パフケージ
としての作用を併せ持っている。The wire bonding portion with (7) is molded with a sealing material (16) such as silicone resin. This drive IC (9) and electrode patterns (4a), (4b)
, (7) The support heat dissipation plate (12), which is fixed and integrated through the oxidation-resistant layer (10) and the adhesive layer (11), has a substantially concave cutout in the part facing the drive IC (9). Notch (1
2a) is formed, the molded part made of the above-mentioned sealing material (16) is housed, and the drive IC (91, etc.) is protected by the support heat sink (12).In other words, the support heat sink (12) has a heat dissipation function. It also functions as a storage puff cage to protect the drive IC (91).
ここで支持放熱板(12)の材料としては、^I2O3
等のセラミックや、 Fe一層系合金、 Pe、^1等
の熱伝導性に優れた金属材料等が使用される。この支持
放熱板(12)の接着には接着作用の他、従来のグレー
ズ層としての作用も有し、適性な熱伝導性を持たせるた
めに接着面側には低融点ガラス層を形成することが望ま
しい。Here, the material of the support heat sink (12) is ^I2O3
Ceramics such as , Fe single-layer alloys, and metal materials with excellent thermal conductivity such as Pe and ^1 are used. In addition to adhesion, this support heat dissipation plate (12) has the function of a conventional glaze layer, and a low melting point glass layer is formed on the bonding surface side in order to provide appropriate thermal conductivity. is desirable.
このようにして基板(11と支持放熱板(12)に固着
した後、前述した如く基板(11の裏面(lb)の前部
側を、前端縁方向に低い傾斜状に研削して傾斜面、即ち
記録面(lbl)を形成する。この記録面(lbl)は
前述した如く所定の角度の傾斜面で、この傾斜角は5°
〜45°の範囲が好ましく、5゜以下は材料強度が弱く
、45°以上は厚すぎて良質の印字が得られない。この
記録面(lbx)の低位側に印字用発熱部(2^)が対
応し、高位側に予熱用発熱部(3^)が対応する。After the substrate (11) and the support heat sink (12) are fixed in this manner, the front side of the back surface (lb) of the substrate (11) is ground into a low slope in the direction of the front edge, as described above, to form an inclined surface. That is, a recording surface (lbl) is formed.As mentioned above, this recording surface (lbl) is an inclined surface with a predetermined angle, and this inclination angle is 5°.
A range of ~45° is preferable; if it is less than 5°, the material strength is weak, and if it is more than 45°, it is too thick and good quality printing cannot be obtained. The printing heating section (2^) corresponds to the lower side of the recording surface (lbx), and the preheating heating section (3^) corresponds to the higher side.
このように本実施例によれば基板(1)の裏面(1b)
側の傾斜記録面(lbl)に対応してその前半部側の比
較的肉薄の部面に印字用発熱部(静)を配し、後平部側
の比較的肉厚の部面に予熱用発熱部(3^)を配したこ
とにより印字用発熱部(2A)からの記録面(Ibx)
への熱伝導が良好となると共に、記録面(lbx)の肉
厚部面は予熱用発熱部(3^)により予め加熱しておく
ことができるので記録面(lbr)は印字用発熱部(2
^)に対して傾斜状に対応していても温度むらが生じる
ことなくほぼ均一に加熱されることになり、印字用発熱
部(2八)の発熱温度を高くすることなく感熱紙上の印
字ドツトに一定の発色濃度を得ることができ、人力電力
の効率も向上される。In this way, according to this embodiment, the back surface (1b) of the substrate (1)
A heat generating part for printing (static) is arranged on a relatively thin part on the front half side corresponding to the inclined recording surface (lbl) on the side, and a heat generating part for preheating is arranged on a relatively thick part on the rear flat part side. By arranging the heat generating part (3^), the recording surface (Ibx) from the heat generating part for printing (2A)
In addition to improving heat conduction to the recording surface (lbx), the thick part of the recording surface (lbx) can be preheated by the preheating heating section (3^), so the recording surface (lbr) can be heated by the heating section for printing (3^). 2
^) Even if it corresponds to the thermal paper in an inclined manner, the temperature will be almost uniformly heated without any unevenness, and the printed dots on the thermal paper will be heated without increasing the heat generation temperature of the printing heat generating part (28). It is possible to obtain a constant color density, and the efficiency of human power is also improved.
また、基板(1)は記録面(lbt )が傾斜状に肉薄
になっていても他の部面、即ち駆動回路部の形成部面は
所定の肉厚に保持されるのでこの部面に実装されるドラ
イブIC(91は十分保護されることになる。In addition, even if the recording surface (lbt) of the substrate (1) is tapered and thinned, the other surfaces, that is, the surface where the drive circuit section is formed, are maintained at a predetermined thickness, so the mounting is carried out on this surface. The drive IC (91) that will be used will be fully protected.
以上、本発明の一実施例について説明したが、本発明は
この実施例に限定されることなく、本発明の趣旨を逸脱
しない範囲で種々の構造が取り得ることは云うまでもな
い。Although one embodiment of the present invention has been described above, it goes without saying that the present invention is not limited to this embodiment, and that various structures can be adopted without departing from the spirit of the present invention.
例えば予熱用発熱パターン(3)は横方向に連続した帯
状に形成することなく、印字用発熱パターン(2)と対
応して形成してもよく、また各電極パターンも図示の態
様に限るものではなく前述した如く、印字用発熱部、予
熱用発熱部を所要の状態に発熱させる態様であればよい
。For example, the heating pattern for preheating (3) may not be formed in a horizontally continuous band shape, but may be formed corresponding to the heating pattern for printing (2), and each electrode pattern is not limited to the embodiment shown in the drawings. As described above, any configuration may be used as long as the heating section for printing and the heating section for preheating generate heat to a desired state.
以上の説明から明らかなように本発明のサーマルヘッド
は基板の印字用発熱部が配設される傾斜状記録面部に予
熱用発熱部を形成して記録面部、特に傾斜高位部の肉厚
部を予め加熱するようにしたことにより、印字用発熱部
の発熱時において、p!4斜状記録面は温度むらがほと
んど生じることなく所要温度にほぼ均一に加熱され、感
熱紙上の印字ドツトに一定の鮮明な発色濃度を得ること
ができて印字品質が向上される。As is clear from the above description, the thermal head of the present invention forms a heating part for preheating on the inclined recording surface part on which the heating part for printing of the substrate is disposed, and heats up the recording surface part, especially the thick part of the inclined high part. By preheating, when the printing heat generating section generates heat, p! 4. The diagonal recording surface is heated almost uniformly to the required temperature with almost no temperature unevenness, and a constant clear color density can be obtained in the printed dots on the thermal paper, improving printing quality.
また、一定の発色濃度を得るための印字用発熱部の発熱
温度を低くできるので入力電力の効率が向上すると共に
発熱部の劣化を抑えることができてヘッドの長寿命化が
図れる。In addition, since the heat generation temperature of the heat generating part for printing to obtain a constant color density can be lowered, the efficiency of input power is improved, and deterioration of the heat generating part can be suppressed, so that the life of the head can be extended.
以上から本発明によれば各種感熱プリンタの小型で高信
頼性のサーマルヘッドを安価に提供できる。As described above, according to the present invention, a compact and highly reliable thermal head for various thermal printers can be provided at low cost.
第1図は本発明を適用したサーマルヘッドの一例を示す
概略的な断面図、第2図は同サーマルヘッドの基板部を
内面側から見た平面図、第3図は従来のサーマルヘッド
を模式的に示す側面図である。
図中(1)は基板、(lbx)は記録面としての傾斜面
、(2)は印字用発熱部抗パターン、(2A)は印字用
発熱部、(3)は予熱用発熱抵抗パターン、(3^)は
予熱用発熱部、(4a) 、 (4b) 、 (5
a> 、 (5b) 。
(7)は電極パターン、(9)は駆動回路部としてのド
ライブIC1(10)は耐酸化層、(12)は支持放熱
板である。Fig. 1 is a schematic cross-sectional view showing an example of a thermal head to which the present invention is applied, Fig. 2 is a plan view of the substrate portion of the thermal head viewed from the inner side, and Fig. 3 is a schematic diagram of a conventional thermal head. FIG. In the figure, (1) is the substrate, (lbx) is the inclined surface as the recording surface, (2) is the heating part resistance pattern for printing, (2A) is the heating part for printing, (3) is the heating resistor pattern for preheating, ( 3^) is the preheating heat generating part, (4a), (4b), (5
a>, (5b). (7) is an electrode pattern, (9) is a drive IC1 as a drive circuit section (10) is an oxidation-resistant layer, and (12) is a support heat sink.
Claims (1)
成され、該発熱抵抗部を選択的に発熱させて感熱記録を
行うサーマルヘッドにおいて、上記基板の発熱抵抗部側
に支持放熱板が接合されると共に、 上記基板の裏面側は上記発熱抵抗部と対応する部面が一
端縁方向に低く傾斜する傾斜面に形成され、 該傾斜面を、感熱記録を行う記録面と成し、上記基板の
上記記録面に対応して上記発熱抵抗部と別に予熱用発熱
抵抗部を形成したことを特徴とするサーマルヘッド。[Scope of Claims] A thermal head in which a plurality of heat-generating resistors and a drive circuit are formed on a wear-resistant substrate, and performs thermal recording by selectively generating heat in the heat-generating resistors, wherein the heat-generating resistor of the substrate A support heat dissipation plate is bonded to the side, and the back side of the substrate has a portion corresponding to the heating resistor portion formed into an inclined surface that slopes low toward the edge, and the inclined surface is used for recording thermal recording. 1. A thermal head comprising: a heating resistor for preheating; and a heating resistor for preheating is formed separately from the heating resistor in correspondence with the recording surface of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1193587A JPS63179763A (en) | 1987-01-21 | 1987-01-21 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1193587A JPS63179763A (en) | 1987-01-21 | 1987-01-21 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63179763A true JPS63179763A (en) | 1988-07-23 |
Family
ID=11791520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1193587A Pending JPS63179763A (en) | 1987-01-21 | 1987-01-21 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63179763A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005070683A1 (en) * | 2004-01-26 | 2005-08-04 | Rohm Co., Ltd. | Thermal print head |
JP2010208159A (en) * | 2009-03-10 | 2010-09-24 | Hideo Taniguchi | Heating head and heating method using the same |
-
1987
- 1987-01-21 JP JP1193587A patent/JPS63179763A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005070683A1 (en) * | 2004-01-26 | 2005-08-04 | Rohm Co., Ltd. | Thermal print head |
US7352381B2 (en) | 2004-01-26 | 2008-04-01 | Rohm Co., Ltd. | Thermal print head |
JP2010208159A (en) * | 2009-03-10 | 2010-09-24 | Hideo Taniguchi | Heating head and heating method using the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6018288B2 (en) | Thermal head and thermal printer | |
US7616223B2 (en) | Thermal printhead | |
US20050219349A1 (en) | Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same | |
KR960012768B1 (en) | Thermal head | |
JP2009226868A (en) | Thermal printing head | |
JP2828358B2 (en) | Semiconductor heat dissipation structure | |
JPS63179763A (en) | Thermal head | |
JPS63222866A (en) | Thermal head | |
JPS63182160A (en) | Thermal head | |
JPH1148513A (en) | Thermal print head | |
JP3126874B2 (en) | Thermal print head | |
JP2547878B2 (en) | Method of manufacturing thermal head | |
JPH02286261A (en) | Thermal head | |
JPS61280953A (en) | Thermal printing head | |
JPS6371364A (en) | Thermal head | |
JPS62244660A (en) | Thermal head | |
JP2003246089A (en) | Thermal head | |
JPS6248571A (en) | Thermal printing head | |
JPH0829595B2 (en) | Thermal head | |
JPS63178058A (en) | Thermal head | |
JP4283506B2 (en) | Thermal head | |
JPH02231153A (en) | Thermal head | |
JP2602608Y2 (en) | Thermal head | |
JPH106542A (en) | Thermal printing head | |
JPH06293149A (en) | Printed circuit board for thermal printing |