JPS6317908A - Composition curable by ultraviolet ray or electron ray - Google Patents

Composition curable by ultraviolet ray or electron ray

Info

Publication number
JPS6317908A
JPS6317908A JP16177986A JP16177986A JPS6317908A JP S6317908 A JPS6317908 A JP S6317908A JP 16177986 A JP16177986 A JP 16177986A JP 16177986 A JP16177986 A JP 16177986A JP S6317908 A JPS6317908 A JP S6317908A
Authority
JP
Japan
Prior art keywords
composition
film
cured
meth
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16177986A
Other languages
Japanese (ja)
Inventor
Kiyoshi Murase
村瀬 清
Tetsuji Jitsumatsu
実松 徹司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Original Assignee
Toagosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd filed Critical Toagosei Co Ltd
Priority to JP16177986A priority Critical patent/JPS6317908A/en
Publication of JPS6317908A publication Critical patent/JPS6317908A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/0275Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with dithiol or polysulfide compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

PURPOSE:To provide a composition composed of a specific (meth)acrylic acid ester, a monothiol compound, etc., curable by irradiation of ultraviolet ray or electron ray and giving a cured film soluble in an alkaline aqueous solution without causing the peeling of the film. CONSTITUTION:The objective composition is composed of (A) 80-99.9(wt)% (meth)acrylic acid ester having >=1 carboxyl group and one (meth)acryloyl group in one molecule (e.g. acrylic acid ester oligomer having terminal carboxyl group), (B) 0.1-5% monothiol compound (e.g. octyl mercaptan) and (C) 0-20% compound having one polymerizable double bond in one molecule or its (co)polymer (e.g. N-vinylpyrrolidone, polymethyl methacrylate, etc.). USE:Useful for etching resist ink and film-removing type corrosion-resistant paint, etc.

Description

【発明の詳細な説明】 (イ)発明の目的 〈産業上の利用分野〉 本発明は、紫外線(以下UVと称す)又は電子線(以下
EBと称す)硬化型の組成物であって、各種の産業分野
において、たとえば印刷回路等の作成時に使用するエツ
チングレジストインキ、或は鉄等の金属の防錆を目的と
した塗料で、塗膜を剥離した後に金属の加工を行なう脱
膜型防錆塗料等として有用であり、硬化したレジスト膜
及び塗膜等の硬化物が水酸化ナトリウム等のアルカリ水
溶液に溶解し必要に応じて除去できる組成物を提供する
ものである。
Detailed Description of the Invention (a) Purpose of the Invention <Industrial Application Field> The present invention is an ultraviolet (hereinafter referred to as UV) or electron beam (hereinafter referred to as EB) curable composition, which In the industrial field, for example, etching resist ink used when creating printed circuits, etc., or paint intended for rust prevention of metals such as iron, film-removal type rust prevention that processes the metal after peeling off the coating. The present invention provides a composition that is useful as a coating material and the like, and the cured products such as a cured resist film and a coating film can be dissolved in an alkaline aqueous solution such as sodium hydroxide and removed as necessary.

〈従来技術〉 従来より使用されている工、チングレジストインキ、脱
膜型防錆塗料等を硬化手段により分類すると、 1)スチレン・マレイン酸共重合樹脂、ロジン変性マレ
イン酸樹脂の様なアルカリ可溶な樹脂を主成分とする溶
剤含有組成物で、加熱硬化型のもの 2)カルボキシル基を有する単官能(メタ)アクリル酸
エステルを主成分とした無溶剤型、組成物で、Uv又は
EB硬化型のもの の二種類に大別される。
〈Prior art〉 Conventionally used coatings, ching resist inks, film-removable anticorrosion paints, etc. can be classified according to the curing method. 2) A solvent-containing composition whose main component is a soluble resin, which is heat-curable.2) A solvent-free composition whose main component is a monofunctional (meth)acrylic acid ester having a carboxyl group, which is UV or EB-curable. It is roughly divided into two types.

UV又はEB硬化型インキは揮発性が極めて低く、UV
やEBの照射によって容易に硬化し、無公害な塗料やイ
ンキとして近年急速に使用量が増大している。硬化膜の
除去に関しては、上記1)の加熱硬化型の大部分が溶剤
溶解型であるのに対し、UV又はEB硬化型の大部分は
脱膜剥離型である。被膜が脱膜剥離型の場合、−皮剥離
した膜の基板への再付着による不良製品の発生等のため
、スクリーン等を設けて剥離膜を除去するといった手段
が講じられているが、スクリーンが閉塞する等の問題が
あるために、装置の完全自動化は困難である。
UV or EB curable ink has extremely low volatility and UV
It is easily cured by irradiation with EB or EB, and its usage has been rapidly increasing in recent years as a non-polluting paint or ink. Regarding the removal of the cured film, most of the heat curing type mentioned above in 1) are of the solvent dissolving type, whereas most of the UV or EB curing types are of the film removal type. If the film is of a peel-off type, - Since defective products occur due to the peeled film re-adhering to the substrate, measures are taken to remove the peel-off film by installing a screen, etc. Full automation of the device is difficult due to problems such as blockage.

被膜の溶解除去には、主として有機溶剤たとえば塩素系
有機溶剤と、アルカリ水溶液がよく使用されるが、有機
溶剤の場合は作業環境の悪化等の労働衛生上及び公害上
の問題があり、コストを考えてもアルカリ水溶液の方が
有利である。
Organic solvents, such as chlorinated organic solvents, and alkaline aqueous solutions are often used to dissolve and remove coatings, but organic solvents pose problems in terms of occupational health and pollution, such as deterioration of the working environment, and are expensive. Even if you think about it, an alkaline aqueous solution is more advantageous.

〈本発明が解決しようとする問題点〉 本発明は、UV又はEBによって硬化可能であり、しか
も水酸化ナトリウム等のアルカリ水溶液中で硬化膜が完
全溶解し、脱膜剥離することなく、硬化膜を除去するこ
とができる組成物を提供しようとするものである。
<Problems to be solved by the present invention> The present invention can be cured by UV or EB, and the cured film can be completely dissolved in an alkaline aqueous solution such as sodium hydroxide, and the cured film can be cured without peeling off. The aim is to provide a composition that can remove .

(ロ)発明の構成 〈問題を解決するための手段〉 本発明において発明者等は、分子中に1個以上のカルボ
キシル基を有し、かつ1個のアクリロイル基又はメタク
リロイル基〔以下これらを(メタ)アクリロイル基と称
す〕を有するアクリル酸又はメタクリル酸エステル〔以
下これらを(メタ)アクリル酸エステルと称す〕を主成
分とする組成物に着目し、UV又はEB照射による硬化
膜の除去手段を従来の脱膜剥離から完全溶解型に転換す
べく鋭意検討の結果、この組成物中の主成分たる重合性
化合物は、(メタ)アクリロイル基を1個しか有してい
ないにもかかわらず、わずかの架橋反応を伴うためか、
アルカリ水溶液への完全溶解性を発現させることは不可
能であったが、驚くことにこの組成物にモノチオール化
合物を0.1〜5重量%添加することにより、その硬化
膜がアルカリ水溶液完全溶解型となることを見出し、本
発明を完成するに至った。
(b) Structure of the invention <Means for solving the problem> In the present invention, the inventors have discovered that the molecule has one or more carboxyl groups, and one acryloyl group or methacryloyl group [hereinafter referred to as ( Focusing on compositions containing acrylic acid or methacrylic esters (hereinafter referred to as (meth)acrylic esters) as the main component, which have a meth)acryloyl group, we developed a method for removing the cured film by UV or EB irradiation. As a result of intensive studies in order to switch from the conventional film removal type to a completely dissolving type, the main component of this composition, the polymerizable compound, has only one (meth)acryloyl group, but only a small amount of Perhaps because it involves a cross-linking reaction,
Although it was impossible to achieve complete solubility in aqueous alkaline solutions, surprisingly, by adding 0.1 to 5% by weight of a monothiol compound to this composition, the cured film was completely soluble in aqueous alkaline solutions. They discovered that it can be used as a mold, and completed the present invention.

以下本発明組成物の各構成成分について説明する。Each component of the composition of the present invention will be explained below.

〈成分A〉 分子中に1個以上のカルボキシル基と1個の(メタ)ア
クリロイル基を有する(メタ)アクリル酸エステルは、
成分A、B及びCの合計重量(以下組成物重量という)
を基準にして、80〜999重量%であることを要し、
該成分としてはたとえば分子中に1個の酸無水物基を有
する化合物と、分子中に水酸基を有する(メタ)アクリ
ル酸エステルとの反応によって得られる化合物が挙げら
れる。分子中に1個の酸無水物基を有する化合物は、分
子中に1個以上のカルボキシル基を有していてもいなく
ても良く、無水フタル酸、テトラヒドロ無水フタル酸、
メチルテトラヒドロ無水フタル酸、ヘキサヒドロ無水フ
タル酸、無水エンドメチレンテトラヒドロフタル酸、無
水メチルエンドメチレンテトラヒドロ無水フタル酸、無
水クロレンド酸、無水トリメリット酸等が例として挙げ
られ、又分子中に水酸基を有する(メタ)アクリル酸エ
ステルとしては、2−ヒドロキエチルアクリレート、2
−ヒドロキシプロピルアクリレート、2−ヒドロキシエ
チルメタクリレート、2−ヒドロキシプロピルメタクリ
レート等が例として挙げられる。
<Component A> A (meth)acrylic acid ester having one or more carboxyl groups and one (meth)acryloyl group in the molecule,
Total weight of components A, B and C (hereinafter referred to as composition weight)
It must be 80 to 999% by weight based on
Examples of such components include compounds obtained by reacting a compound having one acid anhydride group in the molecule with a (meth)acrylic acid ester having a hydroxyl group in the molecule. Compounds having one acid anhydride group in the molecule may or may not have one or more carboxyl groups in the molecule, and include phthalic anhydride, tetrahydrophthalic anhydride,
Examples include methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, chlorendic anhydride, trimellitic anhydride, etc., and also have a hydroxyl group in the molecule ( As the meth)acrylic acid ester, 2-hydroxyethyl acrylate, 2
Examples include -hydroxypropyl acrylate, 2-hydroxyethyl methacrylate, and 2-hydroxypropyl methacrylate.

成分Aとして使用できる化合物はすでに市場において入
手可能であり、それらのいくつかを例示すると、アクリ
ル酸ダイマー〔ローム・アンド・ハース社製rQM−8
24J )や末端カルボキシル基含有アクリル酸エステ
ルオリゴマー〔東亜合成化学工業■製[アロエックス開
−5300]等がある。
Compounds that can be used as component A are already available on the market, and to illustrate some of them, acrylic acid dimer [rQM-8 manufactured by Rohm and Haas Co., Ltd.
24J) and an acrylic acid ester oligomer containing a terminal carboxyl group (manufactured by Toagosei Chemical Co., Ltd. [Aroex Kai-5300]).

本発明組成物における成分Aの濃度は80〜999重量
%であり、80重量%より低い濃度では、組成物中のカ
ルボキシル基濃度が低いために、得られる硬化物はアル
カリ水溶液に不溶性となるか、あるいは可溶性であって
も溶解に時間を要し、本発明の目的を達成できない。−
方濃度が999重量%より多くなると、成分Bの濃度が
不足する結果、硬化物のアルカリ水溶液可溶性が同様に
不充分となる。成分Aの望ましい濃度は90〜999重
量%である。
The concentration of component A in the composition of the present invention is 80 to 999% by weight, and if the concentration is lower than 80% by weight, the resulting cured product will be insoluble in an aqueous alkaline solution due to the low concentration of carboxyl groups in the composition. Or, even if it is soluble, it takes time to dissolve, and the object of the present invention cannot be achieved. −
If the concentration exceeds 999% by weight, the concentration of component B will be insufficient, resulting in similarly insufficient solubility of the cured product in aqueous alkali solution. The desired concentration of component A is 90-999% by weight.

〈成分B〉 硬化膜のアルカリ水溶液完全溶解整への改良は、モノチ
オール化合物の配合によって可能となる。
<Component B> Improvement in complete dissolution of the cured film in an alkaline aqueous solution is possible by blending a monothiol compound.

チオール、チオエーテル類は連鎖重合時の連鎖移動剤と
して使用されるが、これらは少量の添加により重合速度
はあまり低下させずに重合度を調節することができるた
め、分子量の調整剤として使用されている。
Thiols and thioethers are used as chain transfer agents during chain polymerization, and because they can adjust the degree of polymerization without significantly reducing the polymerization rate by adding them in small amounts, they are used as molecular weight regulators. There is.

上記の目的に関しては種々の化合物が有効であるが、成
分Aを主たる硬化性成分とする場合には、各種の連鎖移
動剤の中でも特にモノチオール化合物を添加することに
より、硬化物の分子量を、アルカリ水溶液には容易に溶
解するが、それ以外の薬液たとえばエツチング液には耐
性があるように調整することが可能となった。
Various compounds are effective for the above purpose, but when component A is used as the main curable component, the molecular weight of the cured product can be increased by adding a monothiol compound among various chain transfer agents. It has become possible to adjust the material so that it dissolves easily in alkaline aqueous solutions but is resistant to other chemical solutions, such as etching solutions.

成分Bとして適するモノチオール化合物としては、オク
チルメルカプタン、ノニルメルカプタン、デシルメルカ
プタン、ドデシルメルカプタン、セチルメルカプタン等
のメルカプタン類、モノチオエチレングリコール、モノ
チオプロピレングリコール、α−モノチオグリセリン等
の水酸基置換メルカプタン類、メルカプトプロピオン酸
、2−メルカプ、ドブ四ピオン酸、チオ乳酸、チオリン
ゴ酸等のメルカプトカルボン酸類がその例として挙げら
れ、その添加量は組成物重量基準で0.1〜5重量%と
する必要があり、より好ましい添加量は0.5〜3重量
%である。
Monothiol compounds suitable as component B include mercaptans such as octylmercaptan, nonylmercaptan, decylmercaptan, dodecylmercaptan, and cetylmercaptan, and hydroxyl-substituted mercaptans such as monothioethylene glycol, monothiopropylene glycol, and α-monothioglycerin. Examples include mercaptocarboxylic acids such as , mercaptopropionic acid, 2-mercap, dobtetrapionic acid, thiolactic acid, and thiomalic acid, and the amount added should be 0.1 to 5% by weight based on the weight of the composition. The more preferable addition amount is 0.5 to 3% by weight.

成分Bの濃度が0.1重量%より少ないと、硬化物の分
子量が増大するため、アルカリ水溶液への溶解性が悪く
なる。また5重量%を超えると、硬化物の分子量が低く
なりすぎて、硬化物のエツチング耐性その他の物性が低
下し、実用性を欠いたものとなる。
When the concentration of component B is less than 0.1% by weight, the molecular weight of the cured product increases, resulting in poor solubility in aqueous alkaline solutions. If the amount exceeds 5% by weight, the molecular weight of the cured product becomes too low, resulting in poor etching resistance and other physical properties of the cured product, making it impractical.

〈成分C〉 成分Cは、反応性希釈剤として及び/又はアルカリ水溶
液に対する硬化物の溶解性向上を目的として、所望によ
り配合される成分である。
<Component C> Component C is a component that is optionally blended as a reactive diluent and/or for the purpose of improving the solubility of the cured product in an alkaline aqueous solution.

1分子中に重合可能な二重結合を1個有する化合物の例
としては、アルキル置換フェノールのアルキレンオキシ
ド付加物の(メタ)アクリル酸エステル(例えば東亜合
成化学工業■製の商品名アロエックスM−101,10
2,111,116,117等)、N−ビニルピロリド
ン、2−ヒドロキシ−6−フエツキシプロビルアクリレ
ート、マクロモノマー等が挙げられる。又、重合物及び
共重合物の例としては、塩化ビニル、(メタ)アクリル
酸エステル、スチレン、酢酸ビニル等のモノマーの単一
重合物又は共重合物が挙げられ、具体的にはポリメチル
メタクリレート、塩化ビニル−酢酸ビニル共重合物、ロ
ジン変性マレイン酸樹脂、スチレン−マレイン酸樹脂等
がある。
Examples of compounds having one polymerizable double bond in one molecule include (meth)acrylic acid esters of alkylene oxide adducts of alkyl-substituted phenols (for example, Aroex M-, a product of Toagosei Chemical Industry Co., Ltd.); 101,10
2,111,116,117, etc.), N-vinylpyrrolidone, 2-hydroxy-6-fethoxyprobyl acrylate, and macromonomers. Examples of polymers and copolymers include homopolymers and copolymers of monomers such as vinyl chloride, (meth)acrylic acid esters, styrene, and vinyl acetate; specifically, polymethyl methacrylate , vinyl chloride-vinyl acetate copolymer, rosin-modified maleic acid resin, styrene-maleic acid resin, and the like.

本発明の目的であるアルカリ水溶液中で容易に溶解する
組成物を提供するためには、成分Cの配合量を組成物重
量基準で20重量%以下とすべきであり、これより多い
と硬化物がアルカリ水溶液に不溶性となる他、成分Cが
重合物である場合には成分A、Bに混合溶解して組成物
を調製するのに長時間を要するといった不都合を伴う。
In order to provide a composition that easily dissolves in an alkaline aqueous solution, which is the object of the present invention, the amount of component C should be 20% by weight or less based on the weight of the composition; becomes insoluble in an aqueous alkali solution, and when component C is a polymer, it takes a long time to mix and dissolve in components A and B to prepare a composition.

成分Cの好ましい配合量は0.1〜5重量%、さらに好
ましくは0.5〜3重量%である。
The preferred amount of component C is 0.1 to 5% by weight, more preferably 0.5 to 3% by weight.

その他に、隠ぺい力の向上、増粘、増量、揺変性の付与
等を目的とする二酸化硅系、二酸化チタン、タルク等の
無機系充填剤、又隠ぺい力の向上や着色のための顔料等
の添加も可能である。
In addition, inorganic fillers such as silica, titanium dioxide, and talc are used to improve hiding power, increase viscosity, increase volume, and impart thixotropy, and pigments are used to improve hiding power and add color. Addition is also possible.

〈組成物の硬化〉 硬化手段がUVである場合には光開始剤が用いられる。<Curing of composition> A photoinitiator is used when the curing means is UV.

好適に用いられる光開始剤としては例エハヘンソイン、
ベンゾインエチルエーテル、ベンゾインイソプロピルエ
ーテル、ペンツインイソブチルエーテル、ペンゾインオ
クチルエーチルなどのごときベンゾイン化合物、ベンジ
ル、ジアセチル、メチルアントラキノン、アセトフェノ
ン、ベンゾフェノンなどのごときカルボニル化合物等が
挙げられる。光開始剤の使用量は本発明組成物に対して
0.01〜20重量%、好ましくは0.1〜10重量%
の範囲である。
Examples of photoinitiators that are preferably used include Ehahensoin,
Examples include benzoin compounds such as benzoin ethyl ether, benzoin isopropyl ether, penzoin isobutyl ether, penzoin octyl ether, and carbonyl compounds such as benzyl, diacetyl, methylanthraquinone, acetophenone, and benzophenone. The amount of photoinitiator used is 0.01 to 20% by weight, preferably 0.1 to 10% by weight based on the composition of the present invention.
is within the range of

硬化手段がEBの場合には開始剤を用いな(とも速やか
に硬化するので、特に硬化剤を用いる必要はない。
When the curing means is EB, there is no need to use an initiator (because it cures quickly, there is no need to use a curing agent).

これらUV及びEBの照射条件は、(メタ)アクリロイ
ル基を有する化合物を重合性成分とする組成物の硬化に
際して常用されている条件に従えば良い。
These UV and EB irradiation conditions may be in accordance with the conditions commonly used for curing a composition containing a compound having a (meth)acryloyl group as a polymerizable component.

本発明組成物から得られる硬化物は、例えば60〜90
℃に保持された濃度5〜10重量%の水酸化ナトリウム
、水酸化カリウム等のアルカリ水溶液中に、攪拌下に浸
漬することにより、容易に溶解する。基材上に形成され
た硬化塗膜をこの条件で処理すれば、塗膜は基材から剥
離することなく、表面から順次溶解して行き、1分取内
の短時間で溶出し除去される。
The cured product obtained from the composition of the present invention has, for example, 60 to 90
It is easily dissolved by immersion in an aqueous alkaline solution of sodium hydroxide, potassium hydroxide, etc. with a concentration of 5 to 10% by weight maintained at .degree. C. with stirring. If a cured coating film formed on a substrate is treated under these conditions, the coating film will not peel off from the substrate, but will gradually dissolve from the surface, and will be eluted and removed in a short time within one fraction. .

〈実施例、参考例及び比較例〉 以下に実施例、参考例及び比較例を示して、本発明を更
に具体的に説明する。
<Examples, Reference Examples, and Comparative Examples> The present invention will be explained in more detail by showing Examples, Reference Examples, and Comparative Examples below.

(参考例1) 攪拌機、温度計、空気吹込管、冷却器を備えた反応器に
無水フタル酸148?、2−ヒドロキシエチルアクリレ
ート1221、トリエチルアミン4.0?、ヒドロキノ
ンモノメチルエーテル0.135Pを加工、空気を50
−7分の割合で吹込みつつ攪拌しながら90℃で4時間
加熱して、フタル酸モノアクリロイルオキシエチルエス
テル265?を得た。その粘度は25℃で4500セン
チポイズ酸価は205〜KOH/Pであった。
(Reference Example 1) Phthalic anhydride 148? , 2-hydroxyethyl acrylate 1221, triethylamine 4.0? , process hydroquinone monomethyl ether 0.135P, air 50
-Heating at 90°C for 4 hours while stirring and blowing at a rate of -7 minutes, phthalic acid monoacryloyloxyethyl ester 265? I got it. Its viscosity was 4500 centipoise at 25°C and its acid value was 205-KOH/P.

(参考例2) テトラヒドロ無水フタル酸152?、2−ヒドロキシエ
チルアクリレート122F、)リエチルアミン4.0?
、ヒドロキノンモノメチルエーテル0.135 Fを用
いた以外は参考例1と同様にして、テトラヒドロフタル
酸モノアクリロイルオキシエチルエステル269Fを得
た。その粘度は25℃において13000センチポイズ
、酸価は199NgKOH/P であった。
(Reference Example 2) Tetrahydrophthalic anhydride 152? , 2-hydroxyethyl acrylate 122F,) ethylamine 4.0?
Tetrahydrophthalic acid monoacryloyloxyethyl ester 269F was obtained in the same manner as in Reference Example 1 except that 0.135 F of hydroquinone monomethyl ether was used. Its viscosity was 13,000 centipoise at 25°C, and its acid value was 199 NgKOH/P.

(参考例3) 無水フタル酸148F、2−ヒドロキシエチルメタクリ
レート167?、トリエチルアミン4.3p、ヒドロキ
ノンモノメチルエーテル0.140pを使用した以外は
参考例1と同様にして、フタル酸モノメタクリロイルオ
キシエチルエステル281?を得た。その粘度は25℃
において4200センチボイズ、酸価は1961vKO
H/Pであった。
(Reference Example 3) Phthalic anhydride 148F, 2-hydroxyethyl methacrylate 167? , triethylamine 4.3p, and hydroquinone monomethyl ether 0.140p were used in the same manner as in Reference Example 1 to prepare phthalic acid monomethacryloyloxyethyl ester 281? I got it. Its viscosity is 25℃
4200 centiboise, acid value 1961vKO
It was H/P.

(実施例1) 参考例1のエステル100部(重量部、以下同じ)に対
し、メルカプトプロピオン酸1部、光開始剤としてイル
ガキュアー651(チバガイキー社製)5部を溶解し、
レジストインキ組成物を得た。この組成物をガラスエポ
キシ鋼張積層板(プリント配線基板)テストパネル上に
約70ミクロンの厚さで塗布し、紫外線を照射した。紫
外線照射装置としてはランプ下10偉を10m/分で走
行しているコンベア上に集光している、オゾンタイプの
単位アーク長当りの入力80W/cxiの高圧水銀灯(
ウシオ電機■製)を使用した。組成物は前記装置に2回
通すことによって完全に硬化した。次にテストパネルを
攪拌下で50℃に保ったエツチング浴に5分浸漬し、未
塗装部分の銅を溶解し水洗した。この時硬化塗膜にはが
れ、ふくれ等の異常は認められなかった。更にテストパ
ネルを攪拌下で80℃に保った5%(重量%、以下同じ
)水酸化ナトリウム水溶液の浴に浸漬したところ、直ち
に硬化塗膜表面から膜が剥離することなく溶解し、60
秒後には硬化塗膜は水酸化す) IJウム水溶液に完全
に溶解した。この組成物はアルカリ完全溶解型であるこ
とを確認した。
(Example 1) 1 part of mercaptopropionic acid and 5 parts of Irgacure 651 (manufactured by Ciba Gaiki Co., Ltd.) as a photoinitiator were dissolved in 100 parts (parts by weight, same hereinafter) of the ester of Reference Example 1,
A resist ink composition was obtained. This composition was applied to a thickness of about 70 microns on a glass epoxy steel clad laminate (printed wiring board) test panel and irradiated with ultraviolet light. The ultraviolet irradiation device was an ozone-type high-pressure mercury lamp with an input of 80 W/cxi per unit arc length, concentrating the light on a conveyor running 10 m/min below the lamp.
(manufactured by Ushio Inc.) was used. The composition was fully cured by passing it through the device twice. Next, the test panel was immersed in an etching bath maintained at 50° C. for 5 minutes under stirring to dissolve the copper in the unpainted area and washed with water. At this time, no abnormalities such as peeling or blistering were observed in the cured coating film. Furthermore, when the test panel was immersed in a bath of a 5% (wt%) sodium hydroxide aqueous solution kept at 80°C with stirring, the film immediately dissolved without peeling from the cured coating surface, and the 60°C
After a few seconds, the cured coating film was completely dissolved in the IJum aqueous solution. It was confirmed that this composition was completely alkali-soluble.

(実施例2) メルカプトプロピオン酸を0.5部とした以外は実施例
1と同様に行なった。組成物は紫外線照射装置に6回通
すことによって、完全に硬化した。同様にエツチング後
80℃の5%水酸化ナトリウム水溶液中に浸漬したとこ
ろ硬化塗膜は膜として剥離することなく50秒後には完
全に溶解した。
(Example 2) The same procedure as in Example 1 was carried out except that mercaptopropionic acid was changed to 0.5 part. The composition was completely cured by passing it through the UV irradiator six times. Similarly, after etching, when immersed in a 5% aqueous sodium hydroxide solution at 80°C, the cured coating did not peel off as a film and completely dissolved after 50 seconds.

(実施例3) 参考例1のエステル90部及び反応性希釈剤としてアロ
エ、クス(東亜合成化学工業■製画品名)M−1021
0部を使用した以外は実施例1と同様に、組成物の調製
を行なった。組成物は紫外線照射装置を4回通すことに
よって完全に硬化した。同様にエツチング後80℃の5
チ水酸化ナトリウム水溶液中に浸漬したところ、硬化塗
膜は膜として剥離することな(,50秒後には完全に溶
解した。
(Example 3) 90 parts of the ester of Reference Example 1 and aloe and camphorus (Toagosei Chemical Industry ■Product name) M-1021 as a reactive diluent
A composition was prepared in the same manner as in Example 1 except that 0 part was used. The composition was completely cured by passing it through the UV irradiator four times. 5 at 80℃ after etching in the same way.
When immersed in a sodium hydroxide aqueous solution, the cured coating did not peel off as a film (it was completely dissolved after 50 seconds).

(実施例4) メルカプト酢酸を1部用いた以外は実施例1と同様に、
組成物の調製を行なった。組成物は紫外線照射装置に2
回通すことによって完全に硬化した。同様にエツチング
後80℃の5%水酸化ナトリウム水溶液中に浸漬したと
ころ、硬化膜は膜として剥離することなく35秒後には
完全に溶解した。
(Example 4) Same as Example 1 except that 1 part of mercaptoacetic acid was used.
A composition was prepared. The composition was placed in an ultraviolet irradiation device for 2
It was completely cured by passing it through. Similarly, when the film was immersed in a 5% aqueous sodium hydroxide solution at 80° C. after etching, the cured film did not peel off as a film and completely dissolved after 35 seconds.

(実施例5) 参考例2のエステル100部を使用した以外は実施例1
と同様に組成物を調製した。組成物は紫外線照射装置に
2回通すことによって完全に硬化した。同様にエツチン
グ後80℃の5%水酸化ナトリウム水溶液中に浸漬した
ところ、硬化膜は膜として剥離することなく、40秒後
には完全に溶解した。
(Example 5) Example 1 except that 100 parts of the ester of Reference Example 2 was used.
A composition was prepared in the same manner. The composition was fully cured by passing it through the UV irradiator twice. Similarly, when the film was immersed in a 5% aqueous sodium hydroxide solution at 80° C. after etching, the cured film did not peel off as a film and completely dissolved after 40 seconds.

(比較例1) メルカプトプロピオン酸を使用しない点を除いて、実施
例1と同様に組成物を調製した。組成物は紫外線照射装
置を3回通すことによって完全に硬化した。同様にエツ
チング後、80℃の5チ水酸化ナトリウム水溶液中に浸
漬したところ直ちに硬化膜が膨潤し50秒後には基板か
ら膜が脱離した。
(Comparative Example 1) A composition was prepared in the same manner as in Example 1, except that mercaptopropionic acid was not used. The composition was completely cured by passing it through the UV irradiator three times. Similarly, after etching, the cured film swelled immediately when it was immersed in an aqueous solution of sodium hydroxide at 80°C, and the film detached from the substrate after 50 seconds.

(ハ)発明の効果 本発明の組成物はUV又はEBの照射によって容易に硬
化し、硬化膜は、アルカリ水溶液中で膜が剥離すること
なく実質的に完全に溶解するものであり、印刷回路作成
時等に使用する紫外線又は電子線硬化型のエツチングレ
ジストインキ及び金属の防錆を目的とした脱模型防錆塗
料等として常用されるものである。
(c) Effects of the Invention The composition of the present invention is easily cured by UV or EB irradiation, and the cured film is substantially completely dissolved in an alkaline aqueous solution without peeling, and is suitable for printed circuits. It is commonly used as ultraviolet or electron beam curing type etching resist ink used during production, etc., and as a de-modeling rust-preventing paint for the purpose of preventing rust on metal.

Claims (1)

【特許請求の範囲】 1、下記成分A、B及びCからなることを特徴とする、
紫外線又は電子線の照射により硬化し、アルカリ水溶液
に可溶性の硬化物を形成する組成物。 A:1分子中に1個以上のカルボキシル基と1個のアク
リロイル基又はメタクリロイル基 を有するアクリル酸又はメタクリル酸エス テル80〜99.9重量%。 B:モノチオール化合物0.1〜5重量%。 C:1分子中に重合可能な二重結合を1個有する化合物
、その重合物及び共重合物から選 ばれる1種以上の成分0〜20重量%。
[Claims] 1. Characterized by consisting of the following components A, B and C,
A composition that is cured by irradiation with ultraviolet rays or electron beams to form a cured product that is soluble in aqueous alkaline solutions. A: 80 to 99.9% by weight of acrylic or methacrylic ester having one or more carboxyl group and one acryloyl or methacryloyl group in one molecule. B: Monothiol compound 0.1 to 5% by weight. C: 0 to 20% by weight of one or more components selected from compounds having one polymerizable double bond in one molecule, polymers and copolymers thereof.
JP16177986A 1986-07-11 1986-07-11 Composition curable by ultraviolet ray or electron ray Pending JPS6317908A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16177986A JPS6317908A (en) 1986-07-11 1986-07-11 Composition curable by ultraviolet ray or electron ray

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16177986A JPS6317908A (en) 1986-07-11 1986-07-11 Composition curable by ultraviolet ray or electron ray

Publications (1)

Publication Number Publication Date
JPS6317908A true JPS6317908A (en) 1988-01-25

Family

ID=15741745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16177986A Pending JPS6317908A (en) 1986-07-11 1986-07-11 Composition curable by ultraviolet ray or electron ray

Country Status (1)

Country Link
JP (1) JPS6317908A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5336574A (en) * 1991-10-04 1994-08-09 Toagosei Chemical Industry Co., Ltd. Curable composition and process for producing shadow mask using the same
EP0660762A1 (en) * 1992-09-17 1995-07-05 Deluxe Corporation Oil based composition clean up method and composition for use therein
US5710234A (en) * 1993-07-20 1998-01-20 Nippon Steel Chemical Co., Ltd. Ortho spiroesters and curable and cured resin compositions of same
US5712022A (en) * 1992-09-14 1998-01-27 Yoshino Kogyosho Co., Ltd. Printed thermoplastic resin products and method for printing such products

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785050A (en) * 1980-11-18 1982-05-27 Mitsui Toatsu Chem Inc Pattern forming composition
JPS59142258A (en) * 1983-02-04 1984-08-15 Sony Corp Photo-curable paint composition
JPS60123515A (en) * 1983-12-09 1985-07-02 Mitsui Petrochem Ind Ltd Pretreating agent composition
JPS60166307A (en) * 1984-02-08 1985-08-29 Agency Of Ind Science & Technol Plastic material for optical use

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5785050A (en) * 1980-11-18 1982-05-27 Mitsui Toatsu Chem Inc Pattern forming composition
JPS59142258A (en) * 1983-02-04 1984-08-15 Sony Corp Photo-curable paint composition
JPS60123515A (en) * 1983-12-09 1985-07-02 Mitsui Petrochem Ind Ltd Pretreating agent composition
JPS60166307A (en) * 1984-02-08 1985-08-29 Agency Of Ind Science & Technol Plastic material for optical use

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5336574A (en) * 1991-10-04 1994-08-09 Toagosei Chemical Industry Co., Ltd. Curable composition and process for producing shadow mask using the same
US5712022A (en) * 1992-09-14 1998-01-27 Yoshino Kogyosho Co., Ltd. Printed thermoplastic resin products and method for printing such products
EP0660762A1 (en) * 1992-09-17 1995-07-05 Deluxe Corporation Oil based composition clean up method and composition for use therein
EP0677090A1 (en) * 1992-09-17 1995-10-18 Deluxe Corporation Ink composition and method of making, using and recovering such composition
EP0660762A4 (en) * 1992-09-17 1996-12-27 Deluxe Corp Oil based composition clean up method and composition for use therein.
EP0677090A4 (en) * 1992-09-17 1996-12-27 Deluxe Corp Ink composition and method of making, using and recovering such composition.
US5710234A (en) * 1993-07-20 1998-01-20 Nippon Steel Chemical Co., Ltd. Ortho spiroesters and curable and cured resin compositions of same

Similar Documents

Publication Publication Date Title
JP2007128052A (en) Ultraviolet-curing resist composition for glass etching and glass etching processing method
JPH0772624A (en) Photosensitive resin composition as well as film, resist ink, resist, solder resist and printed circuit board formed by using the same
JP2868190B2 (en) Resin composition, solder resist resin composition and cured product thereof
JPH0297513A (en) Unsaturated polycarboxylic acid resin, resin composition and solder resist resin composition containing same
JP2878486B2 (en) Resin composition, solder resist resin composition and cured product thereof
JPS6115081B2 (en)
JPS6317908A (en) Composition curable by ultraviolet ray or electron ray
JP2017181893A (en) Photosensitive composition for etching protection and metal processing sheet
JPH03250012A (en) Solder resist ink composition and cured product thereof
JPS59170165A (en) Ultraviolet curing composition
JPH01203424A (en) Curable composition
JP3654100B2 (en) Active energy ray-curable aqueous emulsion
JP2963069B2 (en) Solder photoresist ink composition
JPS6279243A (en) Active energy beam curable composition
US5336574A (en) Curable composition and process for producing shadow mask using the same
JPH09278849A (en) Resin composition, resist ink resin composition and cured product thereof
JP3403511B2 (en) Manufacturing method of resist pattern and etching pattern
JPS61201237A (en) Photosensitive resin composition
JPH02153902A (en) Curable composition
JP2003221420A (en) Active radiation-curing composition and cured film
JPS5819704B2 (en) Active energy beam-curable temporary rust-preventive coating composition that can be removed with alkali
JPH05178950A (en) Resin composition, solder resist resin composition and cured products thereof
JPH04270345A (en) Resin composition and solder resist resin composition and their hardened product
JP3436788B2 (en) Resin composition, resist ink composition and cured product thereof
JPH04165358A (en) Polycarboxylic acid resin including unsaturated group, resin compound including same, solder-resisting resin compound and set material of these